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DOCUMENT STRUCTURE FORMATION
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Publication number 20240105669
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Publication date Mar 28, 2024
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INFINEON TECHNOLOGIES AG
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Jens Pohl
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20240071997
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Publication date Feb 29, 2024
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Samsung Electronics Co., Ltd.
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Joonghyun BAEK
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H01 - BASIC ELECTRIC ELEMENTS
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ELECTRONIC PACKAGE
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Publication number 20240047336
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Publication date Feb 8, 2024
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Siliconware Precision Industries Co., Ltd.
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Ching-Chih Lin
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20230178518
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Publication date Jun 8, 2023
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Samsung Electronics Co., Ltd.
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Raehyung DO
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H01 - BASIC ELECTRIC ELEMENTS
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HIGH FREQUENCY PACKAGE
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Publication number 20220329213
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Publication date Oct 13, 2022
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SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
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Tadashi MINAMI
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGES
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Publication number 20220149010
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Publication date May 12, 2022
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Samsung Electronics Co., Ltd.
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Seoeun Kyung
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20220093542
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Publication date Mar 24, 2022
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Kabushiki Kaisha Toshiba
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Hitoshi KOBAYASHI
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H01 - BASIC ELECTRIC ELEMENTS
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SENSOR PACKAGE STRUCTURE
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Publication number 20210398934
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Publication date Dec 23, 2021
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Kingpak Technology Inc.
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CHUNG-HSIEN HSIN
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H01 - BASIC ELECTRIC ELEMENTS
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HIGH POWER MODULE
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Publication number 20210202439
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Publication date Jul 1, 2021
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Industrial Technology Research Institute
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CHIH-CHIANG WU
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20210074619
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Publication date Mar 11, 2021
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KIOXIA Corporation
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Minoru KURATA
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H01 - BASIC ELECTRIC ELEMENTS
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LEADS FOR SEMICONDUCTOR PACKAGE
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Publication number 20210020549
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Publication date Jan 21, 2021
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TEXAS INSTRUMENTS INCORPORATED
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Jason CHIEN
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H01 - BASIC ELECTRIC ELEMENTS
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