with an intermediate bond

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H01L2224/48139

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48139with an intermediate bond

Industries

Patents Grantslast 30 patents

Information Patent Grant
Power module with graphite plate
- Patent number 12,107,029
- Issue date Oct 1, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,087,739
- Issue date Sep 10, 2024
- Mitsubishi Electric Corporation
- Toshiya Tadakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modularized power amplifier devices and architectures
- Patent number 11,967,937
- Issue date Apr 23, 2024
- Viasat, Inc.
- Shih Peng Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising PN junction diode and Schottky barr...
- Patent number 11,894,349
- Issue date Feb 6, 2024
- Rohm Co., Ltd.
- Keiji Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,887,902
- Issue date Jan 30, 2024
- Fuji Electric Co., Ltd.
- Satoshi Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure formed with inductance elements
- Patent number 11,869,854
- Issue date Jan 9, 2024
- United Microelectronics Corporation
- Chien-Ming Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,804,478
- Issue date Oct 31, 2023
- Rohm Co., Ltd.
- Yuji Ishimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,776,936
- Issue date Oct 3, 2023
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method for manufacturing same
- Patent number 11,749,581
- Issue date Sep 5, 2023
- Fuji Electric Co., Ltd.
- Yuhei Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with connection lug
- Patent number 11,728,250
- Issue date Aug 15, 2023
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,728,231
- Issue date Aug 15, 2023
- Fuji Electric Co., Ltd.
- Yoshinori Otomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with elastic coupler and related methods
- Patent number 11,569,140
- Issue date Jan 31, 2023
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and method of manufacturing the same, and power conver...
- Patent number 11,562,979
- Issue date Jan 24, 2023
- Mitsubishi Electric Corporation
- Chika Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a switching element in a first eleme...
- Patent number 11,538,802
- Issue date Dec 27, 2022
- Mitsubishi Electric Corporation
- Mituharu Tabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising PN junction diode and Schottky barr...
- Patent number 11,502,063
- Issue date Nov 15, 2022
- Rohm Co., Ltd.
- Keiji Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,437,354
- Issue date Sep 6, 2022
- ROHM Co, Ltd.
- Yuji Ishimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 11,387,173
- Issue date Jul 12, 2022
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image capturing assembly and packaging method thereof, lens module,...
- Patent number 11,296,141
- Issue date Apr 5, 2022
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Da Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with MOSFET body diode on which energization test can...
- Patent number 11,251,178
- Issue date Feb 15, 2022
- Mitsubishi Electric Corporation
- Seiya Sugimachi
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device
- Patent number 11,233,037
- Issue date Jan 25, 2022
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,177,224
- Issue date Nov 16, 2021
- Fuji Electric Co., Ltd.
- Toshio Denta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,171,122
- Issue date Nov 9, 2021
- Fuji Electric Co., Ltd.
- Shunta Horie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low switching loss high performance power module
- Patent number 11,171,229
- Issue date Nov 9, 2021
- Cree, Inc.
- Mrinal K. Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method and soldering support jig
- Patent number 11,164,846
- Issue date Nov 2, 2021
- Fuji Electric Co., Ltd.
- Rikihiro Maruyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,127,696
- Issue date Sep 21, 2021
- Mitsubishi Electric Corporation
- Haruhiko Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of a phase-change material for limiting the temperature...
- Patent number 11,085,376
- Issue date Aug 10, 2021
- SAFRAN HELICOPTER ENGINES
- Thomas Klonowski
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Grant
Method of manufacturing semiconductor module and semiconductor module
- Patent number 11,037,847
- Issue date Jun 15, 2021
- Renesas Electronics Corporation
- Kuniharu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Half-bridge module with coaxial arrangement of the DC terminals
- Patent number 11,018,117
- Issue date May 25, 2021
- ABB Power Grids Switzerland AG
- Fabian Mohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductive connection structure for use in an integrated circuit
- Patent number 10,991,654
- Issue date Apr 27, 2021
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic component and method of producing same
- Patent number 10,923,640
- Issue date Feb 16, 2021
- OSRAM OLED GmbH
- Thomas Schwarz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR ASSEMBLY COMPRISING AT LEAST TWO SEMICONDUCTOR ELEMENTS
- Publication number 20240379573
- Publication date Nov 14, 2024
- SIEMENS AKTIENGESELLSCHAFT
- MICHAEL ENDRES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH BALANCED CURRENT FLOW
- Publication number 20240379526
- Publication date Nov 14, 2024
- Navitas Semiconductor Limited
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULARIZED POWER AMPLIFIER DEVICES AND ARCHITECTURE
- Publication number 20240356501
- Publication date Oct 24, 2024
- ViaSat, Inc.
- Shih Peng SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID MULTI-DIE QFP-QFN PACKAGE
- Publication number 20240297147
- Publication date Sep 5, 2024
- STMicroelectronics International N.V.
- Shei Meng LOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240290759
- Publication date Aug 29, 2024
- Power Master Semiconductor Co., Ltd.
- Taekkeun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240266315
- Publication date Aug 8, 2024
- Mitsubishi Electric Corporation
- Kazuya OKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...
- Publication number 20240120322
- Publication date Apr 11, 2024
- Rohm Co., Ltd.
- Keiji Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH DECOUPLING CAPACITOR STRUCTURE AND METHOD...
- Publication number 20240088111
- Publication date Mar 14, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE WITH STACKED DIRECT BONDED METAL SUBSTRATES
- Publication number 20240088007
- Publication date Mar 14, 2024
- Semiconductor Components Industries, LLC
- Jonghwan BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH DECOUPLING CAPACITOR STRUCTURE AND METHOD...
- Publication number 20240088113
- Publication date Mar 14, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240071997
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Joonghyun BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATED POWER CHIP BASED ON WAFER LEVEL PACKAGING AND METHOD OF MA...
- Publication number 20240014126
- Publication date Jan 11, 2024
- UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
- Lin CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230420428
- Publication date Dec 28, 2023
- ROHM CO., LTD.
- Yuji ISHIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230402432
- Publication date Dec 14, 2023
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR DETERMINING DETERIORATION OF SE...
- Publication number 20230369142
- Publication date Nov 16, 2023
- Fuji Electric Co., Ltd.
- Motohito HORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230343770
- Publication date Oct 26, 2023
- Fuji Electric Co., Ltd.
- Nobuharu KUSAKARI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20230335457
- Publication date Oct 19, 2023
- BYD SEMICONDUCTOR COMPANY LIMITED
- Shoucao SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230298990
- Publication date Sep 21, 2023
- Rohm Co., Ltd.
- Akihiro KOGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230260952
- Publication date Aug 17, 2023
- Mitsubishi Electric Corporation
- Hideki YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230096381
- Publication date Mar 30, 2023
- Fuji Electric Co., Ltd.
- Hiroaki ICHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR UNIT AND SEMICONDUCTOR DEVICE
- Publication number 20230087499
- Publication date Mar 23, 2023
- Fuji Electric Co., Ltd.
- Taichi ITOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CIRCUIT MODULE
- Publication number 20230052830
- Publication date Feb 16, 2023
- Semiconductor Components Industries, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...
- Publication number 20230025045
- Publication date Jan 26, 2023
- Rohm Co., Ltd.
- Keiji Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical Receiving Circuit
- Publication number 20230005897
- Publication date Jan 5, 2023
- Nippon Telegraph and Telephone Corporation
- Atsushi Kanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Connection Lug
- Publication number 20220375830
- Publication date Nov 24, 2022
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220328464
- Publication date Oct 13, 2022
- ROHM CO., LTD.
- Yuji ISHIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR CHIP
- Publication number 20220328444
- Publication date Oct 13, 2022
- Fuji Electric Co., Ltd.
- Akio YAMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES
- Publication number 20220320032
- Publication date Oct 6, 2022
- STMicroelectronics S.r.l.
- Agatino Minotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20220319952
- Publication date Oct 6, 2022
- Rohm Co., Ltd.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220301955
- Publication date Sep 22, 2022
- Fuji Electric Co., Ltd.
- Satoshi KANEKO
- H01 - BASIC ELECTRIC ELEMENTS

with an intermediate bond

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power module with graphite plate

Semiconductor device

Modularized power amplifier devices and architectures

Semiconductor device comprising PN junction diode and Schottky barr...

Semiconductor device

Semiconductor structure formed with inductance elements

Semiconductor device

Semiconductor device

Semiconductor module and method for manufacturing same

Semiconductor package with connection lug

Semiconductor module

Semiconductor package with elastic coupler and related methods

Power module and method of manufacturing the same, and power conver...

Semiconductor device including a switching element in a first eleme...

Semiconductor device comprising PN junction diode and Schottky barr...

Semiconductor device

Method for manufacturing semiconductor device

Image capturing assembly and packaging method thereof, lens module,...

Power module with MOSFET body diode on which energization test can...

Semiconductor device

Method of manufacturing semiconductor device

Semiconductor device

Low switching loss high performance power module

Semiconductor device manufacturing method and soldering support jig

Semiconductor device

Integration of a phase-change material for limiting the temperature...

Method of manufacturing semiconductor module and semiconductor module

Half-bridge module with coaxial arrangement of the DC terminals

Inductive connection structure for use in an integrated circuit

Optoelectronic component and method of producing same

Patents Applicationslast 30 patents

SEMICONDUCTOR ASSEMBLY COMPRISING AT LEAST TWO SEMICONDUCTOR ELEMENTS

POWER MODULE WITH BALANCED CURRENT FLOW

MODULARIZED POWER AMPLIFIER DEVICES AND ARCHITECTURE

HYBRID MULTI-DIE QFP-QFN PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...

SEMICONDUCTOR DEVICE WITH DECOUPLING CAPACITOR STRUCTURE AND METHOD...

POWER MODULE PACKAGE WITH STACKED DIRECT BONDED METAL SUBSTRATES

SEMICONDUCTOR DEVICE WITH DECOUPLING CAPACITOR STRUCTURE AND METHOD...

SEMICONDUCTOR PACKAGE

ISOLATED POWER CHIP BASED ON WAFER LEVEL PACKAGING AND METHOD OF MA...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR DETERMINING DETERIORATION OF SE...

SEMICONDUCTOR MODULE

POWER MODULE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR UNIT AND SEMICONDUCTOR DEVICE

POWER CIRCUIT MODULE

SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...

Optical Receiving Circuit

Semiconductor Package with Connection Lug

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR CHIP

CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES

POWER MODULE

SEMICONDUCTOR DEVICE