with a graded temperature profile

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CPC
H01L2224/81211

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81211with a graded temperature profile

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Solder reflow apparatus and method of manufacturing an electronic d...
- Patent number 12,154,882
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Youngja Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,113,044
- Issue date Oct 8, 2024
- Advanced Semiconductor Engineering, Inc.
- Shan-Bo Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 11,764,080
- Issue date Sep 19, 2023
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 11,328,937
- Issue date May 10, 2022
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 10,741,419
- Issue date Aug 11, 2020
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming high routing density int...
- Patent number 10,580,749
- Issue date Mar 3, 2020
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 10,403,512
- Issue date Sep 3, 2019
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu core ball, solder paste, formed solder, Cu core column, and sold...
- Patent number 10,322,472
- Issue date Jun 18, 2019
- Senju Metal Industry Co., Ltd.
- Takahiro Hattori
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Structures and methods to enable a full intermetallic interconnect
- Patent number 10,170,446
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste, joining method using the same and joined structure
- Patent number 10,010,980
- Issue date Jul 3, 2018
- MURATA MANUFACTURING CO., LTD.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structures and methods to enable a full intermetallic interconnect
- Patent number 9,911,711
- Issue date Mar 6, 2018
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 9,899,238
- Issue date Feb 20, 2018
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip bonding alloys
- Patent number 9,847,310
- Issue date Dec 19, 2017
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures to enable a full intermetallic interconnect
- Patent number 9,741,682
- Issue date Aug 22, 2017
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical apparatus
- Patent number 9,640,508
- Issue date May 2, 2017
- Fujitsu Limited
- Taiki Uemura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having connection terminal of solder
- Patent number 9,620,470
- Issue date Apr 11, 2017
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device capable of enhancing b...
- Patent number 9,305,875
- Issue date Apr 5, 2016
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect pillars with directed compliance geometry
- Patent number 9,184,144
- Issue date Nov 10, 2015
- QUALCOMM Incorporated
- Zhongping Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip interconnection having narrow interconnection sites on th...
- Patent number 9,159,665
- Issue date Oct 13, 2015
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding structure manufacturing method, heating and melting treatme...
- Patent number 9,119,336
- Issue date Aug 25, 2015
- Ayumi Industry Co., Ltd.
- Hideyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3D assembly for interposer bow
- Patent number 9,059,241
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder paste, joining method using the same and joined structure
- Patent number 9,044,816
- Issue date Jun 2, 2015
- MURATA MANUFACTURING CO., LTD.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder connection structure and solder ball
- Patent number 8,975,757
- Issue date Mar 10, 2015
- Senju Metal Industry Co., Ltd.
- Minoru Ueshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming high routing density BOL...
- Patent number 8,841,779
- Issue date Sep 23, 2014
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding structure manufacturing method, heating and melting treatme...
- Patent number 8,757,474
- Issue date Jun 24, 2014
- Ayumi Industry Co., Ltd.
- Hideyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder, soldering method, and semiconductor device
- Patent number 8,673,762
- Issue date Mar 18, 2014
- Fujitsu Limited
- Toshiya Akamatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Assembly of multi-chip modules with proximity connectors using refl...
- Patent number 8,648,463
- Issue date Feb 11, 2014
- Oracle International Corporation
- Hiren D. Thacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly having increased standoff height
- Patent number 8,604,356
- Issue date Dec 10, 2013
- Amkor Technology, Inc.
- Victor Carl Kessler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing electronic component, and electronic compo...
- Patent number 8,531,028
- Issue date Sep 10, 2013
- Sumitomo Bakelite Co., Ltd.
- Kenzou Maejima
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor package structures
- Patent number 8,524,595
- Issue date Sep 3, 2013
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mirng-Ji Lii
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Apparatus and Method for Wafer Oxide Removal and Reflow Treatment
- Publication number 20240282734
- Publication date Aug 22, 2024
- Air Products and Chemicals, Inc.
- Liang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...
- Publication number 20240047410
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Youngja KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
- Publication number 20230369071
- Publication date Nov 16, 2023
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230268314
- Publication date Aug 24, 2023
- Advanced Semiconductor Engineering, Inc.
- Shan-Bo WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
- Publication number 20220230892
- Publication date Jul 21, 2022
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
- Publication number 20200350181
- Publication date Nov 5, 2020
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
- Publication number 20190341271
- Publication date Nov 7, 2019
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS TO ENABLE A FULL INTERMETALLIC INTERCONNECT
- Publication number 20180158797
- Publication date Jun 7, 2018
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS TO ENABLE A FULL INTERMETALLIC INTERCONNECT
- Publication number 20170179071
- Publication date Jun 22, 2017
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES TO ENABLE A FULL INTERMETALLIC INTERCONNECT
- Publication number 20170179068
- Publication date Jun 22, 2017
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP BONDER WITH INDUCTION COILS
- Publication number 20160141264
- Publication date May 19, 2016
- International Business Machines Corporation
- Jae-woong Nah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Forming High Routing Density Int...
- Publication number 20140319692
- Publication date Oct 30, 2014
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE MANUFACTURING METHOD, HEATING AND MELTING TREATME...
- Publication number 20140246481
- Publication date Sep 4, 2014
- Hideyuki ABE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
3D ASSEMBLY FOR INTERPOSER BOW
- Publication number 20140209666
- Publication date Jul 31, 2014
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20140210086
- Publication date Jul 31, 2014
- Fujitsu Limited
- Kozo SHIMIZU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPO...
- Publication number 20130324641
- Publication date Dec 5, 2013
- SUMITOMO BAKELITE CO., LTD.
- Kenzou MAEJIMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Serial thermal linear processor arrangement
- Publication number 20130175323
- Publication date Jul 11, 2013
- Jian Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated Reflow and Cleaning Process and Apparatus for Performing...
- Publication number 20130146647
- Publication date Jun 13, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding Structure Manufacturing Method, Heating And Melting Treatme...
- Publication number 20130105558
- Publication date May 2, 2013
- AYUMI INDUSTRY CO., LTD.
- Hideyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Bump Bonding In Semiconductor Package Using Solder Balls Hav...
- Publication number 20130043573
- Publication date Feb 21, 2013
- Advanced Analogic Technologies (Hong Kong) Limited
- Richard K. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip Chip Interconnection having Narrow Interconnection Sites on th...
- Publication number 20130026628
- Publication date Jan 31, 2013
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Pillars with Directed Compliance Geometry
- Publication number 20130020711
- Publication date Jan 24, 2013
- QUALCOMM Incorporated
- Zhongping Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming High Routing Density Int...
- Publication number 20120241946
- Publication date Sep 27, 2012
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Flip Chip Interconnection Having Narrow Interconnection Sites on th...
- Publication number 20120211880
- Publication date Aug 23, 2012
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SOLDER, SOLDERING METHOD, AND SEMICONDUCTOR DEVICE
- Publication number 20120193800
- Publication date Aug 2, 2012
- FUJITSU LIMITED
- Toshiya Akamatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Paste, Joining Method Using the Same and Joined Structure
- Publication number 20120156512
- Publication date Jun 21, 2012
- Murata Manufacturing Co., Ltd.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPO...
- Publication number 20120061820
- Publication date Mar 15, 2012
- Kenzou Maejima
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ASSEMBLY OF MULTI-CHIP MODULES USING REFLOWABLE FEATURES
- Publication number 20110278718
- Publication date Nov 17, 2011
- Oracle International Corporation
- Hiren D. Thacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming High Routing Density Int...
- Publication number 20110248399
- Publication date Oct 13, 2011
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Sacrificial Material to Facilitate Thin Die Attach
- Publication number 20110233790
- Publication date Sep 29, 2011
- QUALCOMM Incorporated
- Omar Bchir
- H01 - BASIC ELECTRIC ELEMENTS

with a graded temperature profile

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solder reflow apparatus and method of manufacturing an electronic d...

Semiconductor package and manufacturing method thereof

Low cost package warpage solution

Low cost package warpage solution

Low cost package warpage solution

Semiconductor device and method of forming high routing density int...

Low cost package warpage solution

Cu core ball, solder paste, formed solder, Cu core column, and sold...

Structures and methods to enable a full intermetallic interconnect

Solder paste, joining method using the same and joined structure

Structures and methods to enable a full intermetallic interconnect

Low cost package warpage solution

Flip chip bonding alloys

Structures to enable a full intermetallic interconnect

Electrical apparatus

Semiconductor device having connection terminal of solder

Method of manufacturing semiconductor device capable of enhancing b...

Interconnect pillars with directed compliance geometry

Flip chip interconnection having narrow interconnection sites on th...

Bonding structure manufacturing method, heating and melting treatme...

3D assembly for interposer bow

Solder paste, joining method using the same and joined structure

Lead-free solder connection structure and solder ball

Semiconductor device and method of forming high routing density BOL...

Bonding structure manufacturing method, heating and melting treatme...

Solder, soldering method, and semiconductor device

Assembly of multi-chip modules with proximity connectors using refl...

Electronic assembly having increased standoff height

Method for manufacturing electronic component, and electronic compo...

Semiconductor package structures

Patents Applicationslast 30 patents

Apparatus and Method for Wafer Oxide Removal and Reflow Treatment

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...

LOW COST PACKAGE WARPAGE SOLUTION

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

LOW COST PACKAGE WARPAGE SOLUTION

LOW COST PACKAGE WARPAGE SOLUTION

LOW COST PACKAGE WARPAGE SOLUTION

STRUCTURES AND METHODS TO ENABLE A FULL INTERMETALLIC INTERCONNECT

STRUCTURES AND METHODS TO ENABLE A FULL INTERMETALLIC INTERCONNECT

STRUCTURES TO ENABLE A FULL INTERMETALLIC INTERCONNECT

FLIP-CHIP BONDER WITH INDUCTION COILS

Semiconductor Device and Method of Forming High Routing Density Int...

BONDING STRUCTURE MANUFACTURING METHOD, HEATING AND MELTING TREATME...

3D ASSEMBLY FOR INTERPOSER BOW

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPO...

Serial thermal linear processor arrangement

Integrated Reflow and Cleaning Process and Apparatus for Performing...

Bonding Structure Manufacturing Method, Heating And Melting Treatme...

Solder Bump Bonding In Semiconductor Package Using Solder Balls Hav...

Flip Chip Interconnection having Narrow Interconnection Sites on th...

Interconnect Pillars with Directed Compliance Geometry

Semiconductor Device and Method of Forming High Routing Density Int...

Flip Chip Interconnection Having Narrow Interconnection Sites on th...

SOLDER, SOLDERING METHOD, AND SEMICONDUCTOR DEVICE

Solder Paste, Joining Method Using the Same and Joined Structure

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPO...

ASSEMBLY OF MULTI-CHIP MODULES USING REFLOWABLE FEATURES

Semiconductor Device and Method of Forming High Routing Density Int...

Sacrificial Material to Facilitate Thin Die Attach