with a principal constituent of the material being a metal or a metalloid

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H01L2924/165

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/165with a principal constituent of the material being a metal or a metalloid

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package aligning interposer and substrate
- Patent number 12,051,680
- Issue date Jul 30, 2024
- Samsung Electronics Co., Ltd.
- Tae Hwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material having different thicknesses in packages
- Patent number 11,916,023
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 11,862,525
- Issue date Jan 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with partitioned logic and ass...
- Patent number 11,562,986
- Issue date Jan 24, 2023
- Micron Technology, Inc.
- Jian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered transient liquid phase bonding
- Patent number 11,546,998
- Issue date Jan 3, 2023
- Skyworks Solutions, Inc.
- Bradley Paul Barber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting an electrical component in which a hood is used...
- Patent number 11,424,170
- Issue date Aug 23, 2022
- Siemens Aktiengesellschaft
- Nora Busche
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked silicon package assembly having thermal management
- Patent number 11,355,412
- Issue date Jun 7, 2022
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 11,276,616
- Issue date Mar 15, 2022
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded package assemblies with integrated capacitor
- Patent number 11,049,819
- Issue date Jun 29, 2021
- International Business Machines Corporation
- Mark C. Lamorey
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Stacked semiconductor die assemblies with partitioned logic and ass...
- Patent number 10,978,427
- Issue date Apr 13, 2021
- Micron Technology, Inc.
- Jian Li
- G11 - INFORMATION STORAGE
Information Patent Grant
Thermal interface material on package
- Patent number 10,896,862
- Issue date Jan 19, 2021
- International Business Machines Corporation
- Isabel De Sousa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transient liquid phase material bonding and sealing structures and...
- Patent number 10,840,108
- Issue date Nov 17, 2020
- Skyworks Solutions, Inc.
- Bradley Paul Barber
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High reliability wafer level semiconductor packaging
- Patent number 10,790,208
- Issue date Sep 29, 2020
- Semiconductor Components Industries, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material having different thicknesses in packages
- Patent number 10,770,405
- Issue date Sep 8, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package and related methods
- Patent number 10,770,492
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Bingzhi Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material having different thicknesses in packages
- Patent number 10,707,177
- Issue date Jul 7, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 10,658,255
- Issue date May 19, 2020
- ADVANCED SEMSCONDUCTOR ENGINEERING, INC.
- Tsung-Yu Lin
- G01 - MEASURING TESTING
Information Patent Grant
Shielded package assemblies with integrated capacitor
- Patent number 10,553,544
- Issue date Feb 4, 2020
- International Business Machines Corporation
- Mark C. Lamorey
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Tamper-proof electronic packages with stressed glass component subs...
- Patent number 10,535,618
- Issue date Jan 14, 2020
- International Business Machines Corporation
- James A. Busby
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Tamper-proof electronic packages with stressed glass component subs...
- Patent number 10,535,619
- Issue date Jan 14, 2020
- International Business Machines Corporation
- James A. Busby
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High reliability wafer level semiconductor packaging
- Patent number 10,290,556
- Issue date May 14, 2019
- Semiconductor Components Industries, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical package including bimetal lid
- Patent number 10,090,257
- Issue date Oct 2, 2018
- International Business Machines Corporation
- Keiji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and methods for heat transfer from packaged semiconduct...
- Patent number 10,068,875
- Issue date Sep 4, 2018
- Micron Technology, Inc.
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Limiting electronic package warpage
- Patent number 10,056,268
- Issue date Aug 21, 2018
- International Business Machines Corporation
- Shidong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical package including bimetal lid
- Patent number 10,032,727
- Issue date Jul 24, 2018
- International Business Machines Corporation
- Keiji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 10,032,692
- Issue date Jul 24, 2018
- NVIDIA Corporation
- Shantanu Kalchuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material on package
- Patent number 9,941,184
- Issue date Apr 10, 2018
- International Business Machines Corporation
- Isabel De Sousa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Limiting electronic package warpage with semiconductor chip lid and...
- Patent number 9,892,935
- Issue date Feb 13, 2018
- International Business Machines Corporation
- Shidong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material on package
- Patent number 9,881,848
- Issue date Jan 30, 2018
- International Business Machines Corporation
- Isabel De Sousa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability wafer level semiconductor packaging
- Patent number 9,859,180
- Issue date Jan 2, 2018
- Semiconductor Components Industries, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device Package with Thermal Module
- Publication number 20240395663
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sing-Da JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH A REINFORCING LAYER
- Publication number 20240395731
- Publication date Nov 28, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20240321810
- Publication date Sep 26, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- YU-CHIAO TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312947
- Publication date Sep 19, 2024
- Kabushiki Kaisha Toshiba
- Tomohiro IGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES
- Publication number 20240162166
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20240145319
- Publication date May 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240120252
- Publication date Apr 11, 2024
- RENESAS ELECTRONICS CORPORATION
- Nobuhiro KINOSHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240079366
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Jonggyu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Improved Heat Dissipation Efficiency and Method for Fo...
- Publication number 20240063079
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Liquid Metal as Heat-Dissipation Media and Method For...
- Publication number 20240038627
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE SEALANT FOR CHIP PACKAGING AND PACKAGING STRUCTURE
- Publication number 20240030075
- Publication date Jan 25, 2024
- Wuhan Choice Technology Co,Ltd
- De WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Sensing External Condition in H...
- Publication number 20240003768
- Publication date Jan 4, 2024
- UTAC Headquarters Pte. Ltd.
- Paweena Phatto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELASTIC HEAT SPREADER FOR CHIP PACKAGE, PACKAGE STRUCTURE AND PACKA...
- Publication number 20230411235
- Publication date Dec 21, 2023
- STATS ChipPac Semiconductor (Jiangyin) Co., LTD.
- MAN BAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230402398
- Publication date Dec 14, 2023
- Siliconware Precision Industries Co., Ltd.
- Che-Chi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method Forming Same
- Publication number 20230395461
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP HEAT DISSIPATING STRUCTURE, PROCESS AND SEMICONDUCTOR DEVICE
- Publication number 20230386959
- Publication date Nov 30, 2023
- HEFEI SMAT TECHNOLOGY CO.,LTD.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20230378024
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Warpage Compensation for BGA Package
- Publication number 20230147273
- Publication date May 11, 2023
- Apple Inc.
- Brett W. Degner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ALIGNING INTERPOSER AND SUBSTRATE
- Publication number 20230120252
- Publication date Apr 20, 2023
- Samsung Electronics Co., Ltd.
- TAE HWAN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP STRUCTURE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE...
- Publication number 20220399300
- Publication date Dec 15, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20220208623
- Publication date Jun 30, 2022
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH PARTITIONED LOGIC AND ASS...
- Publication number 20210217734
- Publication date Jul 15, 2021
- Micron Technology, Inc.
- Jian Li
- G11 - INFORMATION STORAGE
Information Patent Application
Thermal Interface Material Having Different Thicknesses in Packages
- Publication number 20200402926
- Publication date Dec 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20200243408
- Publication date Jul 30, 2020
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu LIN
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR MOUNTING COMPONENT
- Publication number 20200196433
- Publication date Jun 18, 2020
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYERED TRANSIENT LIQUID PHASE BONDING
- Publication number 20200146155
- Publication date May 7, 2020
- SKYWORKS SOLUTIONS, INC.
- Bradley Paul Barber
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TRANSIENT LIQUID PHASE MATERIAL BONDING AND SEALING STRUCTURES AND...
- Publication number 20200090951
- Publication date Mar 19, 2020
- SKYWORKS SOLUTIONS, INC.
- Bradley Paul Barber
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SHIELDED PACKAGE ASSEMBLIES WITH INTEGRATED CAPACITOR
- Publication number 20200083177
- Publication date Mar 12, 2020
- International Business Machines Corporation
- Mark C. Lamorey
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING
- Publication number 20190229025
- Publication date Jul 25, 2019
- Semiconductor Components Industries, LLC
- Yu-Te HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAMPER-PROOF ELECTRONIC PACKAGES WITH STRESSED GLASS COMPONENT SUBS...
- Publication number 20180358311
- Publication date Dec 13, 2018
- International Business Machines Corporation
- James A. BUSBY
- G06 - COMPUTING CALCULATING COUNTING

with a principal constituent of the material being a metal or a metalloid

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package aligning interposer and substrate

Thermal interface material having different thicknesses in packages

Semiconductor device package and a method of manufacturing the same

Stacked semiconductor die assemblies with partitioned logic and ass...

Multilayered transient liquid phase bonding

Method for mounting an electrical component in which a hood is used...

Stacked silicon package assembly having thermal management

Semiconductor device package and a method of manufacturing the same

Shielded package assemblies with integrated capacitor

Stacked semiconductor die assemblies with partitioned logic and ass...

Thermal interface material on package

Transient liquid phase material bonding and sealing structures and...

High reliability wafer level semiconductor packaging

Thermal interface material having different thicknesses in packages

Chip scale package and related methods

Thermal interface material having different thicknesses in packages

Semiconductor device package and a method of manufacturing the same

Shielded package assemblies with integrated capacitor

Tamper-proof electronic packages with stressed glass component subs...

Tamper-proof electronic packages with stressed glass component subs...

High reliability wafer level semiconductor packaging

Electrical package including bimetal lid

Apparatuses and methods for heat transfer from packaged semiconduct...

Limiting electronic package warpage

Electrical package including bimetal lid

Semiconductor package structure

Thermal interface material on package

Limiting electronic package warpage with semiconductor chip lid and...

Thermal interface material on package

High reliability wafer level semiconductor packaging

Patents Applicationslast 30 patents

Semiconductor Device Package with Thermal Module

ELECTRONIC DEVICE WITH A REINFORCING LAYER

CHIP PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE

THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

Package with Improved Heat Dissipation Efficiency and Method for Fo...

Packages with Liquid Metal as Heat-Dissipation Media and Method For...

DIE SEALANT FOR CHIP PACKAGING AND PACKAGING STRUCTURE

Semiconductor Device and Method for Sensing External Condition in H...

ELASTIC HEAT SPREADER FOR CHIP PACKAGE, PACKAGE STRUCTURE AND PACKA...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor Device and Method Forming Same

CHIP HEAT DISSIPATING STRUCTURE, PROCESS AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF FORMING THE SAME

Warpage Compensation for BGA Package

SEMICONDUCTOR PACKAGE ALIGNING INTERPOSER AND SUBSTRATE

CLIP STRUCTURE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE...

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH PARTITIONED LOGIC AND ASS...

Thermal Interface Material Having Different Thicknesses in Packages

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

METHOD FOR MOUNTING COMPONENT

MULTILAYERED TRANSIENT LIQUID PHASE BONDING

TRANSIENT LIQUID PHASE MATERIAL BONDING AND SEALING STRUCTURES AND...

SHIELDED PACKAGE ASSEMBLIES WITH INTEGRATED CAPACITOR

HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING

TAMPER-PROOF ELECTRONIC PACKAGES WITH STRESSED GLASS COMPONENT SUBS...