with a principal constituent of the material being a metal or a metalloid

Industry

CPC
H01L2224/804

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/804with a principal constituent of the material being a metal or a metalloid

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,791,243
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,462,458
- Issue date Oct 4, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,075,155
- Issue date Jul 27, 2021
- Innolux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 10,930,580
- Issue date Feb 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die encapsulation in oxide bonded wafer stack
- Patent number 10,784,234
- Issue date Sep 22, 2020
- Raytheon Company
- John J. Drab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermosonically bonded connection for flip chip packages
- Patent number 10,741,415
- Issue date Aug 11, 2020
- STMicroelectronics S.r.l.
- Mauro Mazzola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of liquid assisted micro cold binding
- Patent number 10,672,736
- Issue date Jun 2, 2020
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked CMOS image sensor
- Patent number 10,573,679
- Issue date Feb 25, 2020
- Samsung Electronics Co., Ltd.
- Doo-won Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 10,515,874
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,504,749
- Issue date Dec 10, 2019
- Mitsubishi Materials Corporation
- Shuji Nishimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die encapsulation in oxide bonded wafer stack
- Patent number 10,242,967
- Issue date Mar 26, 2019
- Raytheon Company
- John J. Drab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strip-type substrate for producing chip card modules
- Patent number 10,176,420
- Issue date Jan 8, 2019
- Heraeus Deutschland GmbH & Co. KG
- Eckhard Ditzel
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Microelectronic assemblies formed using metal silicide, and methods...
- Patent number 9,905,523
- Issue date Feb 27, 2018
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking arrangement for integration of multiple integrated circuits
- Patent number 9,741,644
- Issue date Aug 22, 2017
- Honeywell International Inc.
- Romney R. Katti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterostructure comprising a carbon nanomembrane
- Patent number 9,735,366
- Issue date Aug 15, 2017
- CNM TECHNOLOGIES GMBH
- Andrey Turchanin
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Semiconductor device having insulating layers containing oxygen and...
- Patent number 9,704,740
- Issue date Jul 11, 2017
- Fujitsu Semiconductor Limited
- Hirosato Ochimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal to metal bonding for stacked (3D) integrated circuits
- Patent number 9,673,176
- Issue date Jun 6, 2017
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal to metal bonding for stacked (3D) integrated circuits
- Patent number 9,666,563
- Issue date May 30, 2017
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal to metal bonding for stacked (3D) integrated circuits
- Patent number 9,653,431
- Issue date May 16, 2017
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal to metal bonding for stacked (3D) integrated circuits
- Patent number 9,653,432
- Issue date May 16, 2017
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing a semiconductor d...
- Patent number 9,613,930
- Issue date Apr 4, 2017
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component built-in board and method of manufacturing the same, and...
- Patent number 9,591,767
- Issue date Mar 7, 2017
- Fujikura Ltd.
- Kazuhisa Itoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal to metal bonding for stacked (3D) integrated circuits
- Patent number 9,515,051
- Issue date Dec 6, 2016
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flattened substrate surface for substrate bonding
- Patent number 9,355,936
- Issue date May 31, 2016
- GLOBALFOUNDRIES Inc.
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-wafer pair anodic bonding apparatus and method
- Patent number 9,287,126
- Issue date Mar 15, 2016
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Method of sealing and contacting substrates using laser light and e...
- Patent number 9,171,822
- Issue date Oct 27, 2015
- Corelase Oy
- Jarno Kangastupa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip-on-wafer bonding method and bonding device, and structure comp...
- Patent number 9,142,532
- Issue date Sep 22, 2015
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solderless die attach to a direct bonded aluminum substrate
- Patent number 9,111,782
- Issue date Aug 18, 2015
- IXYS Corporation
- Nathan Zommer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Atomic level bonding for electronics packaging
- Patent number 8,754,512
- Issue date Jun 17, 2014
- Delphi Technologies, Inc.
- Ralph S. Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless die attach to a direct bonded aluminum substrate
- Patent number 8,716,864
- Issue date May 6, 2014
- IXYS Corporation
- Nathan Zommer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING
- Publication number 20240379564
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yi-Chu WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20240332247
- Publication date Oct 3, 2024
- Nichia Corporation.
- Hiroaki KAGEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-TO-CHIP STACKING BY USE OF NICKEL TIN METALLIZATION STACKS AND...
- Publication number 20240304600
- Publication date Sep 12, 2024
- Infineon Technologies Austria AG
- Shalini Jakanadan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240250039
- Publication date Jul 25, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240250038
- Publication date Jul 25, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHO...
- Publication number 20240222226
- Publication date Jul 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH IN GLASS CORE PACKAGE THROUGH ORGANIC-TO-ORGANIC BONDING
- Publication number 20240222345
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR DIE RECYCLING FOR HIGH YIELD PACKAGING
- Publication number 20240222298
- Publication date Jul 4, 2024
- Intel Corporation
- Jeremy D. Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURES FOR BONDED WAFERS
- Publication number 20240203816
- Publication date Jun 20, 2024
- International Business Machines Corporation
- Kisik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240128147
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sey-Ping SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D System and Wafer Reconstitution with Mid-layer Interposer
- Publication number 20240105699
- Publication date Mar 28, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20240088048
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...
- Publication number 20240038633
- Publication date Feb 1, 2024
- INVENSAS BONDING TECHNOLOGIES, INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR AND METHOD FOR FORMING THE SAME
- Publication number 20240021549
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240006301
- Publication date Jan 4, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE INTEGRATION WITH HYBRID BONDING
- Publication number 20230411325
- Publication date Dec 21, 2023
- Xilinx, Inc.
- Inderjit SINGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20230369170
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufaturing Co., Ltd.
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING A DIE TO A SUBSTRATE WITH VIAS CONNECTING METAL PADS...
- Publication number 20230317653
- Publication date Oct 5, 2023
- Intel Corporation
- Hongxia FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATE PACKAGE WITH HYBRID BONDED DIE
- Publication number 20230317621
- Publication date Oct 5, 2023
- Intel Corporation
- Bernd WAIDHAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20230154877
- Publication date May 18, 2023
- Industrial Technology Research Institute
- Yu-Ming Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIPSET AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230130460
- Publication date Apr 27, 2023
- Shanghai Biren Technology Co.,Ltd
- Shiqun GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE COMPOSITE WAFER AND MANUFACTURING METHOD THEREOF
- Publication number 20220384385
- Publication date Dec 1, 2022
- Hong Chuang Applied Technology Co., Ltd
- Yan-Kai ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20220367322
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20210175154
- Publication date Jun 10, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20200144160
- Publication date May 7, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200051902
- Publication date Feb 13, 2020
- InnoLux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ENCAPSULATION IN OXIDE BONDED WAFER STACK
- Publication number 20190221547
- Publication date Jul 18, 2019
- Raytheon Company
- John J. Drab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES FORMED USING METAL SILICIDE, AND METHODS...
- Publication number 20170018517
- Publication date Jan 19, 2017
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR D...
- Publication number 20150115458
- Publication date Apr 30, 2015
- INFINEON TECHNOLOGIES AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS
- Publication number 20140374903
- Publication date Dec 25, 2014
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the material being a metal or a metalloid

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method of manufacture

Semiconductor device and method of manufacture

Package structure and manufacturing method thereof

Semiconductor device and method of manufacture

Die encapsulation in oxide bonded wafer stack

Thermosonically bonded connection for flip chip packages

Method of liquid assisted micro cold binding

Stacked CMOS image sensor

Semiconductor device and method of manufacture

Semiconductor device

Die encapsulation in oxide bonded wafer stack

Strip-type substrate for producing chip card modules

Microelectronic assemblies formed using metal silicide, and methods...

Stacking arrangement for integration of multiple integrated circuits

Heterostructure comprising a carbon nanomembrane

Semiconductor device having insulating layers containing oxygen and...

Metal to metal bonding for stacked (3D) integrated circuits

Metal to metal bonding for stacked (3D) integrated circuits

Metal to metal bonding for stacked (3D) integrated circuits

Metal to metal bonding for stacked (3D) integrated circuits

Semiconductor device and method for manufacturing a semiconductor d...

Component built-in board and method of manufacturing the same, and...

Metal to metal bonding for stacked (3D) integrated circuits

Flattened substrate surface for substrate bonding

Multi-wafer pair anodic bonding apparatus and method

Method of sealing and contacting substrates using laser light and e...

Chip-on-wafer bonding method and bonding device, and structure comp...

Solderless die attach to a direct bonded aluminum substrate

Atomic level bonding for electronics packaging

Solderless die attach to a direct bonded aluminum substrate

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING

LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING SAME

CHIP-TO-CHIP STACKING BY USE OF NICKEL TIN METALLIZATION STACKS AND...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHO...

DIE ATTACH IN GLASS CORE PACKAGE THROUGH ORGANIC-TO-ORGANIC BONDING

TECHNOLOGIES FOR DIE RECYCLING FOR HIGH YIELD PACKAGING

HEAT DISSIPATION STRUCTURES FOR BONDED WAFERS

SEMICONDUCTOR DEVICE

3D System and Wafer Reconstitution with Mid-layer Interposer

CHIP STRUCTURE AND METHOD OF FABRICATING THE SAME

EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...

CONNECTOR AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE

CHIP PACKAGE INTEGRATION WITH HYBRID BONDING

Semiconductor Device and Method of Manufacture

HYBRID BONDING A DIE TO A SUBSTRATE WITH VIAS CONNECTING METAL PADS...

GLASS SUBSTRATE PACKAGE WITH HYBRID BONDED DIE

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

CHIPSET AND METHOD OF MANUFACTURING THE SAME

SILICON CARBIDE COMPOSITE WAFER AND MANUFACTURING METHOD THEREOF

Semiconductor Device and Method of Manufacture

Semiconductor Device and Method of Manufacture

Semiconductor Device and Method of Manufacture

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

DIE ENCAPSULATION IN OXIDE BONDED WAFER STACK

MICROELECTRONIC ASSEMBLIES FORMED USING METAL SILICIDE, AND METHODS...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR D...

METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS