with a principal constituent of the material being a non metallic, non metalloid inorganic material

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H01L2224/29386

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29386with a principal constituent of the material being a non metallic, non metalloid inorganic material

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Circuit board with bridge chiplets
- Patent number 12,238,872
- Issue date Feb 25, 2025
- Advanced Micro Devices, Inc.
- Robert N. McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed hybrid bonding structures and methods of forming the same
- Patent number 12,224,261
- Issue date Feb 11, 2025
- Intel Corporation
- Shawna Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using micro LED, and manufacturing method therefor
- Patent number 12,183,866
- Issue date Dec 31, 2024
- LG Electronics Inc.
- Hwanjoon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration and bonding of micro-devices into system substrate
- Patent number 12,014,999
- Issue date Jun 18, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including high thermal conductivity layer
- Patent number 11,948,851
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Sunjae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate
- Patent number 11,948,907
- Issue date Apr 2, 2024
- Nitto Denko Corporation
- Ryota Mita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package system and method
- Patent number 11,901,319
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display module and method of manufacturing the same
- Patent number 11,715,729
- Issue date Aug 1, 2023
- Samsung Electronics Co., Ltd.
- Yoonsuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device
- Patent number 11,594,662
- Issue date Feb 28, 2023
- Nichia Corporation
- Toshifumi Imura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip backside mechanical die grounding techniques
- Patent number 11,574,887
- Issue date Feb 7, 2023
- Texas Instruments Incorporated
- James Fred Salzman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED assembly with omnidirectional light field
- Patent number 11,543,081
- Issue date Jan 3, 2023
- Epistar Corporation
- Hong-Zhi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternative compositions for high temperature soldering applications
- Patent number 11,440,142
- Issue date Sep 13, 2022
- Ormet Circuits, Inc.
- Catherine A Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with bridge chiplets
- Patent number 11,277,922
- Issue date Mar 15, 2022
- Advanced Micro Devices, Inc.
- Robert N. McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed hybrid bonding structures and methods of forming the same
- Patent number 11,183,477
- Issue date Nov 23, 2021
- Intel Corporation
- Shawna Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device-bonded body, image pickup module, endoscope and method for m...
- Patent number 11,043,524
- Issue date Jun 22, 2021
- Olympus Corporation
- Takashi Nakayama
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 10,991,678
- Issue date Apr 27, 2021
- LG Chem, Ltd.
- Jung Hak Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package system and method
- Patent number 10,985,122
- Issue date Apr 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid sealing material for copper bump, and resin composition for...
- Patent number 10,941,280
- Issue date Mar 9, 2021
- Namics Corporation
- Tomoya Yamazawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Anisotropic conductive film with conductive particles forming repea...
- Patent number 10,854,571
- Issue date Dec 1, 2020
- Dexerials Corporation
- Yasushi Akutsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Integration and bonding of micro-devices into system substrate
- Patent number 10,818,622
- Issue date Oct 27, 2020
- VueReal Inc.
- Gholamreza Chaji
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Thermal interface material including crosslinker and multiple fillers
- Patent number 10,781,349
- Issue date Sep 22, 2020
- Honeywell International Inc.
- Liqiang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible and compliant thermal interface materials with ultrahigh t...
- Patent number 10,731,269
- Issue date Aug 4, 2020
- The Texas A&M University System
- Mustafa Akbulut
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Ag underlayer-attached metallic member, Ag underlayer-attached insu...
- Patent number 10,734,297
- Issue date Aug 4, 2020
- Mitsubishi Materials Corporation
- Shuji Nishimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curing a heat-curable material in an embedded curing zone
- Patent number 10,717,236
- Issue date Jul 21, 2020
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Jeroen van den Brand
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 10,707,187
- Issue date Jul 7, 2020
- LG Chem, Ltd.
- Jung Hak Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Engineered polymer-based electronic materials
- Patent number 10,682,732
- Issue date Jun 16, 2020
- Alpha Assembly Solutions Inc.
- Ramakrishna Hosur Venkatagiriyappa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal bonding sheet and thermal bonding sheet with dicing tape
- Patent number 10,685,933
- Issue date Jun 16, 2020
- Nitto Denko Corporation
- Yuki Sugo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Circuit module and manufacturing method thereof
- Patent number 10,679,916
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal bonding sheet and thermal bonding sheet with dicing tape
- Patent number 10,669,452
- Issue date Jun 2, 2020
- Nitto Denko Corporation
- Yuki Sugo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,636,762
- Issue date Apr 28, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takatoshi Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTORS, DICING DIE BONDING FILM, AND METH...
- Publication number 20250226347
- Publication date Jul 10, 2025
- Resonac Corporation
- Takaaki NIWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTORS, DICING/DIE-BONDING FILM, AND METH...
- Publication number 20250226348
- Publication date Jul 10, 2025
- Resonac Corporation
- Takahiro KURODA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20250210440
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Minjung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTERPOSER CHIP
- Publication number 20250210610
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH LID AND METHOD FOR FORMING THE SAME
- Publication number 20250201652
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Min Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HEAT-SPREADING LID
- Publication number 20250201668
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING A REDISTRIBUTION LAYER (RDL) STRUCTURE...
- Publication number 20250149524
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chun-Sheng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL MATERIAL, SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING...
- Publication number 20250140732
- Publication date May 1, 2025
- Resonac Corporation
- Tomoya MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE
- Publication number 20250140670
- Publication date May 1, 2025
- HYPERTAC S.P.A.
- Alessandro Bosca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132214
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-CAVITY EPOXY PLACEMENT FOR PACKAGE RELIABILITY
- Publication number 20250112198
- Publication date Apr 3, 2025
- Intel Corporation
- Pratyasha Mohapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURI...
- Publication number 20250096183
- Publication date Mar 20, 2025
- Renesas Electronics America Inc.
- Martin Ashley VAGUES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURABLE COMPOSITION, CURED PRODUCT FORMED FROM THE SAME AND USE OF...
- Publication number 20250084274
- Publication date Mar 13, 2025
- Daxin Materials Corp.
- Yun-Ching WU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR PACKAGE COMPRISING DAM AND MULTI-LAYERED UNDER-FILL L...
- Publication number 20250070072
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Seongyo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Dissipating Structure and Methods of Forming The Same
- Publication number 20250046667
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
- Publication number 20240297133
- Publication date Sep 5, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HIGH THERMAL CONDUCTIVITY LAYER
- Publication number 20240222217
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Sunjae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Semiconductor Package w...
- Publication number 20240194629
- Publication date Jun 13, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Forming the Same
- Publication number 20240186275
- Publication date Jun 6, 2024
- Chao-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240162181
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Sun Jae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SYSTEM AND METHOD
- Publication number 20240153896
- Publication date May 9, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240145417
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Hyeongwoo JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY-CONDUCTIVE SHEET AND ELECTRONIC DEVICE
- Publication number 20240120254
- Publication date Apr 11, 2024
- DEXERIALS CORPORATION
- Keisuke ARAMAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PERFORMANCE FOR RADIO FREQUENCY (RF) CHIP PACKAGES
- Publication number 20240079371
- Publication date Mar 7, 2024
- GLOBALFOUNDRIES U.S. Inc.
- John C. MALINOWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID ALLOY THERMAL PASTE AND FABRICATION METHOD THEREOF
- Publication number 20240067855
- Publication date Feb 29, 2024
- COOLER MATERIALS TECHNOLOGY INC.
- Po-Wen CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CO-PACKAGE FOR QUBITS AND PARAMETRIC JOSEPHSON DEVICES
- Publication number 20240038723
- Publication date Feb 1, 2024
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE SEALANT FOR CHIP PACKAGING AND PACKAGING STRUCTURE
- Publication number 20240030075
- Publication date Jan 25, 2024
- Wuhan Choice Technology Co,Ltd
- De WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE WITH COAXIAL PILLARS FOR HIGH-SPEED INTERCON...
- Publication number 20230420412
- Publication date Dec 28, 2023
- Intel Corporation
- Hiroki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP PACKAGE INCLUDING A CRACK-RESISTANT LID STRUCTURE A...
- Publication number 20230386945
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH UNDERFILL FLOW CONTROL
- Publication number 20230378124
- Publication date Nov 23, 2023
- Intel Corporation
- Frederick Atadana
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the material being a non metallic, non metalloid inorganic material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit board with bridge chiplets

Mixed hybrid bonding structures and methods of forming the same

Display device using micro LED, and manufacturing method therefor

Integration and bonding of micro-devices into system substrate

Semiconductor package including high thermal conductivity layer

Laminate

Semiconductor package system and method

Display module and method of manufacturing the same

Light-emitting device

Flip chip backside mechanical die grounding techniques

LED assembly with omnidirectional light field

Alternative compositions for high temperature soldering applications

Circuit board with bridge chiplets

Mixed hybrid bonding structures and methods of forming the same

Device-bonded body, image pickup module, endoscope and method for m...

Semiconductor device and method for manufacturing semiconductor device

Semiconductor package system and method

Liquid sealing material for copper bump, and resin composition for...

Anisotropic conductive film with conductive particles forming repea...

Integration and bonding of micro-devices into system substrate

Thermal interface material including crosslinker and multiple fillers

Flexible and compliant thermal interface materials with ultrahigh t...

Ag underlayer-attached metallic member, Ag underlayer-attached insu...

Curing a heat-curable material in an embedded curing zone

Semiconductor device and method for manufacturing semiconductor device

Engineered polymer-based electronic materials

Thermal bonding sheet and thermal bonding sheet with dicing tape

Circuit module and manufacturing method thereof

Thermal bonding sheet and thermal bonding sheet with dicing tape

Method of manufacturing semiconductor device

Patents Applicationslast 30 patents

ADHESIVE FILM FOR SEMICONDUCTORS, DICING DIE BONDING FILM, AND METH...

ADHESIVE FILM FOR SEMICONDUCTORS, DICING/DIE-BONDING FILM, AND METH...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME

STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTERPOSER CHIP

CHIP PACKAGE STRUCTURE WITH LID AND METHOD FOR FORMING THE SAME

STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HEAT-SPREADING LID

PACKAGE STRUCTURE INCLUDING A REDISTRIBUTION LAYER (RDL) STRUCTURE...

UNDERFILL MATERIAL, SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING...

OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

IN-CAVITY EPOXY PLACEMENT FOR PACKAGE RELIABILITY

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURI...

CURABLE COMPOSITION, CURED PRODUCT FORMED FROM THE SAME AND USE OF...

SEMICONDUCTOR PACKAGE COMPRISING DAM AND MULTI-LAYERED UNDER-FILL L...

Heat Dissipating Structure and Methods of Forming The Same

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

SEMICONDUCTOR PACKAGE INCLUDING HIGH THERMAL CONDUCTIVITY LAYER

Semiconductor Device and Method of Making a Semiconductor Package w...

Semiconductor Devices and Methods of Forming the Same

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE SYSTEM AND METHOD

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

THERMALLY-CONDUCTIVE SHEET AND ELECTRONIC DEVICE

THERMAL PERFORMANCE FOR RADIO FREQUENCY (RF) CHIP PACKAGES

LIQUID ALLOY THERMAL PASTE AND FABRICATION METHOD THEREOF

CO-PACKAGE FOR QUBITS AND PARAMETRIC JOSEPHSON DEVICES

DIE SEALANT FOR CHIP PACKAGING AND PACKAGING STRUCTURE

PACKAGING ARCHITECTURE WITH COAXIAL PILLARS FOR HIGH-SPEED INTERCON...

INTEGRATED CHIP PACKAGE INCLUDING A CRACK-RESISTANT LID STRUCTURE A...

MICROELECTRONIC ASSEMBLY WITH UNDERFILL FLOW CONTROL