with a principal constituent of the material being a non metallic, non metalloid inorganic material

Industry

CPC
H01L2224/29386

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29386with a principal constituent of the material being a non metallic, non metalloid inorganic material

Industries

Patents Grantslast 30 patents

Information Patent Grant
Integration and bonding of micro-devices into system substrate
- Patent number 12,014,999
- Issue date Jun 18, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including high thermal conductivity layer
- Patent number 11,948,851
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Sunjae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate
- Patent number 11,948,907
- Issue date Apr 2, 2024
- Nitto Denko Corporation
- Ryota Mita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package system and method
- Patent number 11,901,319
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display module and method of manufacturing the same
- Patent number 11,715,729
- Issue date Aug 1, 2023
- Samsung Electronics Co., Ltd.
- Yoonsuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device
- Patent number 11,594,662
- Issue date Feb 28, 2023
- Nichia Corporation
- Toshifumi Imura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip backside mechanical die grounding techniques
- Patent number 11,574,887
- Issue date Feb 7, 2023
- Texas Instruments Incorporated
- James Fred Salzman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED assembly with omnidirectional light field
- Patent number 11,543,081
- Issue date Jan 3, 2023
- Epistar Corporation
- Hong-Zhi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternative compositions for high temperature soldering applications
- Patent number 11,440,142
- Issue date Sep 13, 2022
- Ormet Circuits, Inc.
- Catherine A Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with bridge chiplets
- Patent number 11,277,922
- Issue date Mar 15, 2022
- Advanced Micro Devices, Inc.
- Robert N. McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed hybrid bonding structures and methods of forming the same
- Patent number 11,183,477
- Issue date Nov 23, 2021
- Intel Corporation
- Shawna Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device-bonded body, image pickup module, endoscope and method for m...
- Patent number 11,043,524
- Issue date Jun 22, 2021
- Olympus Corporation
- Takashi Nakayama
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 10,991,678
- Issue date Apr 27, 2021
- LG Chem, Ltd.
- Jung Hak Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package system and method
- Patent number 10,985,122
- Issue date Apr 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid sealing material for copper bump, and resin composition for...
- Patent number 10,941,280
- Issue date Mar 9, 2021
- Namics Corporation
- Tomoya Yamazawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Anisotropic conductive film with conductive particles forming repea...
- Patent number 10,854,571
- Issue date Dec 1, 2020
- Dexerials Corporation
- Yasushi Akutsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Integration and bonding of micro-devices into system substrate
- Patent number 10,818,622
- Issue date Oct 27, 2020
- VueReal Inc.
- Gholamreza Chaji
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Thermal interface material including crosslinker and multiple fillers
- Patent number 10,781,349
- Issue date Sep 22, 2020
- Honeywell International Inc.
- Liqiang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ag underlayer-attached metallic member, Ag underlayer-attached insu...
- Patent number 10,734,297
- Issue date Aug 4, 2020
- Mitsubishi Materials Corporation
- Shuji Nishimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible and compliant thermal interface materials with ultrahigh t...
- Patent number 10,731,269
- Issue date Aug 4, 2020
- The Texas A&M University System
- Mustafa Akbulut
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Curing a heat-curable material in an embedded curing zone
- Patent number 10,717,236
- Issue date Jul 21, 2020
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Jeroen van den Brand
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 10,707,187
- Issue date Jul 7, 2020
- LG Chem, Ltd.
- Jung Hak Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Engineered polymer-based electronic materials
- Patent number 10,682,732
- Issue date Jun 16, 2020
- Alpha Assembly Solutions Inc.
- Ramakrishna Hosur Venkatagiriyappa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal bonding sheet and thermal bonding sheet with dicing tape
- Patent number 10,685,933
- Issue date Jun 16, 2020
- Nitto Denko Corporation
- Yuki Sugo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Circuit module and manufacturing method thereof
- Patent number 10,679,916
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal bonding sheet and thermal bonding sheet with dicing tape
- Patent number 10,669,452
- Issue date Jun 2, 2020
- Nitto Denko Corporation
- Yuki Sugo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,636,762
- Issue date Apr 28, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takatoshi Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip backside mechanical die grounding techniques
- Patent number 10,600,753
- Issue date Mar 24, 2020
- Texas Instruments Incorporated
- James Fred Salzman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive sheet, production method for thermally conduct...
- Patent number 10,526,519
- Issue date Jan 7, 2020
- Dexerials Corporation
- Hiroki Kanaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging devices and methods for semiconductor devices
- Patent number 10,510,687
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
- Publication number 20240297133
- Publication date Sep 5, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HIGH THERMAL CONDUCTIVITY LAYER
- Publication number 20240222217
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Sunjae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Semiconductor Package w...
- Publication number 20240194629
- Publication date Jun 13, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Forming the Same
- Publication number 20240186275
- Publication date Jun 6, 2024
- Chao-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240162181
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Sun Jae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SYSTEM AND METHOD
- Publication number 20240153896
- Publication date May 9, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240145417
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Hyeongwoo JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY-CONDUCTIVE SHEET AND ELECTRONIC DEVICE
- Publication number 20240120254
- Publication date Apr 11, 2024
- DEXERIALS CORPORATION
- Keisuke ARAMAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PERFORMANCE FOR RADIO FREQUENCY (RF) CHIP PACKAGES
- Publication number 20240079371
- Publication date Mar 7, 2024
- GLOBALFOUNDRIES U.S. Inc.
- John C. MALINOWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID ALLOY THERMAL PASTE AND FABRICATION METHOD THEREOF
- Publication number 20240067855
- Publication date Feb 29, 2024
- COOLER MATERIALS TECHNOLOGY INC.
- Po-Wen CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CO-PACKAGE FOR QUBITS AND PARAMETRIC JOSEPHSON DEVICES
- Publication number 20240038723
- Publication date Feb 1, 2024
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE SEALANT FOR CHIP PACKAGING AND PACKAGING STRUCTURE
- Publication number 20240030075
- Publication date Jan 25, 2024
- Wuhan Choice Technology Co,Ltd
- De WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE WITH COAXIAL PILLARS FOR HIGH-SPEED INTERCON...
- Publication number 20230420412
- Publication date Dec 28, 2023
- Intel Corporation
- Hiroki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP PACKAGE INCLUDING A CRACK-RESISTANT LID STRUCTURE A...
- Publication number 20230386945
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH UNDERFILL FLOW CONTROL
- Publication number 20230378124
- Publication date Nov 23, 2023
- Intel Corporation
- Frederick Atadana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WINDOW BALL GRID ARRAY (WBGA) PACKAGE
- Publication number 20230361073
- Publication date Nov 9, 2023
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Forming the Same
- Publication number 20230307375
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
- Publication number 20230253350
- Publication date Aug 10, 2023
- VueReal Inc.
- GHOLAMREZA CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD OF FORMING THE...
- Publication number 20230154885
- Publication date May 18, 2023
- Samsung Electronics Co., LTD
- Jinyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20230146621
- Publication date May 11, 2023
- Samsung Electronics Co., Ltd.
- Jaekyung YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE SHEET AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230005872
- Publication date Jan 5, 2023
- Samsung Electronics Co., Ltd.
- Dongkwan Kim
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220406766
- Publication date Dec 22, 2022
- Samsung Electronics Co., Ltd.
- Choongbin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE USING MICRO LED, AND MANUFACTURING METHOD THEREFOR
- Publication number 20220367771
- Publication date Nov 17, 2022
- LG ELECTRONICS INC.
- Hwanjoon CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE
- Publication number 20220246510
- Publication date Aug 4, 2022
- HYPERTAC S.P.A.
- Alessandro Bosca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20220230989
- Publication date Jul 21, 2022
- Nitto Denko Corporation
- Mayu Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HIGH THERMAL CONDUCTIVITY LAYER
- Publication number 20220173008
- Publication date Jun 2, 2022
- Samsung Electronics Co., Ltd.
- Sunjae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE SHEET, METHOD FOR MANUFACTURING THE SAME, AND...
- Publication number 20220098462
- Publication date Mar 31, 2022
- DEXERIALS CORPORATION
- Marina TOBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED HYBRID BONDING STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20220020716
- Publication date Jan 20, 2022
- Intel Corporation
- Shawna Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE
- Publication number 20210407952
- Publication date Dec 30, 2021
- Nitto Denko Corporation
- Ryota Mita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package System and Method
- Publication number 20210242150
- Publication date Aug 5, 2021
- Taiwan Semiconductor Manfacturing Co., Ltd.
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the material being a non metallic, non metalloid inorganic material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integration and bonding of micro-devices into system substrate

Semiconductor package including high thermal conductivity layer

Laminate

Semiconductor package system and method

Display module and method of manufacturing the same

Light-emitting device

Flip chip backside mechanical die grounding techniques

LED assembly with omnidirectional light field

Alternative compositions for high temperature soldering applications

Circuit board with bridge chiplets

Mixed hybrid bonding structures and methods of forming the same

Device-bonded body, image pickup module, endoscope and method for m...

Semiconductor device and method for manufacturing semiconductor device

Semiconductor package system and method

Liquid sealing material for copper bump, and resin composition for...

Anisotropic conductive film with conductive particles forming repea...

Integration and bonding of micro-devices into system substrate

Thermal interface material including crosslinker and multiple fillers

Ag underlayer-attached metallic member, Ag underlayer-attached insu...

Flexible and compliant thermal interface materials with ultrahigh t...

Curing a heat-curable material in an embedded curing zone

Semiconductor device and method for manufacturing semiconductor device

Engineered polymer-based electronic materials

Thermal bonding sheet and thermal bonding sheet with dicing tape

Circuit module and manufacturing method thereof

Thermal bonding sheet and thermal bonding sheet with dicing tape

Method of manufacturing semiconductor device

Flip chip backside mechanical die grounding techniques

Thermally conductive sheet, production method for thermally conduct...

Packaging devices and methods for semiconductor devices

Patents Applicationslast 30 patents

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

SEMICONDUCTOR PACKAGE INCLUDING HIGH THERMAL CONDUCTIVITY LAYER

Semiconductor Device and Method of Making a Semiconductor Package w...

Semiconductor Devices and Methods of Forming the Same

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE SYSTEM AND METHOD

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

THERMALLY-CONDUCTIVE SHEET AND ELECTRONIC DEVICE

THERMAL PERFORMANCE FOR RADIO FREQUENCY (RF) CHIP PACKAGES

LIQUID ALLOY THERMAL PASTE AND FABRICATION METHOD THEREOF

CO-PACKAGE FOR QUBITS AND PARAMETRIC JOSEPHSON DEVICES

DIE SEALANT FOR CHIP PACKAGING AND PACKAGING STRUCTURE

PACKAGING ARCHITECTURE WITH COAXIAL PILLARS FOR HIGH-SPEED INTERCON...

INTEGRATED CHIP PACKAGE INCLUDING A CRACK-RESISTANT LID STRUCTURE A...

MICROELECTRONIC ASSEMBLY WITH UNDERFILL FLOW CONTROL

METHOD FOR MANUFACTURING WINDOW BALL GRID ARRAY (WBGA) PACKAGE

Semiconductor Package and Method of Forming the Same

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD OF FORMING THE...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

ADHESIVE SHEET AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

DISPLAY DEVICE USING MICRO LED, AND MANUFACTURING METHOD THEREFOR

OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE INCLUDING HIGH THERMAL CONDUCTIVITY LAYER

THERMALLY CONDUCTIVE SHEET, METHOD FOR MANUFACTURING THE SAME, AND...

MIXED HYBRID BONDING STRUCTURES AND METHODS OF FORMING THE SAME

LAMINATE

Semiconductor Package System and Method