with additional elements

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CPC
H01L2224/05085

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05085with additional elements

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices, semiconductor packages, and methods of manuf...
- Patent number 11,728,297
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with through silicon vias and package-level c...
- Patent number 11,056,467
- Issue date Jul 6, 2021
- Micron Technology, Inc.
- Kevin G. Duesman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, semiconductor packages, and methods of manuf...
- Patent number 11,018,101
- Issue date May 25, 2021
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure and integrated circuit die using the same
- Patent number 10,910,330
- Issue date Feb 2, 2021
- Mediatek Inc.
- Chun-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Expanded head pillar for bump bonds
- Patent number 10,636,758
- Issue date Apr 28, 2020
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process-invariant resistor and capacitor pair
- Patent number 10,553,531
- Issue date Feb 4, 2020
- QUALCOMM Incorporated
- Chao Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and ball bonder
- Patent number 10,497,662
- Issue date Dec 3, 2019
- ABLIC Inc.
- Tomomitsu Risaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with through silicon vias and package-level c...
- Patent number 10,483,241
- Issue date Nov 19, 2019
- Micron Technology, Inc.
- Kevin G. Duesman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of integrating power module with in...
- Patent number 10,438,932
- Issue date Oct 8, 2019
- Semiconductor Components Industries, LLC
- Jinchang Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 10,199,338
- Issue date Feb 5, 2019
- Renesas Electronics Corporation
- Taku Kanaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor package structure
- Patent number 10,037,973
- Issue date Jul 31, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hua-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of integrating power module with in...
- Patent number 9,972,607
- Issue date May 15, 2018
- Semiconductor Components Industries, LLC
- Jinchang Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,899,346
- Issue date Feb 20, 2018
- Kabushiki Kaisha Toshiba
- Yoshiharu Shuutoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 9,893,036
- Issue date Feb 13, 2018
- TOSHIBA MEMORY CORPORATION
- Koji Ogiso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device allowing metal layer routing formed directly u...
- Patent number 9,847,294
- Issue date Dec 19, 2017
- Mediatek Inc.
- Chun-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device allowing metal layer routing formed directly u...
- Patent number 9,824,971
- Issue date Nov 21, 2017
- Mediatek Inc.
- Chun-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,721,915
- Issue date Aug 1, 2017
- Mitsubishi Electric Corporation
- Motoru Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure with dense via array
- Patent number 9,711,468
- Issue date Jul 18, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Han Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 9,698,103
- Issue date Jul 4, 2017
- Toyota Jidosha Kabushiki Kaisha
- Shinya Iwasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal pad offset for multi-layer metal layout
- Patent number 9,659,859
- Issue date May 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Chih Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 9,627,323
- Issue date Apr 18, 2017
- Toyota Jidosha Kabushiki Kaisha
- Shinya Iwasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure of a semiconductor device, method of manufacturing th...
- Patent number 9,570,411
- Issue date Feb 14, 2017
- Samsung Electronics Co., Ltd.
- Nam-Gyu Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumps for chip scale packaging including under bump metal structure...
- Patent number 9,553,065
- Issue date Jan 24, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device allowing metal layer routing formed directly u...
- Patent number 9,455,226
- Issue date Sep 27, 2016
- Mediatek Inc.
- Chun-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package and method for forming same
- Patent number 9,437,574
- Issue date Sep 6, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Tu-Anh N. Tran
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device
- Patent number 9,412,710
- Issue date Aug 9, 2016
- SII Semiconductor Corporation
- Sukehiro Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure of a semiconductor device, method of manufacturing th...
- Patent number 9,202,794
- Issue date Dec 1, 2015
- Samsung Electronics Co., Ltd.
- Nam-Gyu Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure with dense via array
- Patent number 9,041,204
- Issue date May 26, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Han Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 8,669,659
- Issue date Mar 11, 2014
- Renesas Electronics Corporation
- Taku Kanaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure for semiconductor devices
- Patent number 8,476,764
- Issue date Jul 2, 2013
- Nanya Technology Corp.
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...
- Publication number 20240304603
- Publication date Sep 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jinchang ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER STACKING WAFER BONDING STRUCTURE AND METHOD OF MANUFACTU...
- Publication number 20240162035
- Publication date May 16, 2024
- Powerchip Semiconductor Manufacturing Corporation
- Shou-Zen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...
- Publication number 20240072008
- Publication date Feb 29, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jinchang ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PAD STRUCTURE RESISTANT TO PLASMA DAMAGE...
- Publication number 20240014154
- Publication date Jan 11, 2024
- RICHTEK TECHNOLOGY CORPORATION
- Wu-Te WENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDED HEAD PILLAR FOR BUMP BONDS
- Publication number 20200258856
- Publication date Aug 13, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS-INVARIANT RESISTOR AND CAPACITOR PAIR
- Publication number 20190089030
- Publication date Mar 21, 2019
- QUALCOMM Incorporated
- Chao Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND BALL BONDER
- Publication number 20180294243
- Publication date Oct 11, 2018
- SII Semiconductor Corporation
- Tomomitsu RISAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...
- Publication number 20180240786
- Publication date Aug 23, 2018
- Semiconductor Components Industries, LLC
- Jinchang ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...
- Publication number 20180233491
- Publication date Aug 16, 2018
- Semiconductor Components Industries, LLC
- Jinchang ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140217601
- Publication date Aug 7, 2014
- MEDIATEK INC.
- Chun-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bumps for Chip Scale Packaging
- Publication number 20140191394
- Publication date Jul 10, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20140159245
- Publication date Jun 12, 2014
- RENESAS ELECTRONICS CORPORATION
- Taku KANAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD STRUCTURE OF A SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING TH...
- Publication number 20130277833
- Publication date Oct 24, 2013
- Samsung Electronics Co., Ltd.
- Nam-Gyu BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD STRUCTURE WITH DENSE VIA ARRAY
- Publication number 20130256893
- Publication date Oct 3, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Han TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bumps for Chip Scale Packaging
- Publication number 20130119532
- Publication date May 16, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD STRUCTURE FOR SEMICONDUCTOR DEVICES
- Publication number 20130069235
- Publication date Mar 21, 2013
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20120205788
- Publication date Aug 16, 2012
- RENESAS ELECTRONICS CORPORATION HITACHI ULSI SYSTEMS CO., LTD.
- TAKU KANAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING CONDUCTIVE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110143531
- Publication date Jun 16, 2011
- J. B. CHYI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTORING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20100277192
- Publication date Nov 4, 2010
- Renesas Technology Corp.
- Akio HASEBE
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20100252924
- Publication date Oct 7, 2010
- RENESAS TECHNOLOGY CORP.
- Taku Kanaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20090108464
- Publication date Apr 30, 2009
- Elpida Memory, Inc.
- Shiro Uchiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20090057890
- Publication date Mar 5, 2009
- Honda Motor Co., Ltd.
- Takanori MAEBASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20090017565
- Publication date Jan 15, 2009
- Akio Hasebe
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE HAVING ELECTRICAL CONNECTING PADS
- Publication number 20080290528
- Publication date Nov 27, 2008
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE ACOUSTIC WAVE DEVICE AND BOUNDARY ACOUSTIC WAVE DEVICE
- Publication number 20080266023
- Publication date Oct 30, 2008
- Murata Manufacturing Co., Ltd.
- Nobuhira TANAKA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
LIGHT EMITTING APPARATUS AND METHOD FOR MANUFACTURING SAME
- Publication number 20080246051
- Publication date Oct 9, 2008
- Kabushiki Kaisha Toshiba
- Tadaaki Hosokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER CONNECTOR STRUCTURE AND METHOD
- Publication number 20080248643
- Publication date Oct 9, 2008
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20080230899
- Publication date Sep 25, 2008
- SANYO ELECTRIC CO., LTD.
- Yoshimasa Amatatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and fabrication process thereof
- Publication number 20080213945
- Publication date Sep 4, 2008
- FUJITSU LIMITED
- Tomoyuki Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging conductive structure and method for manufacturing the same
- Publication number 20080197489
- Publication date Aug 21, 2008
- ChipMOS TECHNOLOGIES INC.
- J. B. Chyi
- H01 - BASIC ELECTRIC ELEMENTS

with additional elements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor devices, semiconductor packages, and methods of manuf...

Semiconductor devices with through silicon vias and package-level c...

Semiconductor devices, semiconductor packages, and methods of manuf...

Pad structure and integrated circuit die using the same

Expanded head pillar for bump bonds

Process-invariant resistor and capacitor pair

Semiconductor device and ball bonder

Semiconductor devices with through silicon vias and package-level c...

Semiconductor device and method of integrating power module with in...

Semiconductor device and a method of manufacturing the same

Method for manufacturing semiconductor package structure

Semiconductor device and method of integrating power module with in...

Semiconductor device

Semiconductor device and manufacturing method of semiconductor device

Semiconductor device allowing metal layer routing formed directly u...

Semiconductor device allowing metal layer routing formed directly u...

Semiconductor device

Bonding pad structure with dense via array

Semiconductor device and manufacturing method therefor

Metal pad offset for multi-layer metal layout

Semiconductor device and manufacturing method therefor

Pad structure of a semiconductor device, method of manufacturing th...

Bumps for chip scale packaging including under bump metal structure...

Semiconductor device allowing metal layer routing formed directly u...

Electronic component package and method for forming same

Semiconductor device

Pad structure of a semiconductor device, method of manufacturing th...

Bonding pad structure with dense via array

Semiconductor device and a method of manufacturing the same

Bonding pad structure for semiconductor devices

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...

MULTILAYER STACKING WAFER BONDING STRUCTURE AND METHOD OF MANUFACTU...

SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...

SEMICONDUCTOR DEVICE WITH PAD STRUCTURE RESISTANT TO PLASMA DAMAGE...

EXPANDED HEAD PILLAR FOR BUMP BONDS

PROCESS-INVARIANT RESISTOR AND CAPACITOR PAIR

SEMICONDUCTOR DEVICE AND BALL BONDER

SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...

SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...

SEMICONDUCTOR DEVICE

Bumps for Chip Scale Packaging

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

PAD STRUCTURE OF A SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING TH...

BONDING PAD STRUCTURE WITH DENSE VIA ARRAY

Bumps for Chip Scale Packaging

BONDING PAD STRUCTURE FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

PACKAGING CONDUCTIVE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

MANUFACTORING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR PACKAGE SUBSTRATE HAVING ELECTRICAL CONNECTING PADS

SURFACE ACOUSTIC WAVE DEVICE AND BOUNDARY ACOUSTIC WAVE DEVICE

LIGHT EMITTING APPARATUS AND METHOD FOR MANUFACTURING SAME

SOLDER CONNECTOR STRUCTURE AND METHOD

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor device and fabrication process thereof

Packaging conductive structure and method for manufacturing the same