FIELD OF THE INVENTION
The present invention relates generally to a flow guiding structure of chip, and particularly to a structure disposed on a chip and capable of guiding the flowing direction of the conductive medium or retarding the flow of the conductive medium.
BACKGROUND OF THE INVENTION
As time advances, electronic products are developed to be become light, thin, and miniature. Almost all of various electronic products, for example, camcorders, notebook computers, smartphones, or other mobile devices, include a display for displaying information. Thereby, displays have become an important component in electronic products.
To display images, driving chips should be included in a display. Driving chips are used for driving the panel of the display for displaying images. In general, there are multiple technologies for disposing the driving chips on the panel. To adopt these technologies, the conductive medium, for example, an anisotropic conductive film (ACF), should be used. The conductive medium includes the conductive particles, which may contact the connecting bumps of the driving chips and the electrical connecting members of the panel. Thereby, the driving chips may be connected electrically to the panel and then transmit the driving signals to the panel for driving the panel to display images.
According to the prior art, while disposing the driving chips on the panel, the conductive medium will flow arbitrarily on the surface of the driving chips and hence disallowing the conductive particles of the conductive medium to be distributed effective on the surfaces of the connecting bumps of the driving chips. Thereby, the performance of the driving chips transmitting signals to the panel is affected, and the panel might not function normally. In addition, this problem does not only exist in the driving chips of the panel, but it also appears in other chip types such as disposing chips on a circuit board. Thereby, it is urged to provide a flow guiding structure that may guide the conductive medium to flow toward the connecting bumps of the chip for increasing the number of the conductive particles distributed on the surfaces of the connecting bumps. Alternatively, the flow guiding structure may retard the flow of the conductive medium for avoiding reduction of the number of the conductive particles distributed on the surfaces of the connecting bumps.
SUMMARY
An objective of the present invention is to provide a flow guiding structure of chip, which comprises at least one flow guiding member disposed on the surface of a chip and adjacent to a plurality of connecting bumps disposed on the surface of the chip. When the chip is disposed on a board member, the flow guiding member may guide the conductive medium to flow toward the connecting bumps and drive the conductive particles to move toward the connecting bumps and thus increasing the number of the conductive particles on the surfaces of the connecting bumps. Alternatively, the flow guiding member may retard the flow of the conductive medium for avoiding the conductive particles from leaving the surfaces of the connecting bumps and thus preventing reduction of the number of the conductive particles on the surfaces of the connecting bumps.
Another objective of the present invention is to provide a flow guiding structure of chip, which comprises a plurality of connecting-bump groups disposed on the surface of a chip. The connecting-bump groups include a plurality of bumps, respectively. While disposing the chip on a board member, the bumps may retard the flow of the conductive medium and thus avoiding the conductive particles from leaving the surfaces of the bumps and preventing reduction of the number of the conductive particles on the surfaces of the bumps.
The present invention provides a flow guiding structure of chip, which comprises a plurality of connecting bumps and at least one flow guiding member. The connecting bumps are disposed on a surface of a chip. The at least one flow guiding member is also disposed on the surface of the chip and adjacent to the connecting bumps. The flow guiding member is used for blocking the conductive medium and forcing the conductive medium to flow toward the connecting bumps or for retarding the flow of the conductive medium and thus preventing unduly low number of the conductive particles on the surfaces of the connecting bumps.
The present invention provides another flow guiding structure of chip, which comprises a plurality of connecting-bump groups disposed on a surface of a chip. The connecting-bump groups include a plurality of bumps, respectively. The bumps in the same connecting-bump group are adjacent to one another and correspond to the same electrical connecting member. The structure is used for blocking the conductive medium and retarding the flow of the conductive medium and thus preventing unduly low number of the conductive particles on the surfaces of the bumps.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 shows a stereoscopic diagram of the flow guiding structure according to the first embodiment of the present invention;
FIG. 2 shows a top view of the flow guiding structure according to the first embodiment of the present invention;
FIG. 3 shows a cross-sectional view of the flow guiding structure according to the first embodiment of the present invention;
FIG. 4 shows a top view of the flow guiding structure according to the second embodiment of the present invention;
FIG. 5 shows a stereoscopic diagram of the flow guiding structure according to the third embodiment of the present invention;
FIG. 6 shows a top view of the flow guiding structure according to the third embodiment of the present invention;
FIG. 7 shows a cross-sectional view of the flow guiding structure according to the third embodiment of the present invention;
FIG. 8 shows a stereoscopic diagram of the flow guiding structure according to the fourth embodiment of the present invention;
FIG. 9 shows a top view of the flow guiding structure according to the fourth embodiment of the present invention;
FIG. 10 shows a cross-sectional view of the flow guiding structure according to the fourth embodiment of the present invention;
FIG. 11 shows a top view of the flow guiding structure according to the fifth embodiment of the present invention;
FIG. 12 shows a stereoscopic diagram of the flow guiding structure according to the sixth embodiment of the present invention; and
FIG. 13 shows a cross-sectional view of the flow guiding structure according to the sixth embodiment of the present invention.
DETAILED DESCRIPTION
In order to make the structure and characteristics as well as the effectiveness of the present invention to be further understood and recognized, the detailed description of the present invention is provided as follows along with embodiments and accompanying figures.
Please refer to FIG. 1, which shows a stereoscopic diagram of the flow guiding structure according to the first embodiment of the present invention. As shown in the figure, the flow guiding structure 1 according to the present invention comprises a plurality of connecting bumps 10 and at least one flow guiding member 20.
Please refer to FIG. 1 again and to FIG. 3, which shows a cross-sectional view of the flow guiding structure according to the first embodiment of the present invention. According to the present embodiment, the connecting bumps 10 are disposed on a surface 3 of a chip 2. The material of the connecting bumps 10 is a conductive material. The at least one flow guiding member 20 is disposed on the surface 3 of the chip 2 and adjacent to the connecting bumps 10. The at least one flow guiding member 20 has a height H1; the connecting bumps 10 have a height H2. The height H1 is smaller than or equal to the height H2. The at least one flow guiding member 20 is not higher than the connecting bumps 10.
Please refer to FIG. 1 and FIG. 3 again and to FIG. 2, which shows a top view of the flow guiding structure according to the first embodiment of the present invention. As shown in the figures, the number of the flow guiding member 20 according to the present embodiment may be multiple. The flow guiding members 20 are taken as an example for description. The flow guiding members 20 may include a plurality of flow guiding bumps 22 adjacent to the connecting bumps 10. A first side 221 of the flow guiding bumps 22 corresponds to a second side 101 of the connecting bumps 10.
An area of the first side 221 may be greater than an area of the second side 101. When the chip 2 is disposed on a board member 30, which may be a display panel or a circuit board, the flow guiding bumps 22 may block a conductive medium 40 effectively, retard the flow of the conductive medium 40, and drive the conductive medium 40 to flow back to the connecting bumps 10. Equivalently, the flow guiding bumps 22 guide the conductive medium 40 to flow to the connecting bumps 10.
As shown in FIG. 2 and FIG. 3, while adding the conductive medium 40 to the surface 3 of the chip 2 for disposing the chip 2 on the board member 30, the force is exerted on the chip 2, that enables the conductive medium 40 to flow on the surface 3 of the chip 2. As shown in FIG. 2, the conductive medium 40 will be blocked by the flow guiding bumps 22 and thus retarding its flow. In addition, the conductive medium 40 will flow back to the connecting bumps 10 after being blocked by the flow guiding bumps 22. As shown in FIG. 3, a plurality of conductive particles 42 contained in the conductive medium 40 will move toward the connecting bumps 10 accordingly and reach the surfaces of the connecting bumps 10. A plurality of electrical connecting members 32 are disposed on the board member 30. The connecting bumps 10 correspond to the electrical connecting members 32, respectively.
When the chip 2 is disposed on the board member 30, the conductive particles 42 located on the surfaces of the connecting bumps 10 will contact the connecting bumps 10 and the corresponding electrical connecting members 32. Thereby, the connecting bumps 10 may be connected electrically with the corresponding electrical connecting members 32, meaning that the chip 2 may be connected electrically to the board member 30. The flow guiding bumps 22 block the conductive medium 40 and retard the flow of the conductive medium 40, and hence avoiding the conductive particles 42 from leaving the surfaces of the connecting bumps 10. In addition, when the conductive medium 40 is blocked by the flow guiding bumps 22 and flows back to the connecting bumps 10, the conductive particles 42 move toward to the connecting bumps 10 and thus increasing the number of the conductive particles 42 between the connecting bumps 10 and the electrical connecting members 32. Thereby, the transmission capability between the chip 2 and the board member 30 is enhanced.
According to an embodiment of the present invention, it is not required that the flow guiding bumps 22 should correspond to the electrical connecting members 32. In other words, it is not required that the flow guiding bumps 22 should be connected electrically to the electrical connecting members 32.
Refer again to FIG. 3. At least one side of the flow guiding members 20 is adjacent to the connecting bumps 10. The at least one side of the flow guiding members 20 may be a non-sloped surface or a sloped surface. According to the present embodiment, the flow guiding bumps 22 are examples of the at least one flow guiding member 20. The at least one side of the flow guiding bumps 22 may be a sloped surface 202 or a non-sloped surface. When the conductive medium 40 flows, the sloped surface 202 may guide the conductive medium 40 and the conductive particles 42 contained therein to move toward the connecting bumps 10 and thus increasing the number of the conductive particles 42 between the connecting bumps 10 and the electrical connecting members 32. The angle between the sloped surface 202 and the bottom surface 203 of the flow guiding bumps 22 may be acute. The flow guiding bumps 22 may be conductive or non-conductive. The conductive medium 40 may be, but not limited to, an anisotropic conductive film (ACF).
Please refer to FIG. 4, which shows a top view of the flow guiding structure according to the second embodiment of the present invention. As shown in the figure, according to the present embodiment, more than one flow guiding bump 22 may be disposed around the at least one connecting bump 10. Namely, one flow guiding bump 22 may be disposed opposing to the front side, rear side, left side, or right side of the connecting bump 10, respectively. Multiple flow guiding bumps 22 are adjacent to a plurality of sides of the at least one connecting bump 10. By using the flow guiding bumps 22 to limit the flow of the conductive medium 40, the conductive particles 42 may be driven to concentrate between the connecting bumps 10 and the electrical connecting members 32.
Please refer to FIG. 5, which shows a stereoscopic diagram of the flow guiding structure according to the third embodiment of the present invention. As shown in the figure, the flow guiding structure 1 according to the present embodiment comprises a plurality of connecting-bump group 50 disposed on the surface 3 of the chip 2 and including a plurality of bumps 52, respectively. The bumps 52 in the same connecting-bump group 50 are adjacent to one another and corresponding to the same electrical connecting member 32 of the board member 30. As compared to the first embodiment, the connecting bumps 10 according to the present embodiment are divided into the bumps 52 corresponding to the same electrical connecting member 32.
Please refer to FIG. 5 again and to FIGS. 6 and 7. FIG. 6 shows a top view of the flow guiding structure according to the third embodiment of the present invention; FIG. 7 shows a cross-sectional view of the flow guiding structure according to the third embodiment of the present invention. As shown in the figures, according to the present embodiment, while adding the conductive medium 40 to the surface 3 of the chip 2 for disposing the chip 2 on the board member 30, the force is exerted on the chip 2 and thus enabling the conductive medium 40 to flow on the surface 3 of the chip 2. The conductive medium 40 is blocked by the bumps 22 and thus retarding its flow for maintaining the conductive medium 40 around the bumps 52 to the greatest extent. Thereby, the conductive particles 42 may be avoided from leaving the surfaces of the bumps 52 and may be concentrated between the bumps 52 and the electrical connecting members 32.
Please refer to FIG. 8, which shows a stereoscopic diagram of the flow guiding structure according to the fourth embodiment of the present invention. As shown in the figure, the flow guiding structure 1 according to the present embodiment comprises a plurality of connecting bumps 10 and at least one flow guiding member 20. According to the present embodiment, the at least one flow guiding member 20 may be at least one stuffing member 24 stuffed in a circuit region 4 of the chip 2 and adjacent to the connecting bumps 10. The circuit region 4 is the region in the chip 2 where the circuits are located. According to the present embodiment, the at least one stuffing member 24 surrounds the connecting bumps 10. As shown in FIG. 10, the at least one stuffing member 24 has a height H1; the connecting bumps 10 have a height H2. The height H1 is smaller than or equal to the height H2.
Please refer to FIG. 8 again and to FIGS. 9 and 10. FIG. 9 shows a top view of the flow guiding structure according to the fourth embodiment of the present invention; FIG. 10 shows a cross-sectional view of the flow guiding structure according to the fourth embodiment of the present invention. As shown in the figures, while adding the conductive medium 40 to the surface 3 of the chip 2 for disposing the chip 2 on the board member 30, the force is exerted on the chip 2 and thus enabling the conductive medium 40 to flow on the surface 3 of the chip 2 and on the surface of the at least one stuffing member 24. Since the at least one stuffing member 24 surrounds the connecting bumps 10, the conductive medium 40 on the surface 3 of the chip 2 will be blocked by the at least one stuffing member 24 and thus being limited to flow around the location of the connecting bumps 10. Equivalently, the at least one stuffing member 24 will guide the conductive medium 40 to flow to the surfaces of the connecting bumps 10 and concentrate the conductive particles 42 between the connecting bumps 10 and the electrical connecting members 32. Besides, when the force is exerted on the chip 2 for disposing the chip 2 to the board member 30, the conductive medium 40 located on the surface of the at least one stuffing member 24 will be blocked by the at least one stuffing member 24 and thus driving the conductive medium 40 to flow to the surfaces of the chip 2 not stuffed by the at least one stuffing member 24, namely, driving the conductive medium 40 to flow to the locations of the connecting bumps 10. As shown in FIG. 10, the conductive particles 42 contained in the conductive medium 40 located on the surface of the at least one stuffing member 24 will move toward the connecting bumps 10 accordingly. Consequently, the number of the conductive particles 42 between the connecting bumps 10 and the electrical connecting members 32 will be increased.
Refer again to FIG. 10. According to the present embodiment, at least one side of the at least one stuffing member 24 is adjacent to the connecting bumps 10. The at least one side of the at least one stuffing member 24 may be a sloped surface. Alternatively, it may be a non-sloped surface. According to the present embodiment, the material of the at least one stuffing member 24 is, but not limited to, an insulative material, for example, polyimide (PI) or benzocyclobutene (BCB).
Please refer to FIG. 11, which shows a top view of the flow guiding structure according to the fifth embodiment of the present invention. As shown in the figure, the flow guiding structure 1 according to the present embodiment may comprise a plurality of stuffing members 24. The stuffing members 24 are spaced by a gap 242. While adding the conductive medium 40 to the surface 3 of the chip 2 and the surfaces of the stuffing members 24 for disposing the chip 2 on the board member 30, the conductive medium 40 located on the surface 3 of the chip 2 will be blocked by the stuffing members 24 and thus retarding the flow of the conductive medium 40. The conductive medium 40 will flow back to the connecting bumps 10. Then the conductive medium 40 is equivalently guided to flow to the surfaces of the connecting bumps 10. Moreover, as described above, the conductive medium 40 located on the surfaces of the stuffing members 24 will flow to the connecting bumps 10. According to the present embodiment, at least one side of the stuffing members 24 may be a sloped surface.
Please refer to FIG. 12, which shows a stereoscopic diagram of the flow guiding structure according to the sixth embodiment of the present invention. As shown in the figure, the stuffing member 24 according to the present embodiment is further stuffed in a plurality of gaps 12 between the connecting bumps 10 such that the stuffing member 24 envelops the sides of the connecting bumps 10. According to the present embodiment, the stuffing member 24 covers almost all the surface of the chip 2. According to an embodiment, the height of the stuffing member 24 may be smaller than or equal to the height of the connecting bumps 10.
Please refer to FIG. 12 again and to FIG. 13, which shows a cross-sectional view of the flow guiding structure according to the sixth embodiment of the present invention. As shown in the figures, while adding the conductive medium 40 to the surface of the stuffing member 24 for disposing the chip 2 on the board member 30, as described above, the conductive medium 40 on the surface of the stuffing member 24 will flow to the connecting bumps 10. As shown in FIG. 13, the conductive particles 42 contained in the conductive medium 40 will move toward the connecting bumps 10 accordingly. Consequently, the number of the conductive particles 42 between the connecting bumps 10 and the electrical connecting members 32 will be increased. The above embodiments may be applied to each other for increasing the effect.
To sum up, the present invention provides a flow guiding structure of chip, which comprises at least one flow guiding member disposed on the surface of the chip and adjacent to a plurality of connecting bumps disposed on the surface of the chip. The flow guiding member may block the conductive medium and guide the conductive medium to flow toward the connecting bumps and thus increasing the number of the conductive particles on the surfaces of the connecting bumps. Alternatively, the flow guiding member may retard the flow of the conductive medium for avoiding the conductive particles from leaving the surfaces of the connecting bumps. In addition, the connecting bumps may be divided into a plurality of bumps. The bumps may retard the flow of the conductive medium for maintaining the conductive medium around the bumps, and thus preventing the conductive particles located on the surfaces of the bumps from leaving.
Accordingly, the present invention conforms to the legal requirements owing to its novelty, nonobviousness, and utility. However, the foregoing description is only embodiments of the present invention, not used to limit the scope and range of the present invention. Those equivalent changes or modifications made according to the shape, structure, feature, or spirit described in the claims of the present invention are included in the appended claims of the present invention.
Patent Application
20220037275
