with a principal constituent of the material being a metal or a metalloid

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/133with a principal constituent of the material being a metal or a metalloid

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Patents Grantslast 30 patents

Information Patent Grant
Devices and methods related to radio-frequency filters on silicon-o...
- Patent number 12,237,861
- Issue date Feb 25, 2025
- Skyworks Solutions, Inc.
- James Phillip Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level dicing method and semiconductor device
- Patent number 12,176,248
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 12,119,321
- Issue date Oct 15, 2024
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor device with a semiconductor die embedded between an e...
- Patent number 12,107,035
- Issue date Oct 1, 2024
- Amkor Technology Singapore Holdings Pte. Ltd.
- Jae Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged die and RDL with bonding structures therebetween
- Patent number 11,996,401
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,990,435
- Issue date May 21, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,948,808
- Issue date Apr 2, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate
- Patent number 11,901,325
- Issue date Feb 13, 2024
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods related to radio-frequency filters on silicon-on-insulator...
- Patent number 11,817,895
- Issue date Nov 14, 2023
- Skyworks Solutions, Inc.
- James Phillip Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual sided fan-out package having low warpage across all temperatures
- Patent number 11,784,166
- Issue date Oct 10, 2023
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing stacked semiconductor die assemblies with...
- Patent number 11,776,877
- Issue date Oct 3, 2023
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged die and RDL with bonding structures therebetween
- Patent number 11,640,958
- Issue date May 2, 2023
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with redundant electrical connectors and ass...
- Patent number 11,626,388
- Issue date Apr 11, 2023
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with bridge layer
- Patent number 11,476,125
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for bonding a chip to a substrate
- Patent number 11,476,228
- Issue date Oct 18, 2022
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Gari Arutinov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 11,450,639
- Issue date Sep 20, 2022
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor die embedded between an e...
- Patent number 11,430,723
- Issue date Aug 30, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Jae Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced solder alloys for electronic interconnects
- Patent number 11,411,150
- Issue date Aug 9, 2022
- Alpha Assembly Solutions Inc.
- Morgana de Avila Ribas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,393,734
- Issue date Jul 19, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Forming of bump structure
- Patent number 11,329,018
- Issue date May 10, 2022
- International Business Machines Corporation
- Takashi Hisada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar integrated circuit package interconnects
- Patent number 11,276,630
- Issue date Mar 15, 2022
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to radio-frequency filters on silicon-o...
- Patent number 11,245,433
- Issue date Feb 8, 2022
- Skyworks Solutions, Inc.
- James Phillip Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die with embedded communication cavity
- Patent number 11,239,186
- Issue date Feb 1, 2022
- Intel Corporation
- Digvijay Raorane
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dual sided fan-out package having low warpage across all temperatures
- Patent number 11,239,206
- Issue date Feb 1, 2022
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with redundant electrical connectors and ass...
- Patent number 11,233,036
- Issue date Jan 25, 2022
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level integration including design/co-design, structure proce...
- Patent number 11,201,138
- Issue date Dec 14, 2021
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,195,726
- Issue date Dec 7, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor package with stacked semiconduc...
- Patent number 11,101,235
- Issue date Aug 24, 2021
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER LEVEL DICING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20250069954
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN E...
- Publication number 20250022784
- Publication date Jan 16, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PRESSURE SINTERING POWDER
- Publication number 20240413117
- Publication date Dec 12, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240332032
- Publication date Oct 3, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240304577
- Publication date Sep 12, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FLUX, SUBSTRATE AND MANUFACTURING METHOD, AND DEVICE
- Publication number 20240282737
- Publication date Aug 22, 2024
- BOE MLED TECHNOLOGY CO., LTD.
- Liang Sun
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICES AND METHODS RELATED TO RADIO-FREQUENCY FILTERS ON SILICON-O...
- Publication number 20240154639
- Publication date May 9, 2024
- Skyworks Solutions, Inc.
- James Phillip YOUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240047446
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...
- Publication number 20230395463
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN
- Publication number 20230253395
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO-REMELT SOLDER ENFORCEMENT JOINT
- Publication number 20230137877
- Publication date May 4, 2023
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINAL AND CONNECTION METHOD
- Publication number 20230075929
- Publication date Mar 9, 2023
- SONY GROUP CORPORATION
- JO UMEZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN E...
- Publication number 20220415769
- Publication date Dec 29, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS RELATED TO RADIO-FREQUENCY FILTERS ON SILICON-ON-INSULATOR...
- Publication number 20220255577
- Publication date Aug 11, 2022
- Skyworks Solutions, Inc.
- James Phillip YOUNG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...
- Publication number 20220013434
- Publication date Jan 13, 2022
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN
- Publication number 20210249399
- Publication date Aug 12, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE PASTE FOR FORMING PILLARS
- Publication number 20210229172
- Publication date Jul 29, 2021
- DIC CORPORATION
- Ryota Yamaguchi
- B22 - CASTING POWDER METALLURGY
Information Patent Application
FORMING OF BUMP STRUCTURE
- Publication number 20210125950
- Publication date Apr 29, 2021
- International Business Machines Corporation
- Takashi Hisada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO RADIO-FREQUENCY FILTERS ON SILICON-O...
- Publication number 20200321996
- Publication date Oct 8, 2020
- SKYWORKS SOLUTIONS, INC.
- James Phillip YOUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Stack Assembly Using An Edge Separation Structure For Connectiv...
- Publication number 20200266174
- Publication date Aug 20, 2020
- LITTELFUSE, INC.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Making Multi-Die Package With Bridge Layer
- Publication number 20200266074
- Publication date Aug 20, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDED HEAD PILLAR FOR BUMP BONDS
- Publication number 20200258856
- Publication date Aug 13, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SOLDER BUMP STRUCTURE
- Publication number 20200152590
- Publication date May 14, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...
- Publication number 20200126951
- Publication date Apr 23, 2020
- International Business Machines Corporation
- Bing DANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SOLDER BUMP STRUCTURE
- Publication number 20200058612
- Publication date Feb 20, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING DIODE DISPLAY DEVICE
- Publication number 20190305202
- Publication date Oct 3, 2019
- Samsung Electronics Co., Ltd.
- Tan SAKONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Trace Design for Bump-on-Trace (BOT) Assembly
- Publication number 20190252347
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Liang Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DUAL SIDED FAN-OUT PACKAGE HAVING LOW WARPAGE ACROSS ALL TEMPERATURES
- Publication number 20190237438
- Publication date Aug 1, 2019
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Solder Alloys For Electronic Interconnects
- Publication number 20190157535
- Publication date May 23, 2019
- Alpha Assembly Solutions Inc.
- Morgana de Avila Ribas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF
- Publication number 20190109111
- Publication date Apr 11, 2019
- EPISTAR CORPORATION
- Shih-An LIAO
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the material being a metal or a metalloid

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Devices and methods related to radio-frequency filters on silicon-o...

Wafer level dicing method and semiconductor device

Semiconductor device and a method of manufacturing thereof

Low pressure sintering powder

Semiconductor device with a semiconductor die embedded between an e...

Packaged die and RDL with bonding structures therebetween

Fingerprint sensor and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Multilayer substrate

Methods related to radio-frequency filters on silicon-on-insulator...

Dual sided fan-out package having low warpage across all temperatures

Methods of manufacturing stacked semiconductor die assemblies with...

Packaged die and RDL with bonding structures therebetween

Interconnect structure with redundant electrical connectors and ass...

Multi-die package with bridge layer

Method and system for bonding a chip to a substrate

Semiconductor device and a method of manufacturing thereof

Semiconductor device with a semiconductor die embedded between an e...

Advanced solder alloys for electronic interconnects

Fingerprint sensor and manufacturing method thereof

Sintering materials and attachment methods using same

Forming of bump structure

Planar integrated circuit package interconnects

Devices and methods related to radio-frequency filters on silicon-o...

Die with embedded communication cavity

Dual sided fan-out package having low warpage across all temperatures

Interconnect structure with redundant electrical connectors and ass...

Wafer level integration including design/co-design, structure proce...

Semiconductor device and manufacturing method thereof

Fabrication method of semiconductor package with stacked semiconduc...

Patents Applicationslast 30 patents

WAFER LEVEL DICING METHOD AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN E...

LOW PRESSURE SINTERING POWDER

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

FLUX, SUBSTRATE AND MANUFACTURING METHOD, AND DEVICE

DEVICES AND METHODS RELATED TO RADIO-FREQUENCY FILTERS ON SILICON-O...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME

METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...

PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN

NO-REMELT SOLDER ENFORCEMENT JOINT

TERMINAL AND CONNECTION METHOD

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN E...

METHODS RELATED TO RADIO-FREQUENCY FILTERS ON SILICON-ON-INSULATOR...

METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...

PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN

ELECTRICALLY CONDUCTIVE PASTE FOR FORMING PILLARS

FORMING OF BUMP STRUCTURE

DEVICES AND METHODS RELATED TO RADIO-FREQUENCY FILTERS ON SILICON-O...

Die Stack Assembly Using An Edge Separation Structure For Connectiv...

Methods for Making Multi-Die Package With Bridge Layer

EXPANDED HEAD PILLAR FOR BUMP BONDS

METHOD OF FORMING A SOLDER BUMP STRUCTURE

WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...

METHOD OF FORMING A SOLDER BUMP STRUCTURE

LIGHT EMITTING DIODE DISPLAY DEVICE

Trace Design for Bump-on-Trace (BOT) Assembly

DUAL SIDED FAN-OUT PACKAGE HAVING LOW WARPAGE ACROSS ALL TEMPERATURES

Advanced Solder Alloys For Electronic Interconnects

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF