with a principal constituent of the material being a polymer

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H01L2224/2919

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/2919with a principal constituent of the material being a polymer

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Flexible electronic structure
- Patent number 12,283,561
- Issue date Apr 22, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,278,218
- Issue date Apr 15, 2025
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with conductive adhesive that overflows for r...
- Patent number 12,278,206
- Issue date Apr 15, 2025
- Airoha Technology (HK) Limited
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package with 3D magnetic core inductor
- Patent number 12,272,637
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal structure for semiconductor device and method of forming th...
- Patent number 12,272,613
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low warpage high density trench capacitor
- Patent number 12,272,725
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jyun-Ying Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding method
- Patent number 12,266,623
- Issue date Apr 1, 2025
- SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD
- Yunzhi Ling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package unit and associated packaging method
- Patent number 12,266,583
- Issue date Apr 1, 2025
- Chengdu Monolithic Power Systems Co., Ltd.
- Yingjiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light detection device
- Patent number 12,255,214
- Issue date Mar 18, 2025
- Hamamatsu Photonics K.K.
- Nao Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 12,255,153
- Issue date Mar 18, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device arrangement with compressible adhesive
- Patent number 12,249,561
- Issue date Mar 11, 2025
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic device with film isolated power stack
- Patent number 12,243,809
- Issue date Mar 4, 2025
- Texas Instruments Incorporated
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuits including micropatterns and using partial curing to adhere...
- Patent number 12,237,292
- Issue date Feb 25, 2025
- 3M Innovative Properties Company
- Teresa M. Goeddel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible electronic structure including a support element
- Patent number 12,237,289
- Issue date Feb 25, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Brian Cobb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with bridge chiplets
- Patent number 12,238,872
- Issue date Feb 25, 2025
- Advanced Micro Devices, Inc.
- Robert N. McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical semiconductor package including horizontally stacked dies...
- Patent number 12,230,613
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 12,199,058
- Issue date Jan 14, 2025
- VueReal Inc.
- Gholamreza Chaji
- G01 - MEASURING TESTING
Information Patent Grant
Package structure
- Patent number 12,191,287
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,651
- Issue date Dec 31, 2024
- Amkor Technology Japan, Inc.
- Masao Hirobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluidic flow channel over active surface of a die
- Patent number 12,165,939
- Issue date Dec 10, 2024
- Illumina, Inc.
- Arvin Emadi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Light emitting diode and display apparatus having the same
- Patent number 12,159,861
- Issue date Dec 3, 2024
- SEOUL VIOSYS CO., LTD.
- Seong Kyu Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seamless interconnect thresholds using dielectric fluid channels
- Patent number 12,154,837
- Issue date Nov 26, 2024
- Sciperio, Inc.
- Jason Benoit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and the methods of manufacturing
- Patent number 12,142,597
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 12,136,602
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having lead frame with semiconductor die and...
- Patent number 12,125,771
- Issue date Oct 22, 2024
- NXP B.V.
- Chayathorn Saklang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Energy augmentation structures, energy emitters or energy collector...
- Patent number 12,121,746
- Issue date Oct 22, 2024
- Immunolight, LLC
- Frederic A Bourke
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Structure and method for transferring a micro semiconductor element...
- Patent number 12,106,995
- Issue date Oct 1, 2024
- Quanzhou San'an Semiconductor Technology Co., Ltd.
- Zheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a structure
- Patent number 12,107,069
- Issue date Oct 1, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Nohora-Lizeth Caicedo Panqueva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor die embedded between an e...
- Patent number 12,107,035
- Issue date Oct 1, 2024
- Amkor Technology Singapore Holdings Pte. Ltd.
- Jae Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 12,100,697
- Issue date Sep 24, 2024
- Advanced Semiconductor Engineering, Inc.
- Chang-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250132278
- Publication date Apr 24, 2025
- Advanced Semiconductor Engineering, Inc.
- Chih-Jing HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERSATILE DUAL-LAYER TEMPORARY WAFER BONDING FOR HARSH PROCESSING C...
- Publication number 20250132283
- Publication date Apr 24, 2025
- Brewer Science, Inc.
- Xin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20250132260
- Publication date Apr 24, 2025
- Ping-Jung Yang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
HYBRID STACKING OF SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSE...
- Publication number 20250132302
- Publication date Apr 24, 2025
- Micron Technology, Inc.
- Kwun-Han Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132214
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20250118697
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jui Shen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL ON A SURFACE OF A DIE IN A CAVITY
- Publication number 20250112202
- Publication date Apr 3, 2025
- Intel Corporation
- Abdallah BACHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ARRANGEMENT STRUCTURE AND METHOD OF MANUFACTUR...
- Publication number 20250112195
- Publication date Apr 3, 2025
- EPISTAR CORPORATION
- Wen-Chien WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE COMPOSITION CONTAINING PFAS-FREE POLYCYCLOOLEFINIC P...
- Publication number 20250110403
- Publication date Apr 3, 2025
- PROMERUS, LLC
- TAKANOBU MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE STRUCTURE WITH CLIP SUBSTRATE MEMBER
- Publication number 20250105200
- Publication date Mar 27, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seokbong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUIDIC FLOW CHANNEL OVER ACTIVE SURFACE OF A DIE
- Publication number 20250096050
- Publication date Mar 20, 2025
- Illumina, Inc.
- Arvin Emadi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING AN ADHESIVE COMPOSITION FOR OPTICAL IRRADIATIO...
- Publication number 20250092293
- Publication date Mar 20, 2025
- NISSAN CHEMICAL CORPORATION
- Hiroshi OGINO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DAM LAMINATE ISOLATION SUBSTRATE
- Publication number 20250096034
- Publication date Mar 20, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Chang-Yen KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID ENCAPSULATION RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
- Publication number 20250084232
- Publication date Mar 13, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Taisuke YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20250087619
- Publication date Mar 13, 2025
- AUO Corporation
- Yi-Shan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20250087549
- Publication date Mar 13, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Yu Jin JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR SHIELDING ELECTROMAGNETIC WAVE OF SEMICONDUCTOR PACKAGE
- Publication number 20250087597
- Publication date Mar 13, 2025
- JOINSET CO., LTD.
- Sun-Ki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250087618
- Publication date Mar 13, 2025
- Advanced Semiconductor Engineering, Inc.
- Shih-Chieh TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PACKAGE STRUCTURE
- Publication number 20250087648
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES FOR EFFICIENT HEAT DISSIPATION
- Publication number 20250079258
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Woochan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME
- Publication number 20250079414
- Publication date Mar 6, 2025
- Universal Global Technology (Kunshan) Co., Ltd.
- KUO-HSIEN LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGES AND RELATED METHODS
- Publication number 20250081647
- Publication date Mar 6, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Soon Wei WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE AND DISPLAY APPARATUS HAVING THE SAME
- Publication number 20250062295
- Publication date Feb 20, 2025
- Seoul Viosys Co., Ltd.
- Seong Kyu JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250062185
- Publication date Feb 20, 2025
- Siliconware Precision Industries Co., Ltd.
- Yi-Ling CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURABLE RESIN COMPOSITION, CURED FILM, MULTILAYERED OBJECT, IMAGING...
- Publication number 20250054895
- Publication date Feb 13, 2025
- Sekisui Chemical Co., Ltd
- Taro SHIOJIMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS
- Publication number 20250046745
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Young Lyong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250046758
- Publication date Feb 6, 2025
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Takashi OHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED WCSP WITH THERMAL PAD FOR EFFICIENT HEAT DISSIPATION
- Publication number 20250046668
- Publication date Feb 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Gail Edselle S. REYES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046747
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Junyun KWEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250038068
- Publication date Jan 30, 2025
- QingDing Precision Electronics (Huai’an) Co., Ltd.
- Hao WANG
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the material being a polymer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Flexible electronic structure

Semiconductor device

Semiconductor package with conductive adhesive that overflows for r...

Integrated fan-out package with 3D magnetic core inductor

Thermal structure for semiconductor device and method of forming th...

Low warpage high density trench capacitor

Substrate bonding method

Flip chip package unit and associated packaging method

Light detection device

Wire bond wires for interference shielding

Semiconductor device arrangement with compressible adhesive

Packaged electronic device with film isolated power stack

Circuits including micropatterns and using partial curing to adhere...

Flexible electronic structure including a support element

Circuit board with bridge chiplets

Vertical semiconductor package including horizontally stacked dies...

Selective micro device transfer to receiver substrate

Package structure

Semiconductor device

Fluidic flow channel over active surface of a die

Light emitting diode and display apparatus having the same

Seamless interconnect thresholds using dielectric fluid channels

Integrated fan-out package and the methods of manufacturing

Method of fabricating a semiconductor device

Semiconductor package having lead frame with semiconductor die and...

Energy augmentation structures, energy emitters or energy collector...

Structure and method for transferring a micro semiconductor element...

Method for manufacturing a structure

Semiconductor device with a semiconductor die embedded between an e...

Semiconductor package structure

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

VERSATILE DUAL-LAYER TEMPORARY WAFER BONDING FOR HARSH PROCESSING C...

CHIP PACKAGE

HYBRID STACKING OF SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSE...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHODS OF FORMING THE SAME

THERMAL INTERFACE MATERIAL ON A SURFACE OF A DIE IN A CAVITY

SEMICONDUCTOR DEVICE ARRANGEMENT STRUCTURE AND METHOD OF MANUFACTUR...

PHOTOSENSITIVE COMPOSITION CONTAINING PFAS-FREE POLYCYCLOOLEFINIC P...

POWER MODULE STRUCTURE WITH CLIP SUBSTRATE MEMBER

FLUIDIC FLOW CHANNEL OVER ACTIVE SURFACE OF A DIE

METHOD FOR PRODUCING AN ADHESIVE COMPOSITION FOR OPTICAL IRRADIATIO...

DAM LAMINATE ISOLATION SUBSTRATE

LIQUID ENCAPSULATION RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

DISPLAY DEVICE

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

APPARATUS FOR SHIELDING ELECTROMAGNETIC WAVE OF SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE

METHOD FOR FORMING PACKAGE STRUCTURE

PACKAGE STRUCTURES FOR EFFICIENT HEAT DISSIPATION

ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME

IMAGE SENSOR PACKAGES AND RELATED METHODS

LIGHT EMITTING DIODE AND DISPLAY APPARATUS HAVING THE SAME

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

CURABLE RESIN COMPOSITION, CURED FILM, MULTILAYERED OBJECT, IMAGING...

SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS

SEMICONDUCTOR DEVICE

ENCAPSULATED WCSP WITH THERMAL PAD FOR EFFICIENT HEAT DISSIPATION

SEMICONDUCTOR PACKAGE

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF