with a rectangular active surface

Industry

CPC
H01L2924/10161

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/10161with a rectangular active surface

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of producing a multi-chip assembly
- Patent number 12,191,296
- Issue date Jan 7, 2025
- Infineon Technologies AG
- Ling Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,057,362
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,562,935
- Issue date Jan 24, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and die
- Patent number 11,244,891
- Issue date Feb 8, 2022
- Novatek Microelectronics Corp.
- Jhih-Siou Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity wall structure for semiconductor packaging
- Patent number 11,139,233
- Issue date Oct 5, 2021
- UTAC HEADQUARTERS PTE. LTD.
- Hua Hong Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip modules including stacked semiconductor dice
- Patent number 11,101,245
- Issue date Aug 24, 2021
- Micron Technology, Inc.
- Eric Tan Swee Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,069,591
- Issue date Jul 20, 2021
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,049,843
- Issue date Jun 29, 2021
- Semiconductor Components Industries, LLC
- Phillip Celaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity wall structure for semiconductor packaging
- Patent number 10,707,161
- Issue date Jul 7, 2020
- UTAC HEADQUARTERS PTE. LTD.
- Hua Hong Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chips and semiconductor packages including the same
- Patent number 10,622,312
- Issue date Apr 14, 2020
- Samsung Electronics Co., Ltd.
- Myoung-soo Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 10,461,053
- Issue date Oct 29, 2019
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 10,431,516
- Issue date Oct 1, 2019
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package for assembling various dice in a single...
- Patent number 10,410,996
- Issue date Sep 10, 2019
- Dialog Semiconductor (UK) Limited
- Melvin Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Paste material, wiring member formed from the paste material, and e...
- Patent number 10,392,518
- Issue date Aug 27, 2019
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package for assembling various dice in a single...
- Patent number 10,332,864
- Issue date Jun 25, 2019
- Dialog Semiconductor (UK) Limited
- Melvin Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module and electronic device
- Patent number 10,313,567
- Issue date Jun 4, 2019
- Sony Corporation
- Toshihide Ueno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with leadframes and related methods
- Patent number 10,304,798
- Issue date May 28, 2019
- Semiconductor Components Industries, LLC
- Phillip Celaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 10,276,552
- Issue date Apr 30, 2019
- ABB Schweiz AG
- Samuel Hartmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,157,974
- Issue date Dec 18, 2018
- Renesas Electronics Corporation
- Takuo Funaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounted substrate, mounted-substrate production method, and mounted...
- Patent number 10,136,570
- Issue date Nov 20, 2018
- Sharp Kabushiki Kaisha
- Katsuhiro Yamaguchi
- G02 - OPTICS
Information Patent Grant
Stackable molded microelectronic packages
- Patent number 10,128,216
- Issue date Nov 13, 2018
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor chip package assembly and electronic device having sensor ch...
- Patent number 10,121,750
- Issue date Nov 6, 2018
- Shenzhen Goodix Technology Co., Ltd.
- Yuping Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI/RFI shielding for semiconductor device packages
- Patent number 10,074,614
- Issue date Sep 11, 2018
- NXP USA, INC.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Floating bond pad for power semiconductor devices
- Patent number 10,068,834
- Issue date Sep 4, 2018
- Cree, Inc.
- Sarah Kay Haney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component support and semiconductor device
- Patent number 10,068,821
- Issue date Sep 4, 2018
- Nichia Corporation
- Takeaki Shirase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device with interior polygonal pads
- Patent number 10,056,343
- Issue date Aug 21, 2018
- Nexperia B.V.
- Roelf A. J. Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,032,736
- Issue date Jul 24, 2018
- Renesas Electronics Corporation
- Yoshinao Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,991,195
- Issue date Jun 5, 2018
- Renesas Electronics Corporation
- Hiromitsu Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical-device adhesive barrier
- Patent number 9,978,707
- Issue date May 22, 2018
- Delphi Technologies, Inc.
- David W. Zimmerman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 9,972,555
- Issue date May 15, 2018
- Renesas Electronics Corporation
- Soshi Kuroda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240321813
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Syotaro Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240234271
- Publication date Jul 11, 2024
- Mitsubishi Electric Corporation
- Norikazu SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLED POWER MODULE
- Publication number 20240234239
- Publication date Jul 11, 2024
- GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Muhammad Hussain Alvi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20240088093
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230411272
- Publication date Dec 21, 2023
- Innolux Corporation
- Cheng-Chi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230197553
- Publication date Jun 22, 2023
- Samsung Electronics Co., Ltd.
- KYUNGDON MUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND DIE
- Publication number 20220028775
- Publication date Jan 27, 2022
- NOVATEK MICROELECTRONICS CORP.
- Jhih-Siou Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210313245
- Publication date Oct 7, 2021
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190393116
- Publication date Dec 26, 2019
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20190139842
- Publication date May 9, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIEN-WEI CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190027455
- Publication date Jan 24, 2019
- RENESAS ELECTRONICS CORPORATION
- SHINYA SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF
- Publication number 20190019775
- Publication date Jan 17, 2019
- Toshiba Memory Corporation
- Takuma KAWAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package For Assembling Various Dice In A Single...
- Publication number 20180158804
- Publication date Jun 7, 2018
- Dialog Semiconductor (UK) Limited
- Melvin Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20180138144
- Publication date May 17, 2018
- Semiconductor Components Industries, LLC
- Phillip CELAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING LOW ON RESISTANCE
- Publication number 20180090463
- Publication date Mar 29, 2018
- RENESAS ELECTRONICS CORPORATION
- Yukihiro SATOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180069073
- Publication date Mar 8, 2018
- RENESAS ELECTRONICS CORPORATION
- Takuo Funaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20180033709
- Publication date Feb 1, 2018
- RENESAS ELECTRONICS CORPORATION
- Soshi KURODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA MODULE AND ELECTRONIC DEVICE
- Publication number 20170359493
- Publication date Dec 14, 2017
- SONY CORPORATION
- Toshihide Ueno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF
- Publication number 20170278819
- Publication date Sep 28, 2017
- Kabushiki Kaisha Toshiba
- Takuma KAWAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170243847
- Publication date Aug 24, 2017
- RENESAS ELECTRONICS CORPORATION
- SHINYA SUZUKI
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20170162463
- Publication date Jun 8, 2017
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE EMBEDDED WITH PLURALITY OF CHIPS AND METHOD O...
- Publication number 20170062384
- Publication date Mar 2, 2017
- SK HYNIX INC.
- Sang Eun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160233202
- Publication date Aug 11, 2016
- MITSUBISHI ELECTRIC CORPORATION
- Hideo KOMO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20160141272
- Publication date May 19, 2016
- Susumu Inakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20160079207
- Publication date Mar 17, 2016
- PS4 Luxco S.a.r..L.
- Masahiro Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160027714
- Publication date Jan 28, 2016
- Toyota Jidosha Kabushiki Kaisha
- Norimune ORIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20150380378
- Publication date Dec 31, 2015
- RENESAS ELECTRONICS CORPORATION
- Yukihiro SATOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20150311165
- Publication date Oct 29, 2015
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20150091169
- Publication date Apr 2, 2015
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140332866
- Publication date Nov 13, 2014
- Yukihiro SATOU
- H01 - BASIC ELECTRIC ELEMENTS

with a rectangular active surface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of producing a multi-chip assembly

Semiconductor device and method for manufacturing semiconductor device

Semiconductor structure

Integrated circuit package and die

Cavity wall structure for semiconductor packaging

Multi-chip modules including stacked semiconductor dice

Semiconductor device and method for manufacturing semiconductor device

Semiconductor packages

Cavity wall structure for semiconductor packaging

Semiconductor chips and semiconductor packages including the same

Semiconductor device

Semiconductor device and method for manufacturing semiconductor device

Integrated circuit package for assembling various dice in a single...

Paste material, wiring member formed from the paste material, and e...

Integrated circuit package for assembling various dice in a single...

Camera module and electronic device

Semiconductor packages with leadframes and related methods

Semiconductor module

Semiconductor device and method of manufacturing the same

Mounted substrate, mounted-substrate production method, and mounted...

Stackable molded microelectronic packages

Sensor chip package assembly and electronic device having sensor ch...

EMI/RFI shielding for semiconductor device packages

Floating bond pad for power semiconductor devices

Semiconductor component support and semiconductor device

Packaged semiconductor device with interior polygonal pads

Semiconductor device

Semiconductor device

Electrical-device adhesive barrier

Semiconductor device and method of manufacturing same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

COOLED POWER MODULE

Integrated Circuit Packages and Methods of Forming the Same

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT PACKAGE AND DIE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF

Integrated Circuit Package For Assembling Various Dice In A Single...

SEMICONDUCTOR PACKAGES AND RELATED METHODS

SEMICONDUCTOR DEVICE HAVING LOW ON RESISTANCE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

CAMERA MODULE AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE EMBEDDED WITH PLURALITY OF CHIPS AND METHOD O...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE

Semiconductor Device

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE