with a principal constituent of the material being a metal or a metalloid

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H01L2924/16172

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/16172with a principal constituent of the material being a metal or a metalloid

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Integrated heat spreader having electromagnetically-formed features
- Patent number 10,763,188
- Issue date Sep 1, 2020
- Intel Corporation
- Aravindha R. Antoniswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical package including bimetal lid
- Patent number 10,090,257
- Issue date Oct 2, 2018
- International Business Machines Corporation
- Keiji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical package including bimetal lid
- Patent number 10,032,727
- Issue date Jul 24, 2018
- International Business Machines Corporation
- Keiji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with package-on-package stacking capability a...
- Patent number 9,640,518
- Issue date May 2, 2017
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric power semiconductor device
- Patent number 9,433,075
- Issue date Aug 30, 2016
- Mitsubishi Electric Corporation
- Junji Fujino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power line filter for multidimensional integrated circuits
- Patent number 9,391,010
- Issue date Jul 12, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Jr Huang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor package with package-on-package stacking capability a...
- Patent number 9,318,411
- Issue date Apr 19, 2016
- BRODGE SEMICONDUCTOR CORPORATION
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages for three-dimensional die stacks
- Patent number 9,252,101
- Issue date Feb 2, 2016
- International Business Machines Corporation
- Mark C. Lamorey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless module
- Patent number 9,245,859
- Issue date Jan 26, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Suguru Fujita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic module EMI shielding structures and methods
- Patent number 9,245,854
- Issue date Jan 26, 2016
- GLOBALFOUNDRIES Inc.
- William L. Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency semiconductor package and high-frequency semiconduct...
- Patent number 9,177,881
- Issue date Nov 3, 2015
- Kabushiki Kaisha Toshiba
- Yoshiyuki Ikuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus, method of making the same, and transceiving d...
- Patent number 8,952,846
- Issue date Feb 10, 2015
- Fujitsu Limited
- Akihiko Akasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic module EMI shielding structures and methods
- Patent number 8,952,503
- Issue date Feb 10, 2015
- International Business Machines Corporation
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 8,940,584
- Issue date Jan 27, 2015
- Samsung Electronics Co., Ltd.
- Tongsuk Kim
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING
Information Patent Grant
8917205
- Patent number 8,917,205
- Issue date Dec 23, 2014
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with multiple chips and substrate in metal cap
- Patent number 8,916,958
- Issue date Dec 23, 2014
- Infineon Technologies AG
- Chong Yee Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 8,748,228
- Issue date Jun 10, 2014
- Samsung Electronics Co., Ltd.
- Tongsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package module
- Patent number 8,558,377
- Issue date Oct 15, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Jin O Yoo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DEVICE EXPOSED DIE PACKAGE STRUCTURE WITH ADHESIVE
- Publication number 20240014099
- Publication date Jan 11, 2024
- Marvell Asia Pte Ltd.
- Choong Kooi Chee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY SEMICONDUCTOR PACKAGE AND HIGH-FREQUENCY SEMICONDUCT...
- Publication number 20140252569
- Publication date Sep 11, 2014
- KABUSHIKI KAISHA TOSHIBA
- Yoshiyuki Ikuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20140239477
- Publication date Aug 28, 2014
- Samsung Electronics Co., Ltd.
- Tongsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC MODULE EMI SHIELDING STRUCTURES AND METHODS
- Publication number 20140210059
- Publication date Jul 31, 2014
- International Business Machines Corporation
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS MODULE
- Publication number 20140145316
- Publication date May 29, 2014
- Suguru Fujita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER LINE FILTER FOR MULTIDIMENSIONAL INTEGRATED CIRCUITS
- Publication number 20130257564
- Publication date Oct 3, 2013
- Taiwan Semiconductor Manufacturing Co., LTD
- Bo-Jr HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAMELESS HERMETIC CIRCUIT PACKAGE
- Publication number 20130187286
- Publication date Jul 25, 2013
- Richard Schneider
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20130052775
- Publication date Feb 28, 2013
- Samsung Electronics Co., Ltd.
- Tongsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE MODULE
- Publication number 20120104572
- Publication date May 3, 2012
- Samsung Electro-Mechanics CO., LTD.
- Jin O. YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS, METHOD OF MAKING THE SAME, AND TRANSCEIVING D...
- Publication number 20120092218
- Publication date Apr 19, 2012
- Fujitsu Limited
- Akihiko Akasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH MULTIPLE CHIPS AND SUBSTRATE IN METAL CAP
- Publication number 20100270667
- Publication date Oct 28, 2010
- INFINEON TECHNOLOGIES AG
- Chong Yee Tong
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the material being a metal or a metalloid

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated heat spreader having electromagnetically-formed features

Electrical package including bimetal lid

Electrical package including bimetal lid

Semiconductor package with package-on-package stacking capability a...

Electric power semiconductor device

Power line filter for multidimensional integrated circuits

Semiconductor package with package-on-package stacking capability a...

Packages for three-dimensional die stacks

Wireless module

Organic module EMI shielding structures and methods

High-frequency semiconductor package and high-frequency semiconduct...

Electronic apparatus, method of making the same, and transceiving d...

Organic module EMI shielding structures and methods

Semiconductor packages and methods of forming the same

8917205

Semiconductor package with multiple chips and substrate in metal cap

Semiconductor packages and methods of forming the same

Semiconductor package module

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT DEVICE EXPOSED DIE PACKAGE STRUCTURE WITH ADHESIVE

HIGH-FREQUENCY SEMICONDUCTOR PACKAGE AND HIGH-FREQUENCY SEMICONDUCT...

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

ORGANIC MODULE EMI SHIELDING STRUCTURES AND METHODS

WIRELESS MODULE

POWER LINE FILTER FOR MULTIDIMENSIONAL INTEGRATED CIRCUITS

LEAD FRAMELESS HERMETIC CIRCUIT PACKAGE

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR PACKAGE MODULE

ELECTRONIC APPARATUS, METHOD OF MAKING THE SAME, AND TRANSCEIVING D...

SEMICONDUCTOR PACKAGE WITH MULTIPLE CHIPS AND SUBSTRATE IN METAL CAP