with a principal constituent of the material being a non metallic, non metalloid inorganic material

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H01L2924/15786

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/15786with a principal constituent of the material being a non metallic, non metalloid inorganic material

Industries

Patents Grantslast 30 patents

Information Patent Grant
Graphite-laminated chip-on-film-type semiconductor package allowing...
- Patent number 11,437,556
- Issue date Sep 6, 2022
- Hag Mo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphite-laminated chip-on-film-type semiconductor package having i...
- Patent number 11,355,687
- Issue date Jun 7, 2022
- Hag Mo Kim
- G02 - OPTICS
Information Patent Grant
Package on package devices and methods of packaging semiconductor dies
- Patent number RE49045
- Issue date Apr 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
Information Patent Grant
Cavity wall structure for semiconductor packaging
- Patent number 11,139,233
- Issue date Oct 5, 2021
- UTAC HEADQUARTERS PTE. LTD.
- Hua Hong Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity wall structure for semiconductor packaging
- Patent number 10,707,161
- Issue date Jul 7, 2020
- UTAC HEADQUARTERS PTE. LTD.
- Hua Hong Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole electrode substrate
- Patent number 10,600,728
- Issue date Mar 24, 2020
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-hole electrode substrate
- Patent number 10,014,244
- Issue date Jul 3, 2018
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier assembly having a trench structure which separate...
- Patent number 9,623,527
- Issue date Apr 18, 2017
- Osram Opto Semiconductors GmbH
- Jürgen Dachs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally-enhanced provision of underfill to electronic devices usi...
- Patent number 9,583,366
- Issue date Feb 28, 2017
- ASM Technology Singapore Pte. Ltd.
- Qinglong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory module in a package
- Patent number 9,508,629
- Issue date Nov 29, 2016
- Invensas Corporation
- Belgacem Haba
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device with mechanical lock features between a semico...
- Patent number 9,425,161
- Issue date Aug 23, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Lakshminarayan Viswanathan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Memory module in a package
- Patent number 9,287,216
- Issue date Mar 15, 2016
- Invensas Corporation
- Belgacem Haba
- G11 - INFORMATION STORAGE
Information Patent Grant
Package on package devices and methods of packaging semiconductor dies
- Patent number 9,105,552
- Issue date Aug 11, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 8,866,309
- Issue date Oct 21, 2014
- Industrial Technology Research Institute
- Jing-Yao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory module in a package
- Patent number 8,823,165
- Issue date Sep 2, 2014
- Invensas Corporation
- Belgacem Haba
- G11 - INFORMATION STORAGE
Information Patent Grant
Radio-frequency packaging with reduced RF loss
- Patent number 8,773,866
- Issue date Jul 8, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jun-De Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deskewed multi-die packages
- Patent number 8,759,982
- Issue date Jun 24, 2014
- Tessera, Inc.
- Richard Dewitt Crisp
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory module in a package
- Patent number 8,513,817
- Issue date Aug 20, 2013
- Invensas Corporation
- Belgacem Haba
- G11 - INFORMATION STORAGE
Information Patent Grant
De-skewed multi-die packages
- Patent number 8,502,390
- Issue date Aug 6, 2013
- Tessera, Inc.
- Richard Dewitt Crisp
- G11 - INFORMATION STORAGE
Information Patent Grant
Process of manufacturing high frequency device packages
- Patent number 7,520,054
- Issue date Apr 21, 2009
- Bridgewave Communications, Inc.
- Eliezer Pasternak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High frequency device packages and methods
- Patent number 6,770,822
- Issue date Aug 3, 2004
- Bridgewave Communications, Inc.
- Eliezer Pasternak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20180277471
- Publication date Sep 27, 2018
- DAI NIPPON PRINTING CO., LTD.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20160329273
- Publication date Nov 10, 2016
- DAI NIPPON PRINTING CO., LTD.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER CLAD LAMINATE HAVING BARRIER STRUCTURE AND METHOD OF MANUFAC...
- Publication number 20150255423
- Publication date Sep 10, 2015
- LINGSEN PRECISION INDUSTRIES, LTD.
- Tzu-Chih LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY MODULE IN A PACKAGE
- Publication number 20140367866
- Publication date Dec 18, 2014
- Belgacem Haba
- G11 - INFORMATION STORAGE
Information Patent Application
COMPONENT CARRIER ASSEMBLY HAVING A TRENCH STRUCTURE WHICH SEPARATE...
- Publication number 20140145391
- Publication date May 29, 2014
- Osram Opto Semiconductors GmbH
- Jürgen Dachs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DESKEWED MULTI-DIE PACKAGES
- Publication number 20130307138
- Publication date Nov 21, 2013
- Tessera, Inc.
- Richard Dewitt Crisp
- G11 - INFORMATION STORAGE
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20130168798
- Publication date Jul 4, 2013
- Industrial Technology Research Institute
- Jing-Yao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package on Package Devices and Methods of Packaging Semiconductor Dies
- Publication number 20130105979
- Publication date May 2, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY MODULE IN A PACKAGE
- Publication number 20130015590
- Publication date Jan 17, 2013
- Invensas Corporation
- Belgacem Haba
- G11 - INFORMATION STORAGE
Information Patent Application
DE-SKEWED MULTI-DIE PACKAGES
- Publication number 20130015586
- Publication date Jan 17, 2013
- Tessera, Inc.
- Richard Dewitt Crisp
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY MODULE IN A PACKAGE
- Publication number 20130015591
- Publication date Jan 17, 2013
- Invensas Corporation
- Belgacem Haba
- G11 - INFORMATION STORAGE
Information Patent Application
Radio-Frequency Packaging with Reduced RF Loss
- Publication number 20120147578
- Publication date Jun 14, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jun-De Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High frequency device packages and methods
- Publication number 20030168250
- Publication date Sep 11, 2003
- BridgeWave Communications, Inc.
- Eliezer Pasternak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High frequency device packages and methods
- Publication number 20030159262
- Publication date Aug 28, 2003
- Eliezer Pasternak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

with a principal constituent of the material being a non metallic, non metalloid inorganic material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Graphite-laminated chip-on-film-type semiconductor package allowing...

Graphite-laminated chip-on-film-type semiconductor package having i...

Package on package devices and methods of packaging semiconductor dies

Cavity wall structure for semiconductor packaging

Cavity wall structure for semiconductor packaging

Through-hole electrode substrate

Through-hole electrode substrate

Component carrier assembly having a trench structure which separate...

Thermally-enhanced provision of underfill to electronic devices usi...

Memory module in a package

Semiconductor device with mechanical lock features between a semico...

Memory module in a package

Package on package devices and methods of packaging semiconductor dies

Chip package structure

Memory module in a package

Radio-frequency packaging with reduced RF loss

Deskewed multi-die packages

Memory module in a package

De-skewed multi-die packages

Process of manufacturing high frequency device packages

High frequency device packages and methods

Patents Applicationslast 30 patents

THROUGH-HOLE ELECTRODE SUBSTRATE

THROUGH-HOLE ELECTRODE SUBSTRATE

COPPER CLAD LAMINATE HAVING BARRIER STRUCTURE AND METHOD OF MANUFAC...

MEMORY MODULE IN A PACKAGE

COMPONENT CARRIER ASSEMBLY HAVING A TRENCH STRUCTURE WHICH SEPARATE...

DESKEWED MULTI-DIE PACKAGES

CHIP PACKAGE STRUCTURE

Package on Package Devices and Methods of Packaging Semiconductor Dies

MEMORY MODULE IN A PACKAGE

DE-SKEWED MULTI-DIE PACKAGES

MEMORY MODULE IN A PACKAGE

Radio-Frequency Packaging with Reduced RF Loss

High frequency device packages and methods

High frequency device packages and methods