Wire connectors having the same loop shape and height

Industry

CPC
H01L2224/49176

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/49176Wire connectors having the same loop shape and height

Industries

Patents Grantslast 30 patents

Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic package for high CTE mismatch
- Patent number 12,119,281
- Issue date Oct 15, 2024
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element mounting substrate, and electronic device
- Patent number 11,996,339
- Issue date May 28, 2024
- Kyocera Corporation
- Kenichi Ura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,862,608
- Issue date Jan 2, 2024
- Samsung Electronics Co., Ltd.
- Jooyoung Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency package
- Patent number 11,831,282
- Issue date Nov 28, 2023
- Sumitomo Electric Device Innovations, Inc.
- Tadashi Minami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,791,314
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Seoeun Kyung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DC and AC magnetic field protection for MRAM device using magnetic-...
- Patent number 11,715,702
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure, electronic device and method for preparing...
- Patent number 11,545,517
- Issue date Jan 3, 2023
- Shenzhen Goodix Technology Co., Ltd.
- Haoxiang Dong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Leads for semiconductor package
- Patent number 11,538,740
- Issue date Dec 27, 2022
- Texas Instruments Incorporated
- Jason Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with electrode pad having different bonding su...
- Patent number 11,538,779
- Issue date Dec 27, 2022
- Kabushiki Kaisha Toshiba
- Hitoshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF amplifiers with series-coupled output bondwire arrays and shunt...
- Patent number 11,476,209
- Issue date Oct 18, 2022
- NXP B.V.
- Vikas Shilimkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including semiconductor chip having point sym...
- Patent number 11,469,196
- Issue date Oct 11, 2022
- SK hynix Inc.
- Jun Sik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier systems with control interface and bias circuit
- Patent number 11,451,199
- Issue date Sep 20, 2022
- Skyworks Solutions, Inc.
- David Steven Ripley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device including circuitry under bond pads
- Patent number 11,424,169
- Issue date Aug 23, 2022
- Micron Technology, Inc.
- Chiara Cerafogli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged transistor devices with input-output isolation and methods...
- Patent number 11,417,617
- Issue date Aug 16, 2022
- Wolfspeed, Inc.
- Frank Trang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency amplifier
- Patent number 11,398,800
- Issue date Jul 26, 2022
- Sumitomo Electric Device Innovations, Inc.
- Tadashi Minami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure
- Patent number 11,309,275
- Issue date Apr 19, 2022
- KINGPAK TECHNOLOGY INC.
- Chung-Hsien Hsin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,309,236
- Issue date Apr 19, 2022
- Kioxia Corporation
- Minoru Kurata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,239,220
- Issue date Feb 1, 2022
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Amplifier
- Patent number 11,164,828
- Issue date Nov 2, 2021
- Mitsubishi Electric Corporation
- Kei Fukunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,145,597
- Issue date Oct 12, 2021
- Renesas Electronics Corporation
- Shinichi Kuwabara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Abstracted NAND logic in stacks
- Patent number 11,139,283
- Issue date Oct 5, 2021
- Xcelsis Corporation
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parallel electrode combination, power module and power module group
- Patent number 11,127,659
- Issue date Sep 21, 2021
- YANGZHOU GUOYANG ELECTRONIC CO., LTD.
- Wenhui Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced-length bond pads for broadband power amplifiers
- Patent number 11,114,396
- Issue date Sep 7, 2021
- Cree, Inc.
- Lei Zhao
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device assemblies including multiple shingled stacks...
- Patent number 11,094,670
- Issue date Aug 17, 2021
- Micron Technology, Inc.
- Hong Wan Ng
- G11 - INFORMATION STORAGE
Information Patent Grant
DC and AC magnetic field protection for MRAM device using magnetic-...
- Patent number 11,088,083
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF power amplifier pallet
- Patent number 11,075,178
- Issue date Jul 27, 2021
- Ampleon Netherlands B.V.
- Gutta Venkata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond wire array for packaged semiconductor device
- Patent number 11,049,837
- Issue date Jun 29, 2021
- NXP USA, INC.
- Jitesh Vaswani
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
High power cavity package for light emitters
- Patent number 10,971,892
- Issue date Apr 6, 2021
- II-VI DELAWARE, INC.
- Brent Stapleton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 10,971,486
- Issue date Apr 6, 2021
- Samsung Electronics Co., Ltd.
- Hee-Won Kang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT AND EQUIPMENT
- Publication number 20240347565
- Publication date Oct 17, 2024
- Canon Kabushiki Kaisha
- YU KATASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH OVERLAPPING TERMINALS
- Publication number 20240332148
- Publication date Oct 3, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY (RF) INTERCONNECT CONFIGURATION FOR SUBSTRATE AND S...
- Publication number 20240297105
- Publication date Sep 5, 2024
- CIENA CORPORATION
- Michael Vitic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ELEMENT MOUNTING BOARD, ELECTRONIC COMPONENT, AND ELECTR...
- Publication number 20240297108
- Publication date Sep 5, 2024
- KYOCERA CORPORATION
- Kanae HORIUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERTING DEVICE
- Publication number 20240274557
- Publication date Aug 15, 2024
- Mitsubishi Electric Corporation
- Yo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUANTUM CHIP, QUANTUM DEVICE, AND QUANTUM COMPUTER
- Publication number 20240243082
- Publication date Jul 18, 2024
- NEC Corporation
- Tomohiro YAMAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-TOOL AND MULTI-DIRECTIONAL PACKAGE SINGULATION
- Publication number 20240222144
- Publication date Jul 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- John Carlo C. MOLINA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER APPARATUS
- Publication number 20240203852
- Publication date Jun 20, 2024
- SENTEC E&E CO., LTD.
- Jason HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
- Publication number 20240178212
- Publication date May 30, 2024
- KIOXIA Corporation
- Ken MURAMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Comprising a Leadframe Adapted for Higher Curr...
- Publication number 20240112993
- Publication date Apr 4, 2024
- Infineon Technologies Austria AG
- Stefan Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOCUMENT STRUCTURE FORMATION
- Publication number 20240105669
- Publication date Mar 28, 2024
- INFINEON TECHNOLOGIES AG
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240071997
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Joonghyun BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20240047336
- Publication date Feb 8, 2024
- Siliconware Precision Industries Co., Ltd.
- Ching-Chih Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD TOPOLOGY TO MITIGATE CRACK FORMATION
- Publication number 20240006353
- Publication date Jan 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Anton Johann BAYERSTADLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIBBON SHIELD DEVICE AND METHOD
- Publication number 20230317680
- Publication date Oct 5, 2023
- Intel Corporation
- Prabhat Ranjan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DC AND AC MAGNETIC FIELD PROTECTION FOR MRAM DEVICE USING MAGNETIC-...
- Publication number 20230317629
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230178518
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Raehyung DO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE DRIVER PACKAGE FOR UNIFORM COUPLING TO DIFFERENTIAL SIGNAL BON...
- Publication number 20230138570
- Publication date May 4, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Thomas Dyer BONIFIELD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230119348
- Publication date Apr 20, 2023
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING CIRCUITRY UNDER BOND PADS
- Publication number 20230005799
- Publication date Jan 5, 2023
- Micron Technology, Inc.
- Chiara Cerafogli
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR MODULE WITH BOND WIRE LOOP EXPOSED FROM A MOLDED BODY...
- Publication number 20220352114
- Publication date Nov 3, 2022
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY PACKAGE
- Publication number 20220329213
- Publication date Oct 13, 2022
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Tadashi MINAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND TEMPERATURE MEASUREMENT METHOD
- Publication number 20220244111
- Publication date Aug 4, 2022
- Fuji Electric Co., Ltd.
- Shinichi MASUDA
- G02 - OPTICS
Information Patent Application
Semiconductor Device and Method of Forming Leadframe with Clip Bond...
- Publication number 20220208686
- Publication date Jun 30, 2022
- UTAC Headquarters Pte. Ltd.
- Natawat Kasikornrungroj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20220149010
- Publication date May 12, 2022
- Samsung Electronics Co., Ltd.
- Seoeun Kyung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220093542
- Publication date Mar 24, 2022
- Kabushiki Kaisha Toshiba
- Hitoshi KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20210407972
- Publication date Dec 30, 2021
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE
- Publication number 20210398934
- Publication date Dec 23, 2021
- Kingpak Technology Inc.
- CHUNG-HSIEN HSIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DC AND AC MAGNETIC FIELD PROTECTION FOR MRAM DEVICE USING MAGNETIC-...
- Publication number 20210366840
- Publication date Nov 25, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIP HAVING POINT SYM...
- Publication number 20210257323
- Publication date Aug 19, 2021
- SK HYNIX INC.
- Jun Sik KIM
- H01 - BASIC ELECTRIC ELEMENTS

Wire connectors having the same loop shape and height

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power amplifier modules including semiconductor resistor and tantal...

Hermetic package for high CTE mismatch

Electronic element mounting substrate, and electronic device

Semiconductor package

High frequency package

Semiconductor packages

DC and AC magnetic field protection for MRAM device using magnetic-...

Chip package structure, electronic device and method for preparing...

Leads for semiconductor package

Semiconductor device with electrode pad having different bonding su...

RF amplifiers with series-coupled output bondwire arrays and shunt...

Semiconductor package including semiconductor chip having point sym...

Power amplifier systems with control interface and bias circuit

Memory device including circuitry under bond pads

Packaged transistor devices with input-output isolation and methods...

High frequency amplifier

Sensor package structure

Semiconductor device

Semiconductor package and method of fabricating the same

Amplifier

Semiconductor device and method of manufacturing the same

Abstracted NAND logic in stacks

Parallel electrode combination, power module and power module group

Reduced-length bond pads for broadband power amplifiers

Semiconductor device assemblies including multiple shingled stacks...

DC and AC magnetic field protection for MRAM device using magnetic-...

RF power amplifier pallet

Bond wire array for packaged semiconductor device

High power cavity package for light emitters

Semiconductor package and method of manufacturing the semiconductor...

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT AND EQUIPMENT

POWER MODULE WITH OVERLAPPING TERMINALS

RADIO FREQUENCY (RF) INTERCONNECT CONFIGURATION FOR SUBSTRATE AND S...

ELECTRONIC ELEMENT MOUNTING BOARD, ELECTRONIC COMPONENT, AND ELECTR...

SEMICONDUCTOR DEVICE AND POWER CONVERTING DEVICE

QUANTUM CHIP, QUANTUM DEVICE, AND QUANTUM COMPUTER

MULTI-TOOL AND MULTI-DIRECTIONAL PACKAGE SINGULATION

POWER APPARATUS

SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE

Semiconductor Device Comprising a Leadframe Adapted for Higher Curr...

DOCUMENT STRUCTURE FORMATION

SEMICONDUCTOR PACKAGE

ELECTRONIC PACKAGE

BOND PAD TOPOLOGY TO MITIGATE CRACK FORMATION

RIBBON SHIELD DEVICE AND METHOD

DC AND AC MAGNETIC FIELD PROTECTION FOR MRAM DEVICE USING MAGNETIC-...

SEMICONDUCTOR PACKAGE

GATE DRIVER PACKAGE FOR UNIFORM COUPLING TO DIFFERENTIAL SIGNAL BON...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

MEMORY DEVICE INCLUDING CIRCUITRY UNDER BOND PADS

SEMICONDUCTOR MODULE WITH BOND WIRE LOOP EXPOSED FROM A MOLDED BODY...

HIGH FREQUENCY PACKAGE

SEMICONDUCTOR DEVICE AND TEMPERATURE MEASUREMENT METHOD

Semiconductor Device and Method of Forming Leadframe with Clip Bond...

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SENSOR PACKAGE STRUCTURE

DC AND AC MAGNETIC FIELD PROTECTION FOR MRAM DEVICE USING MAGNETIC-...

SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIP HAVING POINT SYM...