with a principal constituent of the material being a non metallic, non metalloid inorganic material

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H01L2224/05686

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05686with a principal constituent of the material being a non metallic, non metalloid inorganic material

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Display device
- Patent number 12,159,882
- Issue date Dec 3, 2024
- KYOCERA Coporation
- Hiroaki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,142,587
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Jinho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for fabricating the same
- Patent number 12,125,838
- Issue date Oct 22, 2024
- Samsung Display Co., Ltd.
- Seung Geun Lee
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Bonded structures
- Patent number 12,100,684
- Issue date Sep 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Light-emitting window element and motor vehicle comprising a light-...
- Patent number 12,087,743
- Issue date Sep 10, 2024
- Osram Opto Semiconductors GmbH
- Andreas Dobner
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Display device and manufacturing method thereof
- Patent number 12,087,748
- Issue date Sep 10, 2024
- Samsung Display Co., Ltd.
- Jong Hwan Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 12,080,662
- Issue date Sep 3, 2024
- Samsung Display Co., Ltd.
- Eui Jeong Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,072,588
- Issue date Aug 27, 2024
- Samsung Display Co., Ltd.
- Yoo Jeong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation structure with increased thickness for metal pads
- Patent number 12,057,418
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Shu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures with integrated passive component
- Patent number 12,057,383
- Issue date Aug 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating paste-based conductive device and manufacturing method t...
- Patent number 12,009,334
- Issue date Jun 11, 2024
- Shenzhen Guangshe Zhaoming Technology Co., LTD
- Jianwei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure for front side illuminated image sensor
- Patent number 11,996,433
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Chun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,973,016
- Issue date Apr 30, 2024
- Infineon Technologies Austria AG
- Elvir Kahrimanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate, display panel and display device
- Patent number 11,942,443
- Issue date Mar 26, 2024
- HEFEI BOE DISPLAY TECHNOLOGY CO., LTD.
- Chunxu Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate and method for manufacturing the same, and display...
- Patent number 11,901,375
- Issue date Feb 13, 2024
- ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
- Yongbo Ju
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bonding alignment marks at bonding interface
- Patent number 11,876,049
- Issue date Jan 16, 2024
- Yangtze Memory Technologies Co., Ltd.
- Meng Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a metallization structure
- Patent number 11,876,041
- Issue date Jan 16, 2024
- Infineon Technologies Austria AG
- Oliver Blank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 11,830,838
- Issue date Nov 28, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,804,459
- Issue date Oct 31, 2023
- Samsung Electronics Co., Ltd.
- Jinho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for fabricating the same
- Patent number 11,784,177
- Issue date Oct 10, 2023
- Samsung Display Co., Ltd.
- Seung Geun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal pad modification
- Patent number 11,756,911
- Issue date Sep 12, 2023
- International Business Machines Corporation
- Krishna Tunga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 11,670,615
- Issue date Jun 6, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronic devices and apparatuses having a patterned surface...
- Patent number 11,640,948
- Issue date May 2, 2023
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures with integrated passive component
- Patent number 11,626,363
- Issue date Apr 11, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 11,569,123
- Issue date Jan 31, 2023
- Sony Corporation
- Yoshihisa Kagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit test method and structure thereof
- Patent number 11,532,524
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation structure with increased thickness for metal pads
- Patent number 11,532,579
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Shu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,387,172
- Issue date Jul 12, 2022
- Renesas Electronics Corporation
- Yoshinori Deguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 11,342,309
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure for front side illuminated image sensor
- Patent number 11,322,540
- Issue date May 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Chun Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
NITRIDE SEMICONDUCTOR MODULE
- Publication number 20240413235
- Publication date Dec 12, 2024
- Rohm Co., Ltd.
- Hirotaka Otake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE FOR A HYBRID WAFER BONDING, SEMICONDUCTOR DEVICE...
- Publication number 20240413109
- Publication date Dec 12, 2024
- SK HYNIX INC.
- Young Su YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240404969
- Publication date Dec 5, 2024
- SAMSUNG DISPLAY CO., LTD.
- EUI JEONG KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240393653
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsin LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structures with Compact Copper Conductive Features
- Publication number 20240387604
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Yu Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND TEST METHOD THEREOF
- Publication number 20240387297
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF INTEGRATED CHIPS PACKAGE WITH CAP...
- Publication number 20240379738
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240369888
- Publication date Nov 7, 2024
- SAMSUNG DISPLAY CO., LTD.
- YOO JEONG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION STRUCTURE WITH INCREASED THICKNESS FOR METAL PADS
- Publication number 20240363563
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Shu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ISOLATION WITH CONFORMAL COATING
- Publication number 20240363465
- Publication date Oct 31, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240290677
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Gyuseong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PAD CONTACT FEATURE AND METHOD THEREFOR
- Publication number 20240282726
- Publication date Aug 22, 2024
- NXP USA, Inc.
- Trent Uehling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING CAPACITORS THROUGH WAFER BONDING
- Publication number 20240276735
- Publication date Aug 15, 2024
- Kepler Computing Inc.
- Biswajeet Guha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240250039
- Publication date Jul 25, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240250038
- Publication date Jul 25, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SILICON-COATED COPPER, SILICON-COATED ANTI...
- Publication number 20240250049
- Publication date Jul 25, 2024
- Pusan National University Industry-University Cooperation Foundation
- Se Young JEONG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20240243085
- Publication date Jul 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240243028
- Publication date Jul 18, 2024
- Innolux Corporation
- Ming-Chih Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240178095
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR PREPARING CHIP PACKAGE STRUCTURE
- Publication number 20240178167
- Publication date May 30, 2024
- Huawei Technologies Co., Ltd
- Ran HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR PREPARING THE SAME
- Publication number 20240162174
- Publication date May 16, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240162402
- Publication date May 16, 2024
- AUO Corporation
- Chia-Hui Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH AIR GAP
- Publication number 20240162177
- Publication date May 16, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240155892
- Publication date May 9, 2024
- SAMSUNG DISPLAY CO., LTD.
- Junhyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240153915
- Publication date May 9, 2024
- SK HYNIX INC.
- Hee Sun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANARIZATION STRUCTURE FOR MIM TOPOGRAPHY
- Publication number 20240145377
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Liang-Shiuan Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240128147
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sey-Ping SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240128217
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED NANOPARTICLES FOR ON-DIE THERMAL ENHANCEMENT OF HYBRID BON...
- Publication number 20240071987
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Bang-Ning Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING DISPLAY PANEL
- Publication number 20240072027
- Publication date Feb 29, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jeong Won HAN
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the material being a non metallic, non metalloid inorganic material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device

Semiconductor device and method of fabricating the same

Display device and method for fabricating the same

Bonded structures

Light-emitting window element and motor vehicle comprising a light-...

Display device and manufacturing method thereof

Display device and method of manufacturing the same

Display device

Passivation structure with increased thickness for metal pads

Bonded structures with integrated passive component

Insulating paste-based conductive device and manufacturing method t...

Pad structure for front side illuminated image sensor

Semiconductor device

Array substrate, display panel and display device

Array substrate and method for manufacturing the same, and display...

Bonding alignment marks at bonding interface

Semiconductor device having a metallization structure

Conductive barrier direct hybrid bonding

Semiconductor device and method of fabricating the same

Display device and method for fabricating the same

Metal pad modification

Bonded structures

Microelectronic devices and apparatuses having a patterned surface...

Bonded structures with integrated passive component

Semiconductor device, fabrication method for a semiconductor device...

Integrated circuit test method and structure thereof

Passivation structure with increased thickness for metal pads

Semiconductor device and method for manufacturing the same

Semiconductor packages and methods of forming same

Pad structure for front side illuminated image sensor

Patents Applicationslast 30 patents

NITRIDE SEMICONDUCTOR MODULE

BONDING STRUCTURE FOR A HYBRID WAFER BONDING, SEMICONDUCTOR DEVICE...

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

Semiconductor Structures with Compact Copper Conductive Features

SEMICONDUCTOR STRUCTURE AND TEST METHOD THEREOF

STRUCTURE AND FORMATION METHOD OF INTEGRATED CHIPS PACKAGE WITH CAP...

DISPLAY DEVICE

PASSIVATION STRUCTURE WITH INCREASED THICKNESS FOR METAL PADS

DIE ISOLATION WITH CONFORMAL COATING

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH PAD CONTACT FEATURE AND METHOD THEREFOR

METHOD OF FORMING CAPACITORS THROUGH WAFER BONDING

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR MANUFACTURING SILICON-COATED COPPER, SILICON-COATED ANTI...

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE STRUCTURE AND METHOD FOR PREPARING CHIP PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR PREPARING THE SAME

DISPLAY DEVICE

SEMICONDUCTOR DEVICE WITH AIR GAP

DISPLAY DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

PLANARIZATION STRUCTURE FOR MIM TOPOGRAPHY

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

EMBEDDED NANOPARTICLES FOR ON-DIE THERMAL ENHANCEMENT OF HYBRID BON...

METHOD OF FABRICATING DISPLAY PANEL