with a principal constituent of the material being a polymer

Industry

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H01L2224/8149

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8149with a principal constituent of the material being a polymer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Chip package structure with nickel layer
- Patent number 12,125,715
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ching Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-speed RFID tag assembly using impulse heating
- Patent number 11,790,206
- Issue date Oct 17, 2023
- Impinj, Inc.
- Ronald Lee Koepp
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip package structure with conductive adhesive layer
- Patent number 11,728,180
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ching Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with conductive adhesive layer and method fo...
- Patent number 11,302,537
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Ching Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-speed RFID tag assembly using impulse heating
- Patent number 11,288,564
- Issue date Mar 29, 2022
- Impinj, Inc.
- Ronald Lee Koepp
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Substrate structure with selective surface finishes for flip chip a...
- Patent number 10,607,960
- Issue date Mar 31, 2020
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 10,366,949
- Issue date Jul 30, 2019
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate structure with selective surface finishes for flip chip a...
- Patent number 10,283,480
- Issue date May 7, 2019
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming flip chip systems
- Patent number 10,236,267
- Issue date Mar 19, 2019
- Kyocera International, Inc.
- Dinah Lieu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support member, wiring substrate, method for manufacturing wiring s...
- Patent number 9,997,441
- Issue date Jun 12, 2018
- Shinko Electric Industries Co., Ltd.
- Tomohiro Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 9,875,957
- Issue date Jan 23, 2018
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board
- Patent number 9,820,391
- Issue date Nov 14, 2017
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to provide die attach stress relief using gold stud bumps
- Patent number 9,754,914
- Issue date Sep 5, 2017
- Rosemount Aerospace Inc.
- Jim Golden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounted structure and manufacturing method of mounted structure
- Patent number 9,603,295
- Issue date Mar 21, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Atsushi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging method and chip package using hydrophobic surface
- Patent number 9,570,415
- Issue date Feb 14, 2017
- KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
- Hyo Hoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact smart card
- Patent number 9,524,459
- Issue date Dec 20, 2016
- Johnson Electric S.A.
- Vincent Daniel Jean Salle
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electrical connector
- Patent number 9,439,298
- Issue date Sep 6, 2016
- Lotes Co., Ltd.
- Ted Ju
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package carrier and manufacturing method thereof
- Patent number 9,236,364
- Issue date Jan 12, 2016
- Subtron Technology Co., Ltd.
- Shih-Hao Sun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module allowing fine tuning after assembly
- Patent number 9,155,198
- Issue date Oct 6, 2015
- EAGANTU LTD.
- Michael Dakhiya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 8,980,692
- Issue date Mar 17, 2015
- Fujitsu Semiconductor Limited
- Kenichi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon nanotube structures for enhancement of thermal dissipation f...
- Patent number 8,933,559
- Issue date Jan 13, 2015
- International Business Machines Corporation
- Veeraraghavan S. Basker
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device
- Patent number 8,664,775
- Issue date Mar 4, 2014
- Fujitsu Semiconductor Limited
- Kenichi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure, electronic device, and method for fabricating a structure
- Patent number 8,350,160
- Issue date Jan 8, 2013
- Kabushiki Kaisha Toshiba
- Tadashi Sakai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Carbon nanotube structures for enhancement of thermal dissipation f...
- Patent number 8,299,605
- Issue date Oct 30, 2012
- International Business Machines Corporation
- Veeraraghavan S Basker
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Wiring board and fabricating method thereof, semiconductor device a...
- Patent number 6,812,549
- Issue date Nov 2, 2004
- Seiko Epson Corporation
- Kazushige Umetsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and fabricating method thereof, semiconductor device a...
- Patent number 6,596,634
- Issue date Jul 22, 2003
- Seiko Epson Corporation
- Kazushige Umetsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240234364
- Publication date Jul 11, 2024
- LG Innotek Co., Ltd.
- Tae Sup CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240136322
- Publication date Apr 25, 2024
- LG Innotek Co., Ltd.
- Tae Sup CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH NICKEL LAYER
- Publication number 20230335411
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ching HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH CONDUCTIVE ADHESIVE LAYER
- Publication number 20220238352
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ching HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH CONDUCTIVE ADHESIVE LAYER AND METHOD FO...
- Publication number 20210313195
- Publication date Oct 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ching HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE WITH SELECTIVE SURFACE FINISHES FOR FLIP CHIP A...
- Publication number 20190229087
- Publication date Jul 25, 2019
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring Substrate and Semiconductor Device
- Publication number 20180166372
- Publication date Jun 14, 2018
- Shinko Electric Industries Co., Ltd.
- Noriyoshi SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING METHOD AND CHIP PACKAGE USING HYDROPHOBIC SURFACE
- Publication number 20150311177
- Publication date Oct 29, 2015
- Korea Advanced Institute of Science and Technology
- Hyo Hoon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE ALLOWING FINE TUNING AFTER ASSEMBLY
- Publication number 20140334120
- Publication date Nov 13, 2014
- Michael Dakhiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT SMART CARD
- Publication number 20140306016
- Publication date Oct 16, 2014
- JOHNSON ELECTRIC S.A.
- Vincent Daniel Jean SALLE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method for Bonding Semiconductor Devices
- Publication number 20140242777
- Publication date Aug 28, 2014
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20140187000
- Publication date Jul 3, 2014
- FUJITSU SEMICONDUCTOR LIMITED
- Kenichi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTED STRUCTURE AND MANUFACTURING METHOD OF MOUNTED STRUCTURE
- Publication number 20140049930
- Publication date Feb 20, 2014
- PANASONIC CORPORATION
- Atsushi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-SOLDER METHOD FOR SELF-ALIGNING SOLDER BUMPS IN SEMICONDUCTOR A...
- Publication number 20130228916
- Publication date Sep 5, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Kazuaki Mawatari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20130032942
- Publication date Feb 7, 2013
- FUJITSU SEMICONDUCTOR LIMITED
- Kenichi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON NANOTUBE STRUCTURES FOR ENHANCEMENT OF THERMAL DISSIPATION F...
- Publication number 20120168931
- Publication date Jul 5, 2012
- International Business Machines Corporation
- Veeraraghavan S. Basker
- B82 - NANO-TECHNOLOGY
Information Patent Application
STRUCTURE, ELECTRONIC DEVICE, AND METHOD FOR FABRICATING A STRUCTURE
- Publication number 20110147177
- Publication date Jun 23, 2011
- Kabushiki Kaisha Toshiba
- Tadashi Sakai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CARBON NANOTUBE STRUCTURES FOR ENHANCEMENT OF THERMAL DISSIPATION F...
- Publication number 20090121343
- Publication date May 14, 2009
- International Business Machines Corporation
- Veeraraghavan S. Basker
- B82 - NANO-TECHNOLOGY
Information Patent Application
Wiring board and fabricating method thereof, semiconductor device a...
- Publication number 20030060000
- Publication date Mar 27, 2003
- SEIKO EPSON CORPORATION
- Kazushige Umetsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring board and fabricating method thereof, semiconductor device a...
- Publication number 20020127839
- Publication date Sep 12, 2002
- SEIKO EPSON CORPORATION
- Kazushige Umetsu
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the material being a polymer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip package structure with nickel layer

High-speed RFID tag assembly using impulse heating

Chip package structure with conductive adhesive layer

Chip package structure with conductive adhesive layer and method fo...

High-speed RFID tag assembly using impulse heating

Substrate structure with selective surface finishes for flip chip a...

Wiring substrate and semiconductor device

Substrate structure with selective surface finishes for flip chip a...

Methods of forming flip chip systems

Support member, wiring substrate, method for manufacturing wiring s...

Wiring substrate and semiconductor device

Wiring board

Method to provide die attach stress relief using gold stud bumps

Mounted structure and manufacturing method of mounted structure

Chip packaging method and chip package using hydrophobic surface

Contact smart card

Electrical connector

Package carrier and manufacturing method thereof

Electronic module allowing fine tuning after assembly

Semiconductor device manufacturing method

Carbon nanotube structures for enhancement of thermal dissipation f...

Semiconductor device

Structure, electronic device, and method for fabricating a structure

Carbon nanotube structures for enhancement of thermal dissipation f...

Wiring board and fabricating method thereof, semiconductor device a...

Wiring board and fabricating method thereof, semiconductor device a...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR

CHIP PACKAGE STRUCTURE WITH NICKEL LAYER

CHIP PACKAGE STRUCTURE WITH CONDUCTIVE ADHESIVE LAYER

CHIP PACKAGE STRUCTURE WITH CONDUCTIVE ADHESIVE LAYER AND METHOD FO...

SUBSTRATE STRUCTURE WITH SELECTIVE SURFACE FINISHES FOR FLIP CHIP A...

Wiring Substrate and Semiconductor Device

CHIP PACKAGING METHOD AND CHIP PACKAGE USING HYDROPHOBIC SURFACE

ELECTRONIC MODULE ALLOWING FINE TUNING AFTER ASSEMBLY

CONTACT SMART CARD

Method for Bonding Semiconductor Devices

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

MOUNTED STRUCTURE AND MANUFACTURING METHOD OF MOUNTED STRUCTURE

TWO-SOLDER METHOD FOR SELF-ALIGNING SOLDER BUMPS IN SEMICONDUCTOR A...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

CARBON NANOTUBE STRUCTURES FOR ENHANCEMENT OF THERMAL DISSIPATION F...

STRUCTURE, ELECTRONIC DEVICE, AND METHOD FOR FABRICATING A STRUCTURE

CARBON NANOTUBE STRUCTURES FOR ENHANCEMENT OF THERMAL DISSIPATION F...

Wiring board and fabricating method thereof, semiconductor device a...

Wiring board and fabricating method thereof, semiconductor device a...