with a square active surface

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H01L2924/10162

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/10162with a square active surface

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Pad structure design in fan-out package
- Patent number 11,984,405
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure design in fan-out package
- Patent number 11,424,189
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 11,049,833
- Issue date Jun 29, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with island and associated leads
- Patent number 10,978,379
- Issue date Apr 13, 2021
- Rohm Co., Ltd.
- Akihiro Koga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Positional relationship among components of semiconductor device
- Patent number 10,796,983
- Issue date Oct 6, 2020
- Renesas Electronics Corporation
- Noriyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power gallium nitride devices and structures
- Patent number 10,615,094
- Issue date Apr 7, 2020
- Zhanming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,586,777
- Issue date Mar 10, 2020
- Renesas Electronics Corporation
- Kentaro Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power gallium nitride devices and structures
- Patent number 10,586,749
- Issue date Mar 10, 2020
- Zhanming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure design in fan-out package
- Patent number 10,510,670
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Positional relationship among components of semiconductor device
- Patent number 10,461,020
- Issue date Oct 29, 2019
- Renesas Electronics Corporation
- Noriyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with island and associated leads
- Patent number 10,431,527
- Issue date Oct 1, 2019
- Rohm Co., Ltd.
- Akihiro Koga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-to-back stacked dies
- Patent number 10,290,618
- Issue date May 14, 2019
- Intersil Americas LLC
- Francois Hebert
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Microelectronic devices, stacked microelectronic devices, and metho...
- Patent number 10,211,114
- Issue date Feb 19, 2019
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabrication method thereof
- Patent number 10,192,834
- Issue date Jan 29, 2019
- Siliconware Precision Industries Co., Ltd.
- Fu-Tang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,163,850
- Issue date Dec 25, 2018
- Rohm Co., Ltd.
- Motoharu Haga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounted substrate, mounted-substrate production method, and mounted...
- Patent number 10,136,570
- Issue date Nov 20, 2018
- Sharp Kabushiki Kaisha
- Katsuhiro Yamaguchi
- G02 - OPTICS
Information Patent Grant
Semiconductor component support and semiconductor device
- Patent number 10,068,821
- Issue date Sep 4, 2018
- Nichia Corporation
- Takeaki Shirase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Positional relationship among components of semiconductor device
- Patent number 10,032,700
- Issue date Jul 24, 2018
- Renesas Electronics Corporation
- Noriyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,008,433
- Issue date Jun 26, 2018
- Denso Corporation
- Tomoo Morino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for mounting LED elements, lead frame with resin, method...
- Patent number 9,899,583
- Issue date Feb 20, 2018
- Dai Nippon Printing Co., Ltd.
- Kazunori Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and mounting structure thereof
- Patent number 9,847,299
- Issue date Dec 19, 2017
- MURATA MANUFACTURING CO., LTD.
- Yuichiro Teshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,847,282
- Issue date Dec 19, 2017
- Rohm Co., Ltd.
- Akihiro Koga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and production method therefor
- Patent number 9,837,373
- Issue date Dec 5, 2017
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,780,069
- Issue date Oct 3, 2017
- Rohm Co., Ltd.
- Motoharu Haga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic devices, stacked microelectronic devices, and metho...
- Patent number 9,768,121
- Issue date Sep 19, 2017
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device for reducing propagation time of gate input si...
- Patent number 9,601,573
- Issue date Mar 21, 2017
- JTEKT Corporation
- Yasuhide Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor packages with an intermetallic lay...
- Patent number 9,564,409
- Issue date Feb 7, 2017
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting method
- Patent number 9,508,679
- Issue date Nov 29, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Mitsuhiko Ueda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Assembly bonding
- Patent number 9,488,853
- Issue date Nov 8, 2016
- VERILY LIFE SCIENCES LLC
- James Etzkorn
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
Selectively Dispensed Underfill and Edge Bond Patterns
- Publication number 20240249989
- Publication date Jul 25, 2024
- Apple Inc.
- Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pad Structure Design in Fan-Out Package
- Publication number 20220352080
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pad Structure Design in Fan-Out Package
- Publication number 20200091075
- Publication date Mar 19, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ISLAND AND ASSOCIATED LEADS
- Publication number 20190385937
- Publication date Dec 19, 2019
- Rohm Co., Ltd.
- Akihiro KOGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180315686
- Publication date Nov 1, 2018
- RENESAS ELECTRONICS CORPORATION
- Noriyuki TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Power Gallium Nitride Devices and Structures
- Publication number 20180247879
- Publication date Aug 30, 2018
- Zhanming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Power Gallium Nitride Devices and Structures
- Publication number 20180218961
- Publication date Aug 2, 2018
- Zhanming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180108629
- Publication date Apr 19, 2018
- RENESAS ELECTRONICS CORPORATION
- Kentaro YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20180068972
- Publication date Mar 8, 2018
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...
- Publication number 20180005909
- Publication date Jan 4, 2018
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180005981
- Publication date Jan 4, 2018
- Rohm Co., Ltd.
- Motoharu HAGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170162464
- Publication date Jun 8, 2017
- Denso Corporation
- Tomoo MORINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLING THIN SILICON CHIPS ON A CONTACT LENS
- Publication number 20140085599
- Publication date Mar 27, 2014
- Google Inc.
- James Etzkorn
- G02 - OPTICS
Information Patent Application
ASSEMBLING THIN SILICON CHIPS ON A CONTACT LENS
- Publication number 20140084489
- Publication date Mar 27, 2014
- James Etzkorn
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR COMPONENT SUPPORT AND SEMICONDUCTOR DEVICE
- Publication number 20140021595
- Publication date Jan 23, 2014
- Takeaki SHIRASE
- H01 - BASIC ELECTRIC ELEMENTS

with a square active surface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Pad structure design in fan-out package

Pad structure design in fan-out package

Semiconductor packages with an intermetallic layer

Semiconductor device with island and associated leads

Positional relationship among components of semiconductor device

High power gallium nitride devices and structures

Semiconductor device and method of manufacturing the same

High power gallium nitride devices and structures

Pad structure design in fan-out package

Positional relationship among components of semiconductor device

Semiconductor device with island and associated leads

Back-to-back stacked dies

Microelectronic devices, stacked microelectronic devices, and metho...

Semiconductor package and fabrication method thereof

Semiconductor device

Mounted substrate, mounted-substrate production method, and mounted...

Semiconductor component support and semiconductor device

Positional relationship among components of semiconductor device

Semiconductor device

Lead frame for mounting LED elements, lead frame with resin, method...

Semiconductor package and mounting structure thereof

Semiconductor device

Semiconductor device and production method therefor

Semiconductor device

Microelectronic devices, stacked microelectronic devices, and metho...

Semiconductor device for reducing propagation time of gate input si...

Methods of forming semiconductor packages with an intermetallic lay...

Mounting method

Assembly bonding

Patents Applicationslast 30 patents

Selectively Dispensed Underfill and Edge Bond Patterns

Pad Structure Design in Fan-Out Package

Pad Structure Design in Fan-Out Package

SEMICONDUCTOR DEVICE WITH ISLAND AND ASSOCIATED LEADS

SEMICONDUCTOR DEVICE

High Power Gallium Nitride Devices and Structures

High Power Gallium Nitride Devices and Structures

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

ASSEMBLING THIN SILICON CHIPS ON A CONTACT LENS

ASSEMBLING THIN SILICON CHIPS ON A CONTACT LENS

SEMICONDUCTOR COMPONENT SUPPORT AND SEMICONDUCTOR DEVICE