with a staggered arrangement

Industry

CPC
H01L2224/06133

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/06133with a staggered arrangement

Industries

Patents Grantslast 30 patents

Information Patent Grant
Display device including anisotropic conductive film (ACF)
- Patent number 12,167,644
- Issue date Dec 10, 2024
- SHARP KABUSHIKI KAISHA
- Shinzoh Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and display device
- Patent number 12,021,049
- Issue date Jun 25, 2024
- Wuhan China Star Optoelectronics Technology Co., Ltd.
- Shuya Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,923,279
- Issue date Mar 5, 2024
- Sony Group Corporation
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,810,869
- Issue date Nov 7, 2023
- Renesas Electronics Corporation
- Kazuo Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,626,356
- Issue date Apr 11, 2023
- Sony Group Corporation
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,587,857
- Issue date Feb 21, 2023
- Sony Corporation
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,482,498
- Issue date Oct 25, 2022
- Renesas Electronics Corporation
- Kazuo Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device having a plurality of pad terminals including connec...
- Patent number 11,393,851
- Issue date Jul 19, 2022
- Samsung Display Co., Ltd.
- Byoung Yong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple band multiple mode transceiver front end flip-chip archite...
- Patent number 11,309,926
- Issue date Apr 19, 2022
- Skyworks Solutions, Inc.
- Lisette L. Zhang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Methods of bonding the strip-shaped under bump metallization struct...
- Patent number 11,049,850
- Issue date Jun 29, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate and display panel
- Patent number 11,043,510
- Issue date Jun 22, 2021
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Chaoyu Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,964,659
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,923,437
- Issue date Feb 16, 2021
- Renesas Electronics Corporation
- Kazuo Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact wirebonding in stacked-chip system in package, and methods...
- Patent number 10,847,450
- Issue date Nov 24, 2020
- Intel Corporation
- Saeed Shojaie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and semiconductor device provided with same
- Patent number 10,825,760
- Issue date Nov 3, 2020
- SOCIONEXT INC.
- Toshihiro Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having a plurality of first and second conduc...
- Patent number 10,658,348
- Issue date May 19, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed semiconductor device with noise reduction wiring pattern
- Patent number 10,643,939
- Issue date May 5, 2020
- Renesas Electronics Corporation
- Shuuichi Kariyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device having a plurality of pad terminals
- Patent number 10,600,819
- Issue date Mar 24, 2020
- Samsung Display Co., Ltd.
- Byoung Yong Kim
- G02 - OPTICS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,566,255
- Issue date Feb 18, 2020
- Renesas Electronics Corporation
- Toshihiko Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple band multiple mode transceiver front end flip-chip archite...
- Patent number 10,484,025
- Issue date Nov 19, 2019
- Skyworks Solutions, Inc.
- Lisette L. Zhang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device
- Patent number 10,475,760
- Issue date Nov 12, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and display device including display panel
- Patent number 10,468,435
- Issue date Nov 5, 2019
- LG Display Co., Ltd.
- JaeBok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 10,325,871
- Issue date Jun 18, 2019
- Samsung Display Co., Ltd.
- Hae-Kwan Seo
- G02 - OPTICS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,283,458
- Issue date May 7, 2019
- Renesas Electronics Corporation
- Kazuo Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reversible semiconductor die
- Patent number 10,262,926
- Issue date Apr 16, 2019
- Nexperia B.V.
- Kan Wae Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,236,238
- Issue date Mar 19, 2019
- Sony Corporation
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming an embedded SoP fan-out...
- Patent number 10,217,702
- Issue date Feb 26, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabrication method thereof
- Patent number 10,192,834
- Issue date Jan 29, 2019
- Siliconware Precision Industries Co., Ltd.
- Fu-Tang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 10,134,648
- Issue date Nov 20, 2018
- Renesas Electronics Corporation
- Toshihiko Akiba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a semiconductor device including strain reduced s...
- Patent number 9,997,480
- Issue date Jun 12, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20250006587
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20240312934
- Publication date Sep 19, 2024
- Wuhan China Star Optoelectronics Technology Co., Ltd.
- Shuya DONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20240071964
- Publication date Feb 29, 2024
- WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Shuya Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE
- Publication number 20240047389
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Hyeonmin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVE CHIP AND DISPLAY PANEL
- Publication number 20240038700
- Publication date Feb 1, 2024
- WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Shuya Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240021541
- Publication date Jan 18, 2024
- RENESAS ELECTRONICS CORPORATION
- Kazuo Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BASIN-SHAPED UNDERBUMP PLATES AND METHODS OF FORMING THE SAME
- Publication number 20230352428
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Yen-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230253269
- Publication date Aug 10, 2023
- Sony Semiconductor Solutions Corporation
- YUTAKA OOTAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230098931
- Publication date Mar 30, 2023
- SONY GROUP CORPORATION
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual-Side Folded Source Driver Outputs of a Display Panel Having a...
- Publication number 20230045931
- Publication date Feb 16, 2023
- PARADE TECHNOLOGIES, LTD.
- You Ben Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230015101
- Publication date Jan 19, 2023
- RENESAS ELECTRONICS CORPORATION
- Kazuo Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220246498
- Publication date Aug 4, 2022
- SONY GROUP CORPORATION
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210066213
- Publication date Mar 4, 2021
- Renesas Electronics Corporation
- Kazuo Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY SUBSTRATE AND DISPLAY PANEL
- Publication number 20200357824
- Publication date Nov 12, 2020
- Wuhan China Star Optoelectronics Semieconductor Display Technology Co., Ltd.
- Chaoyu YUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Forming the Same
- Publication number 20200279837
- Publication date Sep 3, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE HAVING A PLURALITY OF PAD TERMINALS
- Publication number 20200203390
- Publication date Jun 25, 2020
- SAMSUNG DISPLAY CO., LTD.
- Byoung Yong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices Having a Plurality of First and Second Conduc...
- Publication number 20200105730
- Publication date Apr 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple Band Multiple Mode Transceiver Front End Flip-Chip Archite...
- Publication number 20200083915
- Publication date Mar 12, 2020
- SKYWORKS SOLUTIONS, INC.
- LISETTE L. ZHANG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200075525
- Publication date Mar 5, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- JIE CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190348332
- Publication date Nov 14, 2019
- RENESAS ELECTRONICS CORPORATION
- Toshihiko AKIBA
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190221526
- Publication date Jul 18, 2019
- RENESAS ELECTRONICS CORPORATION
- Kazuo Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Display Panel and Display Device Including Display Panel
- Publication number 20190123071
- Publication date Apr 25, 2019
- LG Display Co., Ltd.
- JaeBok KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20190057913
- Publication date Feb 21, 2019
- RENESAS ELECTRONICS CORPORATION
- Toshihiko AKIBA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180233435
- Publication date Aug 16, 2018
- SONY CORPORATION
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20180145001
- Publication date May 24, 2018
- RENESAS ELECTRONICS CORPORATION
- Toshihiko Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REVERSIBLE SEMICONDUCTOR DIE
- Publication number 20180096916
- Publication date Apr 5, 2018
- Kan Wae Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180096915
- Publication date Apr 5, 2018
- SONY CORPORATION
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180082970
- Publication date Mar 22, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- JIE CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SEMICONDUCTOR DEVICE INCLUDING STRAIN REDUCED S...
- Publication number 20180047686
- Publication date Feb 15, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170345775
- Publication date Nov 30, 2017
- RENESAS ELECTRONICS CORPORATION
- Kazuo Tomita
- H01 - BASIC ELECTRIC ELEMENTS

with a staggered arrangement

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device including anisotropic conductive film (ACF)

Display panel and display device

Semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device

Semiconductor device

Semiconductor device and method of manufacturing the same

Display device having a plurality of pad terminals including connec...

Multiple band multiple mode transceiver front end flip-chip archite...

Methods of bonding the strip-shaped under bump metallization struct...

Array substrate and display panel

Semiconductor device

Semiconductor device and method of manufacturing the same

Compact wirebonding in stacked-chip system in package, and methods...

Semiconductor chip and semiconductor device provided with same

Semiconductor devices having a plurality of first and second conduc...

High speed semiconductor device with noise reduction wiring pattern

Display device having a plurality of pad terminals

Method of manufacturing semiconductor device

Multiple band multiple mode transceiver front end flip-chip archite...

Semiconductor device

Display panel and display device including display panel

Display device

Semiconductor device and method of manufacturing the same

Reversible semiconductor die

Semiconductor device

Semiconductor device and method of forming an embedded SoP fan-out...

Semiconductor package and fabrication method thereof

Manufacturing method of semiconductor device

Method of forming a semiconductor device including strain reduced s...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD

DISPLAY PANEL AND DISPLAY DEVICE

DISPLAY PANEL AND DISPLAY DEVICE

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE

DRIVE CHIP AND DISPLAY PANEL

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

BASIN-SHAPED UNDERBUMP PLATES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

Dual-Side Folded Source Driver Outputs of a Display Panel Having a...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

ARRAY SUBSTRATE AND DISPLAY PANEL

Semiconductor Devices and Methods of Forming the Same

DISPLAY DEVICE HAVING A PLURALITY OF PAD TERMINALS

Semiconductor Devices Having a Plurality of First and Second Conduc...

Multiple Band Multiple Mode Transceiver Front End Flip-Chip Archite...

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Display Panel and Display Device Including Display Panel

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

REVERSIBLE SEMICONDUCTOR DIE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

METHOD OF FORMING A SEMICONDUCTOR DEVICE INCLUDING STRAIN REDUCED S...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME