with a staggered arrangement

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H01L2224/14133

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/14133with a staggered arrangement

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Display device including anisotropic conductive film (ACF)
- Patent number 12,167,644
- Issue date Dec 10, 2024
- SHARP KABUSHIKI KAISHA
- Shinzoh Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress reduction apparatus and method
- Patent number 12,113,055
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for pixel data compensation for display drivers w...
- Patent number 12,051,355
- Issue date Jul 30, 2024
- Synaptics Incorporated
- Kazuhiro Okamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for clock signal transmission in integrated circuits and...
- Patent number 12,026,008
- Issue date Jul 2, 2024
- Altera Corporation
- Jeffrey Chromczak
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 11,916,033
- Issue date Feb 27, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip and semiconductor package including the same
- Patent number 11,830,840
- Issue date Nov 28, 2023
- Samsung Electronics Co., Ltd.
- Young Jun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and electronic device comprising a plurality of...
- Patent number 11,742,311
- Issue date Aug 29, 2023
- STMicroelectronics S.r.l.
- Angelo Scuderi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having wiring substrate with lead-out wirings
- Patent number 11,699,645
- Issue date Jul 11, 2023
- Renesas Electronics Corporation
- Keita Tsuchiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test pad structure of chip
- Patent number 11,694,983
- Issue date Jul 4, 2023
- SITRONIX TECHNOLOGY CORPORATION
- Kuo-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device comprising interconnect structures having an inne...
- Patent number 11,676,922
- Issue date Jun 13, 2023
- QUALCOMM Incorporated
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump-on-trace design for enlarge bump-to-trace distance
- Patent number 11,658,143
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming recesses in molding compound of wafer to reduce stress
- Patent number 11,658,153
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for clock signal transmission in integrated circuits and...
- Patent number 11,500,412
- Issue date Nov 15, 2022
- Intel Corporation
- Jeffrey Chromczak
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device having planarized passivation layer and method...
- Patent number 11,488,894
- Issue date Nov 1, 2022
- Samsung Electronics Co., Ltd.
- Young Lyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging mechanisms for dies with different sizes of connectors
- Patent number 11,488,878
- Issue date Nov 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupling of integrated circuits (ICS) through a passivation-defined...
- Patent number 11,450,630
- Issue date Sep 20, 2022
- Cirrus Logic, Inc.
- Christopher Healy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density routing for heterogeneous package integration
- Patent number 11,282,776
- Issue date Mar 22, 2022
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress reduction apparatus and method
- Patent number 11,244,940
- Issue date Feb 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 11,239,192
- Issue date Feb 1, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch copper pillar package and method
- Patent number 11,088,064
- Issue date Aug 10, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,063,009
- Issue date Jul 13, 2021
- Renesas Electronics Corporation
- Kenji Sakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 10,991,649
- Issue date Apr 27, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tsung-Yuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging mechanisms for dies with different sizes of connectors
- Patent number 10,964,610
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating low resistance, low inductance interconnecti...
- Patent number RE48420
- Issue date Feb 2, 2021
- Texas Instruments Incorporated
- Bernhard P. Lange
Information Patent Grant
Integrated circuit having a periphery of input/output cells
- Patent number 10,892,236
- Issue date Jan 12, 2021
- QUALCOMM Incorporated
- Sumeet Aggarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having planarized passivation layer and method...
- Patent number 10,847,447
- Issue date Nov 24, 2020
- Samsung Electronics Co., Ltd.
- Young Lyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 10,734,343
- Issue date Aug 4, 2020
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,720,402
- Issue date Jul 21, 2020
- Sony Corporation
- Makoto Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress reduction apparatus and method
- Patent number 10,692,848
- Issue date Jun 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming recesses in molding compound of wafer to reduce stress
- Patent number 10,685,936
- Issue date Jun 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT, DATA DRIVING APPARATUS, AND CHIP-ON-FILM PACKAGE
- Publication number 20230402419
- Publication date Dec 14, 2023
- LX Semicon Co., Ltd.
- Yong Sung AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND ELECTRONIC DEVICE COMPRISING A PLURALITY OF...
- Publication number 20230335524
- Publication date Oct 19, 2023
- STMicroelectronics S.r.l.
- Angelo SCUDERI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump-on-Trace Design for Enlarge Bump-to-Trace Distance
- Publication number 20230253358
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Recesses in Molding Compound of Wafer to Reduce Stress
- Publication number 20230253370
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Harvested Reconstitution Bumping
- Publication number 20230245988
- Publication date Aug 3, 2023
- Kwan-Yu Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, A PACKAGE SUBSTRATE, AND A SEMICONDUCTOR PACKAGE
- Publication number 20230154879
- Publication date May 18, 2023
- SK HYNIX INC.
- Si Yun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UV-CURABLE RESIN COMPOSITIONS SUITABLE FOR REDISTRIBUTION LAYERS
- Publication number 20230095931
- Publication date Mar 30, 2023
- DESIGNER MOLECULES, INC.
- Farhad Mizori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Techniques For Clock Signal Transmission In Integrated Circuits And...
- Publication number 20230049681
- Publication date Feb 16, 2023
- Intel Corporation
- Jeffrey Chromczak
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BUMP STRUCTURE OF CHIP
- Publication number 20220336398
- Publication date Oct 20, 2022
- Sitronix Technology Corp.
- KUO-WEI TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE PITCH COPPER PILLAR PACKAGE AND METHOD
- Publication number 20220189866
- Publication date Jun 16, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Packing Optimization of Semiconductor Devices
- Publication number 20220157755
- Publication date May 19, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUPLING OF INTEGRATED CIRCUITS (ICS) THROUGH A PASSIVATION-DEFINED...
- Publication number 20220130778
- Publication date Apr 28, 2022
- Cirrus Logic International Semiconductor Ltd.
- Christopher Healy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOW GUIDING STRUCTURE OF CHIP
- Publication number 20220037275
- Publication date Feb 3, 2022
- Sitronix Technology Corp.
- KUO-WEI TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20210407948
- Publication date Dec 30, 2021
- Samsung Electronics Co., Ltd.
- Young Jun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND ELECTRONIC DEVICE COMPRISING A PLURALITY OF...
- Publication number 20210242157
- Publication date Aug 5, 2021
- STMicroelectronics S.r.l.
- Angelo SCUDERI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Mechanisms for Dies with Different Sizes of Connectors
- Publication number 20210217672
- Publication date Jul 15, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING INTERCONNECT STRUCTURES HAVING AN INNE...
- Publication number 20210125951
- Publication date Apr 29, 2021
- QUALCOMM Incorporated
- Li-Sheng WENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING PLANARIZED PASSIVATION LAYER AND METHO...
- Publication number 20210028092
- Publication date Jan 28, 2021
- Samsung Electronics Co., Ltd.
- YOUNG LYONG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Packing Optimization of Semiconductor Devices
- Publication number 20200357763
- Publication date Nov 12, 2020
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING A PERIPHERY OF INPUT/OUTPUT CELLS
- Publication number 20200350265
- Publication date Nov 5, 2020
- QUALCOMM Incorporated
- Sumeet AGGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress Reduction Apparatus and Method
- Publication number 20200321326
- Publication date Oct 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Recesses in Molding Compound of Wafer to Reduce Stress
- Publication number 20200286863
- Publication date Sep 10, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE PITCH COPPER PILLAR PACKAGE AND METHOD
- Publication number 20200219802
- Publication date Jul 9, 2020
- Amkor Technology, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200118916
- Publication date Apr 16, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- TSUNG-YUAN YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress Reduction Apparatus and Method
- Publication number 20200006311
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Mechanisms for Dies with Different Sizes of Connectors
- Publication number 20190341319
- Publication date Nov 7, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE CUBE WITH ENHANCED SIDEWALL PLANARITY
- Publication number 20190189591
- Publication date Jun 20, 2019
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Yazhou Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SUBSTRATE
- Publication number 20190164881
- Publication date May 30, 2019
- Intel Corporation
- Mathew J. MANUSHAROW
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MICROELECTRONIC PACKAGE FOR WAFER-LEVEL CHIP SCALE PACKAGING WITH F...
- Publication number 20190096861
- Publication date Mar 28, 2019
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY PACKAGE INTERCONNECTS
- Publication number 20180182696
- Publication date Jun 28, 2018
- Intel Corporation
- Sanka GANESAN
- H01 - BASIC ELECTRIC ELEMENTS

with a staggered arrangement

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device including anisotropic conductive film (ACF)

Stress reduction apparatus and method

Device and method for pixel data compensation for display drivers w...

Techniques for clock signal transmission in integrated circuits and...

Method and system for packing optimization of semiconductor devices

Integrated chip and semiconductor package including the same

Integrated circuit and electronic device comprising a plurality of...

Semiconductor device having wiring substrate with lead-out wirings

Test pad structure of chip

Integrated device comprising interconnect structures having an inne...

Bump-on-trace design for enlarge bump-to-trace distance

Forming recesses in molding compound of wafer to reduce stress

Techniques for clock signal transmission in integrated circuits and...

Semiconductor device having planarized passivation layer and method...

Packaging mechanisms for dies with different sizes of connectors

Coupling of integrated circuits (ICS) through a passivation-defined...

High density routing for heterogeneous package integration

Stress reduction apparatus and method

Method and system for packing optimization of semiconductor devices

Fine pitch copper pillar package and method

Semiconductor device

Semiconductor device and method of manufacturing semiconductor device

Packaging mechanisms for dies with different sizes of connectors

Method for fabricating low resistance, low inductance interconnecti...

Integrated circuit having a periphery of input/output cells

Semiconductor device having planarized passivation layer and method...

Method and system for packing optimization of semiconductor devices

Semiconductor device and method of manufacturing the same

Stress reduction apparatus and method

Forming recesses in molding compound of wafer to reduce stress

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT, DATA DRIVING APPARATUS, AND CHIP-ON-FILM PACKAGE

INTEGRATED CIRCUIT AND ELECTRONIC DEVICE COMPRISING A PLURALITY OF...

Bump-on-Trace Design for Enlarge Bump-to-Trace Distance

Forming Recesses in Molding Compound of Wafer to Reduce Stress

Harvested Reconstitution Bumping

SEMICONDUCTOR DEVICE, A PACKAGE SUBSTRATE, AND A SEMICONDUCTOR PACKAGE

UV-CURABLE RESIN COMPOSITIONS SUITABLE FOR REDISTRIBUTION LAYERS

Techniques For Clock Signal Transmission In Integrated Circuits And...

BUMP STRUCTURE OF CHIP

FINE PITCH COPPER PILLAR PACKAGE AND METHOD

Method and System for Packing Optimization of Semiconductor Devices

COUPLING OF INTEGRATED CIRCUITS (ICS) THROUGH A PASSIVATION-DEFINED...

FLOW GUIDING STRUCTURE OF CHIP

INTEGRATED CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

INTEGRATED CIRCUIT AND ELECTRONIC DEVICE COMPRISING A PLURALITY OF...

Packaging Mechanisms for Dies with Different Sizes of Connectors

INTEGRATED DEVICE COMPRISING INTERCONNECT STRUCTURES HAVING AN INNE...

SEMICONDUCTOR DEVICE HAVING PLANARIZED PASSIVATION LAYER AND METHO...

Method and System for Packing Optimization of Semiconductor Devices

INTEGRATED CIRCUIT HAVING A PERIPHERY OF INPUT/OUTPUT CELLS

Stress Reduction Apparatus and Method

Forming Recesses in Molding Compound of Wafer to Reduce Stress

FINE PITCH COPPER PILLAR PACKAGE AND METHOD

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Stress Reduction Apparatus and Method

Packaging Mechanisms for Dies with Different Sizes of Connectors

SEMICONDUCTOR STORAGE CUBE WITH ENHANCED SIDEWALL PLANARITY

INTEGRATED CIRCUIT PACKAGE SUBSTRATE

MICROELECTRONIC PACKAGE FOR WAFER-LEVEL CHIP SCALE PACKAGING WITH F...

HIGH DENSITY PACKAGE INTERCONNECTS