Wedge and ball bonds

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H01L2224/49429

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/49429Wedge and ball bonds

Industries

Patents Grantslast 30 patents

Information Patent Grant
Decoupling capacitor mounted on an integrated circuit die, and meth...
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- Issue date Jan 24, 2023
- Intel Corporation
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Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
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- Issue date May 24, 2022
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- Ji Young Chung
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Information Patent Grant
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- Issue date Nov 20, 2018
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- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with bond pad wiring lead-out arrangement avoi...
- Patent number 9,646,901
- Issue date May 9, 2017
- Renesas Electronics Corporation
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Information Patent Grant
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- Issue date Apr 25, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Masumi Abe
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Information Patent Grant
Electronic component device
- Patent number 9,502,456
- Issue date Nov 22, 2016
- Hamamatsu Photonics K.K.
- Shin-ichiro Takagi
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Information Patent Grant
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- Issue date Jul 19, 2016
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- Issue date Mar 8, 2016
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Information Patent Grant
Semiconductor device including alternating stepped semiconductor di...
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- Issue date Jan 5, 2016
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Shiv Kumar
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Information Patent Grant
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- Issue date Nov 3, 2015
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Information Patent Grant
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- Issue date Oct 20, 2015
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- G01 - MEASURING TESTING
Information Patent Grant
Through wire interconnect (TWI) for semiconductor components having...
- Patent number 9,013,044
- Issue date Apr 21, 2015
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Information Patent Grant
Semiconductor device
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- Issue date Dec 16, 2014
- Renesas Electronics Corporations
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly with joined bond elements having lowered i...
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Information Patent Grant
Method of manufacturing semiconductor device
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Information Patent Grant
Semiconductor device and method of manufacturing the semiconductor...
- Patent number 8,759,987
- Issue date Jun 24, 2014
- Nichia Corporation
- Ryota Seno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
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- Issue date Dec 10, 2013
- Rohm Co., Ltd.
- Hideki Hiromoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a manufacturing method of the same
- Patent number 8,530,278
- Issue date Sep 10, 2013
- Renesas Electronics Corporation
- Nobuyasu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor component having through wire interconnect (T...
- Patent number 8,513,797
- Issue date Aug 20, 2013
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
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- Issue date Jul 9, 2013
- Marvell International Ltd.
- Shiann-Ming Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the semiconductor...
- Patent number 8,476,726
- Issue date Jul 2, 2013
- Nichia Corporation
- Satoshi Shirahama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 8,415,199
- Issue date Apr 9, 2013
- Renesas Electronics Corporation
- Toshihiko Akiba
- G01 - MEASURING TESTING
Information Patent Grant
Microelectronic assembly with joined bond elements having lowered i...
- Patent number 8,410,618
- Issue date Apr 2, 2013
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,283,210
- Issue date Oct 9, 2012
- Renesas Electronics Corporation
- Nobuyasu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for manufacturing semiconductor device...
- Patent number 8,237,295
- Issue date Aug 7, 2012
- Kabushiki Kaisha Toshiba
- Yuichi Sano
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor component having through wire interconnect (TWI) with...
- Patent number 8,193,646
- Issue date Jun 5, 2012
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 8,132,709
- Issue date Mar 13, 2012
- Nichia Corporation
- Tadao Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method for the same
- Patent number 8,134,240
- Issue date Mar 13, 2012
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount device
- Patent number 8,115,106
- Issue date Feb 14, 2012
- Stanley Electric Co., Ltd.
- Minoru Tanaka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220246542
- Publication date Aug 4, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Young CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190348332
- Publication date Nov 14, 2019
- RENESAS ELECTRONICS CORPORATION
- Toshihiko AKIBA
- G01 - MEASURING TESTING
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20190057913
- Publication date Feb 21, 2019
- RENESAS ELECTRONICS CORPORATION
- Toshihiko AKIBA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140361299
- Publication date Dec 11, 2014
- Toshihiko Akiba
- G01 - MEASURING TESTING
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...
- Publication number 20140124565
- Publication date May 8, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140127860
- Publication date May 8, 2014
- RENESAS ELECTRONICS CORPORATION
- Nobuyasu MUTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20140021608
- Publication date Jan 23, 2014
- Samsunung Electronics., Ltd.
- KEUN-HO CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through Wire Interconnect (TWI) For Semiconductor Components Having...
- Publication number 20130299983
- Publication date Nov 14, 2013
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...
- Publication number 20130292834
- Publication date Nov 7, 2013
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20130267050
- Publication date Oct 10, 2013
- Satoshi SHIRAHAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130193438
- Publication date Aug 1, 2013
- RENESAS ELECTRONICS CORPORATION
- Toshihiko Akiba
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF MANUFACTRUING SEMICONDUCTOR DEVICE
- Publication number 20130005086
- Publication date Jan 3, 2013
- Renesas Electronics Corporation
- Nobuyasu MUTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR COMPONENT HAVING THROUGH WIRE INTERCONNECT (T...
- Publication number 20120228781
- Publication date Sep 13, 2012
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20120193791
- Publication date Aug 2, 2012
- Ryota Seno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR JOINING BONDING WIRE, SEMICONDUCTOR DEVICE, AND METHOD F...
- Publication number 20120193784
- Publication date Aug 2, 2012
- Kabushiki Kaisha Toshiba
- Norihiro Togasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing Method of Semiconductor Device
- Publication number 20120077310
- Publication date Mar 29, 2012
- Renesas Electronics Corporation
- Toshihiko AKIBA
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20110309502
- Publication date Dec 22, 2011
- Kabushiki Kaisha Toshiba
- Yuichi SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...
- Publication number 20110285020
- Publication date Nov 24, 2011
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME
- Publication number 20110269268
- Publication date Nov 3, 2011
- Renesas Electronics Corporation
- NOBUYASU MUTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20110171777
- Publication date Jul 14, 2011
- Renesas Electronics Corporation
- Nobuyasu MUTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20110159644
- Publication date Jun 30, 2011
- Renesas Electronics Corporation
- Yoshihiko SHIMANUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...
- Publication number 20110147953
- Publication date Jun 23, 2011
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH BOND ELEMENTS HAVING LOWERED INDUCTANCE
- Publication number 20110147928
- Publication date Jun 23, 2011
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20100276802
- Publication date Nov 4, 2010
- Nichia Corporation.
- Satoshi SHIRAHAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Component Having Through Wire Interconnect (TWI) With...
- Publication number 20100264521
- Publication date Oct 21, 2010
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND WIRE BONDING METHOD
- Publication number 20100237480
- Publication date Sep 23, 2010
- SHINKAWA LTD.
- Tatsunari Mii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100187690
- Publication date Jul 29, 2010
- Kabushiki Kaisha Toshiba
- Kiyokazu OKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating package structure of stacked chips
- Publication number 20100035380
- Publication date Feb 11, 2010
- Kun Yuan Technology Co., Ltd.
- Chun-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Semiconductor Device Manufacturing Method
- Publication number 20100001413
- Publication date Jan 7, 2010
- Rohm Co., Ltd.
- Hideki Hiromoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20090321927
- Publication date Dec 31, 2009
- Fujitsu Microelectronics Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS

Wedge and ball bonds

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Decoupling capacitor mounted on an integrated circuit die, and meth...

Semiconductor device and method of manufacturing semiconductor device

Method of manufacturing semiconductor device

Manufacturing method of semiconductor device

Semiconductor device with bond pad wiring lead-out arrangement avoi...

Light-emitting module

Electronic component device

Method of manufacturing semiconductor device

Semiconductor device and method of manufacturing the semiconductor...

Semiconductor device including alternating stepped semiconductor di...

Method of manufacturing semiconductor device

Semiconductor device

Through wire interconnect (TWI) for semiconductor components having...

Semiconductor device

Microelectronic assembly with joined bond elements having lowered i...

Method of manufacturing semiconductor device

Semiconductor device and method of manufacturing the semiconductor...

Semiconductor device

Semiconductor device and a manufacturing method of the same

Stacked semiconductor component having through wire interconnect (T...

Semiconductor package

Semiconductor device and method of manufacturing the semiconductor...

Manufacturing method of semiconductor device

Microelectronic assembly with joined bond elements having lowered i...

Method of manufacturing semiconductor device

Semiconductor device, method for manufacturing semiconductor device...

Semiconductor component having through wire interconnect (TWI) with...

Semiconductor device and method for manufacturing same

Semiconductor device and manufacturing method for the same

Surface mount device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

Through Wire Interconnect (TWI) For Semiconductor Components Having...

MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTRUING SEMICONDUCTOR DEVICE

STACKED SEMICONDUCTOR COMPONENT HAVING THROUGH WIRE INTERCONNECT (T...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

METHOD FOR JOINING BONDING WIRE, SEMICONDUCTOR DEVICE, AND METHOD F...

Manufacturing Method of Semiconductor Device

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...

MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...

MICROELECTRONIC ASSEMBLY WITH BOND ELEMENTS HAVING LOWERED INDUCTANCE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

Semiconductor Component Having Through Wire Interconnect (TWI) With...

SEMICONDUCTOR DEVICE AND WIRE BONDING METHOD

SEMICONDUCTOR DEVICE

Method for fabricating package structure of stacked chips

Semiconductor Device and Semiconductor Device Manufacturing Method

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME