-
Electronic component
-
Patent number 11,961,653
-
Issue date Apr 16, 2024
-
Murata Manufacturing Co., Ltd.
-
Yuta Shimoda
-
H01 - BASIC ELECTRIC ELEMENTS
-
Inductor device
-
Patent number 11,942,258
-
Issue date Mar 26, 2024
-
Realtek Semiconductor Corporation
-
Hsiao-Tsung Yen
-
H01 - BASIC ELECTRIC ELEMENTS
-
Inductor device
-
Patent number 11,915,848
-
Issue date Feb 27, 2024
-
Realtek Semiconductor Corporation
-
Hsiao-Tsung Yen
-
H01 - BASIC ELECTRIC ELEMENTS
-
Broadband induction
-
Patent number 11,908,617
-
Issue date Feb 20, 2024
-
3D GLASS SOLUTIONS, INC.
-
Jeb H. Flemming
-
H01 - BASIC ELECTRIC ELEMENTS
-
Switching power supply device
-
Patent number 11,909,310
-
Issue date Feb 20, 2024
-
Murata Manufacturing Co., Ltd.
-
Tatsuya Hosotani
-
H01 - BASIC ELECTRIC ELEMENTS
-
Coil component
-
Patent number 11,842,844
-
Issue date Dec 12, 2023
-
TDK Corporation
-
Junichiro Urabe
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
Inductor
-
Patent number 11,728,084
-
Issue date Aug 15, 2023
-
Murata Manufacturing Co., Ltd.
-
Yasunari Nakashima
-
H01 - BASIC ELECTRIC ELEMENTS
-
Inductor structure
-
Patent number 11,699,550
-
Issue date Jul 11, 2023
-
Realtek Semiconductor Corporation
-
Hsiao-Tsung Yen
-
H01 - BASIC ELECTRIC ELEMENTS
-
Inductor device
-
Patent number 11,694,835
-
Issue date Jul 4, 2023
-
Realtek Semiconductor Corporation
-
Hsiao-Tsung Yen
-
H01 - BASIC ELECTRIC ELEMENTS
-
Inductor device
-
Patent number 11,682,518
-
Issue date Jun 20, 2023
-
Realtek Semiconductor Corporation
-
Chieh-Pin Chang
-
H01 - BASIC ELECTRIC ELEMENTS
-
Electronic component
-
Patent number 11,664,152
-
Issue date May 30, 2023
-
Murata Manufacturing Co., Ltd.
-
Yuta Shimoda
-
H01 - BASIC ELECTRIC ELEMENTS
-
Coil component
-
Patent number 11,636,971
-
Issue date Apr 25, 2023
-
SAMSUNG ELECTRO-MECHANICS CO., LTD.
-
Ye Eun Jung
-
H01 - BASIC ELECTRIC ELEMENTS
-
8-shaped inductive coil device
-
Patent number 11,631,517
-
Issue date Apr 18, 2023
-
Realtek Semiconductor Corporation
-
Hsiao-Tsung Yen
-
H01 - BASIC ELECTRIC ELEMENTS
-
Electronic component
-
Patent number 11,610,709
-
Issue date Mar 21, 2023
-
TDK Corporation
-
Yuto Shiga
-
H01 - BASIC ELECTRIC ELEMENTS
-
Inductor device
-
Patent number 11,587,709
-
Issue date Feb 21, 2023
-
Realtek Semiconductor Corporation
-
Hsiao-Tsung Yen
-
H01 - BASIC ELECTRIC ELEMENTS
-
Inductor device
-
Patent number 11,587,710
-
Issue date Feb 21, 2023
-
Realtek Semiconductor Corporation
-
Hsiao-Tsung Yen
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
Coil component
-
Patent number 11,562,847
-
Issue date Jan 24, 2023
-
SAMSUNG ELECTRO-MECHANICS CO., LTD.
-
Byung Soo Kang
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
Coil component
-
Patent number 11,557,417
-
Issue date Jan 17, 2023
-
Taiyo Yuden Co., Ltd.
-
Takayuki Arai
-
H01 - BASIC ELECTRIC ELEMENTS
-
Inductor
-
Patent number 11,551,847
-
Issue date Jan 10, 2023
-
Murata Manufacturing Co., Ltd.
-
Yasunari Nakashima
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
Coil substrate
-
Patent number 11,521,778
-
Issue date Dec 6, 2022
-
LG Electronics Inc.
-
Hyungjun Kim
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
Inductor device
-
Patent number 11,515,072
-
Issue date Nov 29, 2022
-
Realtek Semiconductor Corporation
-
Hsiao-Tsung Yen
-
H01 - BASIC ELECTRIC ELEMENTS
-