with a principal constituent of the material being a polymer

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H01L2224/2919

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/2919with a principal constituent of the material being a polymer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Hybrid integrated circuit packages
- Patent number 12,368,146
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) and electronic apparatus
- Patent number 12,362,265
- Issue date Jul 15, 2025
- Nuvoton Technology Corporation
- Uri Trichter
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Anisotropic conductive film with carbon-based conductive regions ha...
- Patent number 12,362,311
- Issue date Jul 15, 2025
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a conductive layer on an IC using non-lithogr...
- Patent number 12,347,800
- Issue date Jul 1, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Ken Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,341,105
- Issue date Jun 24, 2025
- Shinko Electric Industries Co., Ltd.
- Kenichi Koi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including package substrate with dummy via an...
- Patent number 12,334,451
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 12,322,705
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for UBM/RDL routing
- Patent number 12,322,727
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,308,350
- Issue date May 20, 2025
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Takeshi Imamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a packaged semiconductor device having enhanced w...
- Patent number 12,300,582
- Issue date May 13, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a bonded semiconductor structure
- Patent number 12,300,660
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,293,991
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition for semiconductor circuit connection, adhesive...
- Patent number 12,286,564
- Issue date Apr 29, 2025
- LG Chem, Ltd.
- Youngsam Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Flexible electronic structure
- Patent number 12,283,561
- Issue date Apr 22, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Brian Cobb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,278,218
- Issue date Apr 15, 2025
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Takeshi Imamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with conductive adhesive that overflows for r...
- Patent number 12,278,206
- Issue date Apr 15, 2025
- Airoha Technology (HK) Limited
- Chun-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package with 3D magnetic core inductor
- Patent number 12,272,637
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal structure for semiconductor device and method of forming th...
- Patent number 12,272,613
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low warpage high density trench capacitor
- Patent number 12,272,725
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jyun-Ying Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding method
- Patent number 12,266,623
- Issue date Apr 1, 2025
- SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD
- Yunzhi Ling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package unit and associated packaging method
- Patent number 12,266,583
- Issue date Apr 1, 2025
- Chengdu Monolithic Power Systems Co., Ltd.
- Yingjiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light detection device
- Patent number 12,255,214
- Issue date Mar 18, 2025
- Hamamatsu Photonics K.K.
- Nao Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 12,255,153
- Issue date Mar 18, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device arrangement with compressible adhesive
- Patent number 12,249,561
- Issue date Mar 11, 2025
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic device with film isolated power stack
- Patent number 12,243,809
- Issue date Mar 4, 2025
- Texas Instruments Incorporated
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuits including micropatterns and using partial curing to adhere...
- Patent number 12,237,292
- Issue date Feb 25, 2025
- 3M Innovative Properties Company
- Teresa M. Goeddel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible electronic structure including a support element
- Patent number 12,237,289
- Issue date Feb 25, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Brian Cobb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with bridge chiplets
- Patent number 12,238,872
- Issue date Feb 25, 2025
- Advanced Micro Devices, Inc.
- Robert N. McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical semiconductor package including horizontally stacked dies...
- Patent number 12,230,613
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 12,199,058
- Issue date Jan 14, 2025
- VueReal Inc.
- Gholamreza Chaji
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
LOW WARPAGE HIGH DENSITY TRENCH CAPACITOR
- Publication number 20250240981
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Jyun-Ying LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250239561
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20250233115
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20250233083
- Publication date Jul 17, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Young Do KWEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PUMP-OUT RESISTANT COLDPLATE
- Publication number 20250210442
- Publication date Jun 26, 2025
- Microsoft Technology Licensing, LLC
- Kathryn OSEEN-SENDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH FILM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250210448
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Myoungchul Eum
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTORS, INTEGRATED DICING/DIE BONDING FIL...
- Publication number 20250210572
- Publication date Jun 26, 2025
- Resonac Corporation
- Yui KUNITO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH THERMAL RESERVOIR DIES AND METHODS...
- Publication number 20250210608
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Lipu Kris Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING USING A FLOATING PAD
- Publication number 20250201681
- Publication date Jun 19, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Hiroshi INOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Structure for Semiconductor Device and Method of Forming th...
- Publication number 20250201649
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH LID AND METHOD FOR FORMING THE SAME
- Publication number 20250201652
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Min Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH DOUBLE-SIDED THERMAL SOLUTION AND METHOD...
- Publication number 20250201651
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH SIDEWALL RECESSES
- Publication number 20250192090
- Publication date Jun 12, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Rennier RODRIGUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20250192095
- Publication date Jun 12, 2025
- TRON FUTURE TECH INC.
- KUAN-NENG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183103
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Hyunjung Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20250176105
- Publication date May 29, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...
- Publication number 20250167080
- Publication date May 22, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Integration of Passive Devices
- Publication number 20250167176
- Publication date May 22, 2025
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SEMICONDUCTOR PACKAGE INCLUDING HORIZONTALLY STACKED DIES...
- Publication number 20250157997
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL CHIP STACK PREPARING METHOD AND THREE-DIMENSIONAL...
- Publication number 20250157971
- Publication date May 15, 2025
- Institute of Semiconductors, Guangdong Academy of Sciences
- Chuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE PACKAGE WITH REDUCED THICKNESS
- Publication number 20250149493
- Publication date May 8, 2025
- Skyworks Solutions, Inc.
- Dae Keun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit with Enhanced Thermal Dissipation Structure
- Publication number 20250140639
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che Chi Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Fan-Out Package Structur...
- Publication number 20250140730
- Publication date May 1, 2025
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250140636
- Publication date May 1, 2025
- Amkor Technology Japan, Inc.
- Masao HIROBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILVER PASTE, AND PREPARATION METHOD AND USE THEREOF
- Publication number 20250140437
- Publication date May 1, 2025
- SOLDERWELL MICROELECTRONIC PACKAGING MATERIALS CO., LTD
- Yunhui Mei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250132278
- Publication date Apr 24, 2025
- Advanced Semiconductor Engineering, Inc.
- Chih-Jing HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERSATILE DUAL-LAYER TEMPORARY WAFER BONDING FOR HARSH PROCESSING C...
- Publication number 20250132283
- Publication date Apr 24, 2025
- Brewer Science, Inc.
- Xin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20250132260
- Publication date Apr 24, 2025
- Ping-Jung Yang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
HYBRID STACKING OF SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSE...
- Publication number 20250132302
- Publication date Apr 24, 2025
- Micron Technology, Inc.
- Kwun-Han Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132214
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the material being a polymer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Hybrid integrated circuit packages

Integrated circuit (IC) and electronic apparatus

Anisotropic conductive film with carbon-based conductive regions ha...

Method of fabricating a conductive layer on an IC using non-lithogr...

Semiconductor device

Semiconductor package including package substrate with dummy via an...

Chip package and manufacturing method thereof

Device and method for UBM/RDL routing

Semiconductor device

Method of forming a packaged semiconductor device having enhanced w...

Method of forming a bonded semiconductor structure

Semiconductor packages and methods of forming same

Adhesive composition for semiconductor circuit connection, adhesive...

Flexible electronic structure

Semiconductor device

Semiconductor package with conductive adhesive that overflows for r...

Integrated fan-out package with 3D magnetic core inductor

Thermal structure for semiconductor device and method of forming th...

Low warpage high density trench capacitor

Substrate bonding method

Flip chip package unit and associated packaging method

Light detection device

Wire bond wires for interference shielding

Semiconductor device arrangement with compressible adhesive

Packaged electronic device with film isolated power stack

Circuits including micropatterns and using partial curing to adhere...

Flexible electronic structure including a support element

Circuit board with bridge chiplets

Vertical semiconductor package including horizontally stacked dies...

Selective micro device transfer to receiver substrate

Patents Applicationslast 30 patents

LOW WARPAGE HIGH DENSITY TRENCH CAPACITOR

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

Semiconductor Packages and Methods of Forming Same

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

PUMP-OUT RESISTANT COLDPLATE

DIE ATTACH FILM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

ADHESIVE FILM FOR SEMICONDUCTORS, INTEGRATED DICING/DIE BONDING FIL...

INTEGRATED CIRCUIT PACKAGES WITH THERMAL RESERVOIR DIES AND METHODS...

WIRE BONDING USING A FLOATING PAD

Thermal Structure for Semiconductor Device and Method of Forming th...

CHIP PACKAGE STRUCTURE WITH LID AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE WITH DOUBLE-SIDED THERMAL SOLUTION AND METHOD...

SEMICONDUCTOR DEVICES WITH SIDEWALL RECESSES

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SELECTIVE TRANSFER OF MICRO DEVICES

METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...

Wafer Level Integration of Passive Devices

VERTICAL SEMICONDUCTOR PACKAGE INCLUDING HORIZONTALLY STACKED DIES...

THREE-DIMENSIONAL CHIP STACK PREPARING METHOD AND THREE-DIMENSIONAL...

INTEGRATED DEVICE PACKAGE WITH REDUCED THICKNESS

Integrated Circuit with Enhanced Thermal Dissipation Structure

Semiconductor Device and Method of Forming Fan-Out Package Structur...

SEMICONDUCTOR DEVICE

SILVER PASTE, AND PREPARATION METHOD AND USE THEREOF

ELECTRONIC DEVICE

VERSATILE DUAL-LAYER TEMPORARY WAFER BONDING FOR HARSH PROCESSING C...

CHIP PACKAGE

HYBRID STACKING OF SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSE...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF