with a principal constituent of the material being a solid not provided for in groups H01L2224/291 - H01L2224/29191

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H01L2224/29193

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29193with a principal constituent of the material being a solid not provided for in groups H01L2224/291 - H01L2224/29191

Industries

Patents Grantslast 30 patents

Information Patent Grant
Thermal management device for high heat flux applications including...
- Patent number 12,080,627
- Issue date Sep 3, 2024
- University of Sharjah
- Essam Mohamed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration and bonding of micro-devices into system substrate
- Patent number 12,014,999
- Issue date Jun 18, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive member and display device including the same
- Patent number 12,015,007
- Issue date Jun 18, 2024
- Samsung Display Co., Ltd.
- Hong Am Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive member and display device including the same
- Patent number 11,545,461
- Issue date Jan 3, 2023
- Samsung Display Co., Ltd.
- Hong Am Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,488,886
- Issue date Nov 1, 2022
- Amkor Technology Japan, Inc.
- Masao Hirobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display substrate, manufacturing method thereo...
- Patent number 11,233,038
- Issue date Jan 25, 2022
- BOE Technology Group Co., Ltd.
- Xiang Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including magnetic hold-down layer
- Patent number 11,177,242
- Issue date Nov 16, 2021
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a metal silicide layer and methods...
- Patent number 11,063,014
- Issue date Jul 13, 2021
- Infineon Technologies AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film (ACF) with controllable distribution st...
- Patent number 10,957,668
- Issue date Mar 23, 2021
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Hui Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer thin film composite thermal interface materials
- Patent number 10,937,716
- Issue date Mar 2, 2021
- Arizona Board of Regents on behalf of Arizona State University
- Konrad Rykaczewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration and bonding of micro-devices into system substrate
- Patent number 10,818,622
- Issue date Oct 27, 2020
- VueReal Inc.
- Gholamreza Chaji
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Pnictide buffer structures and devices for GaN base applications
- Patent number 10,615,141
- Issue date Apr 7, 2020
- IQE plc
- Andrew Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding semiconductor elements and junction structure
- Patent number 10,608,136
- Issue date Mar 31, 2020
- National Institute of Advanced Industrial Science and Technology
- Hidenori Mizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Paste material, wiring member formed from the paste material, and e...
- Patent number 10,392,518
- Issue date Aug 27, 2019
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rare earth pnictides for strain management
- Patent number 10,332,857
- Issue date Jun 25, 2019
- IQE plc
- Andrew Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-adhesive die
- Patent number 10,312,212
- Issue date Jun 4, 2019
- Texas Instruments Incorporated
- Rongwei Zhang
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Bonded semiconductor wafer and method for manufacturing bonded semi...
- Patent number 10,283,401
- Issue date May 7, 2019
- Shin-Etsu Handotai Co., Ltd.
- Osamu Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical nanoribbon array (VERNA) thermal interface materials with...
- Patent number 10,170,338
- Issue date Jan 1, 2019
- Northrop Grumman Systems Corporation
- John A. Starkovich
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electronic device and method for manufacturing the same
- Patent number 10,115,696
- Issue date Oct 30, 2018
- Innolux Corporation
- Yan-Syun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical package including bimetal lid
- Patent number 10,090,257
- Issue date Oct 2, 2018
- International Business Machines Corporation
- Keiji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating diamond-semiconductor composite substrates
- Patent number 10,043,700
- Issue date Aug 7, 2018
- RFHIC CORPORATION
- Daniel Francis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical package including bimetal lid
- Patent number 10,032,727
- Issue date Jul 24, 2018
- International Business Machines Corporation
- Keiji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for performing direct bonding between two structures
- Patent number 9,922,954
- Issue date Mar 20, 2018
- Commisariat A l'Energie Atomique et Aux Energies Alternatives
- Hubert Moriceau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene based filler material of superior thermal conductivity for...
- Patent number 9,892,994
- Issue date Feb 13, 2018
- STMicroelectronics S.r.l.
- Mario Giovanni Scurati
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electronic devices with semiconductor die attached with sintered me...
- Patent number 9,875,987
- Issue date Jan 23, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin power transistor and synchronous buck converter having c...
- Patent number 9,779,967
- Issue date Oct 3, 2017
- Texas Instruments Incorporated
- Juan A Herbsommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic component with a pre-oriented molecule configuration...
- Patent number 9,722,159
- Issue date Aug 1, 2017
- Osram Opto Semiconductors GmbH
- Reinhard Streitel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphite-containing substrates for LED packages
- Patent number 9,634,214
- Issue date Apr 25, 2017
- LedEngin, Inc.
- Xiantao Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper nanorod-based thermal interface material (TIM)
- Patent number 9,601,406
- Issue date Mar 21, 2017
- Intel Corporation
- Chandra M. Jha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices with semiconductor die coupled to a thermally co...
- Patent number 9,589,860
- Issue date Mar 7, 2017
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMAL INTERFACE MATERIAL INCLUDING A MULTI-LAYER STRUCTURE AND ME...
- Publication number 20240371722
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Chien Pan
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
THERMAL MANAGEMENT SYSTEMS AND METHODS FOR SEMICONDUCTOR DEVICES
- Publication number 20240363473
- Publication date Oct 31, 2024
- Avago Technologies International Sales Pte. Limited
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240339383
- Publication date Oct 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Ko-Pu WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHITE SHEET AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240300819
- Publication date Sep 12, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Youji SHIRATO
- C01 - INORGANIC CHEMISTRY
Information Patent Application
THERMALLY ENHANCED PACKAGE WITH HIGH K MOLD COMPOUND ON DIE TOP
- Publication number 20240304517
- Publication date Sep 12, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Li Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
- Publication number 20240297133
- Publication date Sep 5, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT DEVICE FOR HIGH HEAT FLUX APPLICATIONS INCLUDING...
- Publication number 20240282669
- Publication date Aug 22, 2024
- University of Sharjah
- Essam MOHAMED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF INTERCONNECTING SEMICONDUCTOR DEVICES AND ASSEMBLY OF INT...
- Publication number 20240266320
- Publication date Aug 8, 2024
- Yibu Semiconductor Co., Ltd.
- Yifan Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLIES WITH THERMAL INTERFACE STRUCTURE
- Publication number 20240234243
- Publication date Jul 11, 2024
- Tesla, Inc.
- Aydin Nabovati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Forming the Same
- Publication number 20240186275
- Publication date Jun 6, 2024
- Chao-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FIXTURE AND METHODS OF MANUFACTURING
- Publication number 20240096732
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND ELECTRONIC DEVICE
- Publication number 20240071859
- Publication date Feb 29, 2024
- Huawei Technologies Co., Ltd
- Zelong Jiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CONFORMAL THERMAL HEAT SPREADER FOR MULTICHIP COMPOSITE...
- Publication number 20240063076
- Publication date Feb 22, 2024
- Intel Corporation
- Mohammad Enamul Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE ADHESIVE ASSEMBLY FOR SEMICONDUCTOR DIE ATTACHMENT
- Publication number 20240063165
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Ramesh NALLAVELLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240063074
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Structure for Semiconductor Device and Method of Forming th...
- Publication number 20240014091
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL, DISPLAY SCREEN, AND MANUFACTURING METHOD OF DISPLAY...
- Publication number 20230402440
- Publication date Dec 14, 2023
- Chuzhou HKC Optoelectronics Technology Co., Ltd.
- Guangjia WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE MEMBER AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20230100980
- Publication date Mar 30, 2023
- SAMSUNG DISPLAY CO., LTD.
- Hong Am KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE MEMBER AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20210407957
- Publication date Dec 30, 2021
- SAMSUNG DISPLAY CO., LTD.
- Hong Am KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING MAGNETIC HOLD-DOWN LAYER
- Publication number 20200411477
- Publication date Dec 31, 2020
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200035582
- Publication date Jan 30, 2020
- J-DEVICES CORPORATION
- Masao HIROBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices Including a Metal Silicide Layer and Methods...
- Publication number 20190355691
- Publication date Nov 21, 2019
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER THIN FILM COMPOSITE THERMAL INTERFACE MATERIALS
- Publication number 20190181069
- Publication date Jun 13, 2019
- Konrad Rykaczewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing electronic device
- Publication number 20190027458
- Publication date Jan 24, 2019
- InnoLux Corporation
- Yan-Syun WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL NANORIBBON ARRAY (VERNA) THERMAL INTERFACE MATERIALS WITH...
- Publication number 20180342405
- Publication date Nov 29, 2018
- Northrop Grumman Systems Corporation
- John A. Starkovich
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF FABRICATING DIAMOND-SEMICONDUCTOR COMPOSITE SUBSTRATES
- Publication number 20180151404
- Publication date May 31, 2018
- RFHIC Corporation
- Daniel FRANCIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING BONDED SEMI...
- Publication number 20180033681
- Publication date Feb 1, 2018
- Shin-Etsu Handotai Co., Ltd.
- Osamu ISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RARE EARTH INTERLAYS FOR MECHANICALLY LAYERING DISSIMILAR SEMICONDU...
- Publication number 20180012858
- Publication date Jan 11, 2018
- IQE, plc
- Andrew Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE THAT INCLUDES A MOLECULAR BONDING LAYER FOR BO...
- Publication number 20170294408
- Publication date Oct 12, 2017
- Kabushiki Kaisha Toshiba
- Akihiko HAPPOYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE THAT INCLUDES A MOLECULAR BONDING LAYER FOR BO...
- Publication number 20170294395
- Publication date Oct 12, 2017
- Kabushiki Kaisha Toshiba
- Akihiko HAPPOYA
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the material being a solid not provided for in groups H01L2224/291 - H01L2224/29191

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Thermal management device for high heat flux applications including...

Integration and bonding of micro-devices into system substrate

Adhesive member and display device including the same

Adhesive member and display device including the same

Semiconductor device

Light emitting diode display substrate, manufacturing method thereo...

Semiconductor device including magnetic hold-down layer

Semiconductor devices including a metal silicide layer and methods...

Anisotropic conductive film (ACF) with controllable distribution st...

Multi-layer thin film composite thermal interface materials

Integration and bonding of micro-devices into system substrate

Pnictide buffer structures and devices for GaN base applications

Method of bonding semiconductor elements and junction structure

Paste material, wiring member formed from the paste material, and e...

Rare earth pnictides for strain management

Self-adhesive die

Bonded semiconductor wafer and method for manufacturing bonded semi...

Vertical nanoribbon array (VERNA) thermal interface materials with...

Electronic device and method for manufacturing the same

Electrical package including bimetal lid

Method of fabricating diamond-semiconductor composite substrates

Electrical package including bimetal lid

Method for performing direct bonding between two structures

Graphene based filler material of superior thermal conductivity for...

Electronic devices with semiconductor die attached with sintered me...

Ultra-thin power transistor and synchronous buck converter having c...

Optoelectronic component with a pre-oriented molecule configuration...

Graphite-containing substrates for LED packages

Copper nanorod-based thermal interface material (TIM)

Electronic devices with semiconductor die coupled to a thermally co...

Patents Applicationslast 30 patents

THERMAL INTERFACE MATERIAL INCLUDING A MULTI-LAYER STRUCTURE AND ME...

THERMAL MANAGEMENT SYSTEMS AND METHODS FOR SEMICONDUCTOR DEVICES

ELECTRONIC DEVICE

GRAPHITE SHEET AND METHOD FOR MANUFACTURING THE SAME

THERMALLY ENHANCED PACKAGE WITH HIGH K MOLD COMPOUND ON DIE TOP

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

THERMAL MANAGEMENT DEVICE FOR HIGH HEAT FLUX APPLICATIONS INCLUDING...

METHOD OF INTERCONNECTING SEMICONDUCTOR DEVICES AND ASSEMBLY OF INT...

ELECTRONIC ASSEMBLIES WITH THERMAL INTERFACE STRUCTURE

Semiconductor Devices and Methods of Forming the Same

SEMICONDUCTOR PACKAGE FIXTURE AND METHODS OF MANUFACTURING

CHIP PACKAGE STRUCTURE AND ELECTRONIC DEVICE

INTEGRATED CONFORMAL THERMAL HEAT SPREADER FOR MULTICHIP COMPOSITE...

CONDUCTIVE ADHESIVE ASSEMBLY FOR SEMICONDUCTOR DIE ATTACHMENT

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF

Thermal Structure for Semiconductor Device and Method of Forming th...

DISPLAY PANEL, DISPLAY SCREEN, AND MANUFACTURING METHOD OF DISPLAY...

ADHESIVE MEMBER AND DISPLAY DEVICE INCLUDING THE SAME

ADHESIVE MEMBER AND DISPLAY DEVICE INCLUDING THE SAME

SEMICONDUCTOR DEVICE INCLUDING MAGNETIC HOLD-DOWN LAYER

SEMICONDUCTOR DEVICE

Semiconductor Devices Including a Metal Silicide Layer and Methods...

MULTI-LAYER THIN FILM COMPOSITE THERMAL INTERFACE MATERIALS

Method for manufacturing electronic device

VERTICAL NANORIBBON ARRAY (VERNA) THERMAL INTERFACE MATERIALS WITH...

METHOD OF FABRICATING DIAMOND-SEMICONDUCTOR COMPOSITE SUBSTRATES

BONDED SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING BONDED SEMI...

RARE EARTH INTERLAYS FOR MECHANICALLY LAYERING DISSIMILAR SEMICONDU...

SEMICONDUCTOR DEVICE THAT INCLUDES A MOLECULAR BONDING LAYER FOR BO...

SEMICONDUCTOR DEVICE THAT INCLUDES A MOLECULAR BONDING LAYER FOR BO...