with an intermediate bond

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CPC
H01L2224/48147

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48147with an intermediate bond

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device assemblies and systems with one or more dies a...
- Patent number 12,125,816
- Issue date Oct 22, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack with cascade and vertical connections
- Patent number 12,068,283
- Issue date Aug 20, 2024
- Intel Corporation
- Min-Tih Ted Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with unbalanced die stackup
- Patent number 12,027,497
- Issue date Jul 2, 2024
- Western Digital Technologies, Inc.
- Haiyue Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 12,009,344
- Issue date Jun 11, 2024
- SK hynix Inc.
- Jin Kyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die stack having bent wires and vertical wires and a...
- Patent number 11,908,825
- Issue date Feb 20, 2024
- SK hynix Inc.
- Jeong Hyun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 11,901,348
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Tae-Ho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and test method of semiconductor device
- Patent number 11,892,503
- Issue date Feb 6, 2024
- Toshiba Tec Kabushiki Kaisha
- Takuya Kusaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies with systems and methods for managing high...
- Patent number 11,710,722
- Issue date Jul 25, 2023
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device having a semiconduc...
- Patent number 11,688,659
- Issue date Jun 27, 2023
- Kioxia Corporation
- Yoshiaki Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,676,904
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Jiwon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 11,658,149
- Issue date May 23, 2023
- SK hynix Inc.
- Jin Kyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with multiple substrates and die stacks
- Patent number 11,562,987
- Issue date Jan 24, 2023
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, receiver and transmitter
- Patent number 11,508,686
- Issue date Nov 22, 2022
- Thine Electronics, Inc.
- Hideyuki Kokatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Straight wirebonding of silicon dies
- Patent number 11,456,272
- Issue date Sep 27, 2022
- Western Digital Technologies, Inc.
- Kirubakaran Periyannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory scaling semiconductor device
- Patent number 11,444,062
- Issue date Sep 13, 2022
- SanDisk Technologies LLC
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,437,351
- Issue date Sep 6, 2022
- Kioxia Corporation
- Yasuo Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with die-skipping wire bonds
- Patent number 11,362,063
- Issue date Jun 14, 2022
- Western Digital Technologies, Inc.
- Xinzhi Xing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack with cascade and vertical connections
- Patent number 11,171,114
- Issue date Nov 9, 2021
- Intel Corporation
- Min-Tih Ted Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip like integrated passive prepackage for SIP device
- Patent number 11,101,254
- Issue date Aug 24, 2021
- Intel Corporation
- Zhicheng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory scaling semiconductor device
- Patent number 11,094,674
- Issue date Aug 17, 2021
- SanDisk Technologies LLC
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies including multiple shingled stacks...
- Patent number 11,094,670
- Issue date Aug 17, 2021
- Micron Technology, Inc.
- Hong Wan Ng
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory scaling semiconductor device
- Patent number 11,011,500
- Issue date May 18, 2021
- SanDisk Technologies LLC
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method and wire bonding apparatus
- Patent number 11,004,821
- Issue date May 11, 2021
- Shinkawa Ltd.
- Yusuke Maruya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Memory scaling semiconductor device
- Patent number 11,004,829
- Issue date May 11, 2021
- SanDisk Technologies LLC
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing process for separating logic and memory array
- Patent number 10,930,607
- Issue date Feb 23, 2021
- Western Digital Technologies, Inc.
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DRAM memory chips quick optical erasure
- Patent number 10,872,655
- Issue date Dec 22, 2020
- Goran Krilic
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor devices with post-probe configurability
- Patent number 10,811,372
- Issue date Oct 20, 2020
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of operating microelectronic devices including a controller
- Patent number 10,811,387
- Issue date Oct 20, 2020
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 10,777,479
- Issue date Sep 15, 2020
- TOSHIBA MEMORY CORPORATION
- Yoshiaki Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging structure and manufacturing method for the same
- Patent number 10,651,146
- Issue date May 12, 2020
- Dawning Leading Technology Inc.
- Diann-Fang Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240421061
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Jongyoun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING A SEMICONDUCTOR P...
- Publication number 20240404935
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Seunghun Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY REGULATED SEMICONDUCTOR DEVICE
- Publication number 20240347413
- Publication date Oct 17, 2024
- Micron Technology, Inc.
- Chen Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGING METHOD AND PACKAGING STRUCTURE OF STACKED CHIPS T...
- Publication number 20240321704
- Publication date Sep 26, 2024
- TONGFU MICROELECTRONICS CO., LTD.
- Maohua DU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERTER APPARATUS
- Publication number 20240304530
- Publication date Sep 12, 2024
- Fuji Electric Co., Ltd.
- Hisato INOKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID MULTI-DIE QFP-QFN PACKAGE
- Publication number 20240297147
- Publication date Sep 5, 2024
- STMicroelectronics International N.V.
- Shei Meng LOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
- Publication number 20240282756
- Publication date Aug 22, 2024
- SK HYNIX INC.
- Jin Kyoung PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES WITH DOWNSET
- Publication number 20240282751
- Publication date Aug 22, 2024
- Micron Technology, Inc.
- Ling Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACILITATOR DIES FOR HETEROGENEOUS DIE STACKS
- Publication number 20240250070
- Publication date Jul 25, 2024
- International Business Machines Corporation
- Kyu-hyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUFFER CHIP, AND SEMICONDUCTOR PACKAGE INCLUDING THE BUFFER CHIP AN...
- Publication number 20240249753
- Publication date Jul 25, 2024
- SK HYNIX INC.
- Choung Ki SONG
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240222324
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Hyunjun NOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING REINFORCING STRUCTURE
- Publication number 20240213179
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Jaewoo Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGING FOR A MULTICHIP PACKAGE
- Publication number 20240145457
- Publication date May 2, 2024
- Micron Technology, Inc.
- Faxing CHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID-REPELLING COATING FOR UNDERFILL BLEED OUT CONTROL
- Publication number 20240145422
- Publication date May 2, 2024
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP STACK STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUD...
- Publication number 20240105680
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Junyoung Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240105578
- Publication date Mar 28, 2024
- ROHM CO., LTD.
- Kohei TANIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH DECOUPLING CAPACITOR STRUCTURE AND METHOD...
- Publication number 20240088111
- Publication date Mar 14, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH DECOUPLING CAPACITOR STRUCTURE AND METHOD...
- Publication number 20240088113
- Publication date Mar 14, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NAND DIE WITH RDL FOR ALTERED BOND WIRE BANDWIDTH IN MEMORY DEVICES
- Publication number 20240079318
- Publication date Mar 7, 2024
- Western Digital Technologies, Inc.
- Md. Sayed Mobin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE
- Publication number 20240079380
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Joonghyun BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR SYSTEMS IN PACKAGES, AND ASSOCIATED DEVICES, SYSTEMS, AND M...
- Publication number 20240072024
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES, ASSEMBLIES, AND ASSOCIATED METHODS
- Publication number 20240072002
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Raj K. Bansal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240071997
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Joonghyun BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING AN ADHESIVE STRUCTURE
- Publication number 20240014164
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- Jooyoung OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20230420352
- Publication date Dec 28, 2023
- Samsung Electronics Co., Ltd.
- Yeongbeom KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230387029
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- JIWON SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSS STACK BRIDGE BONDING DEVICES AND ASSOCIATED METHODS
- Publication number 20230378128
- Publication date Nov 23, 2023
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH STACK BRIDGE BONDING DEVICES AND ASSOCIATED METHODS
- Publication number 20230378129
- Publication date Nov 23, 2023
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH SYSTEMS AND METHODS FOR MANAGING HIGH...
- Publication number 20230369291
- Publication date Nov 16, 2023
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND TEST METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20230296669
- Publication date Sep 21, 2023
- KIOXIA Corporation
- Takuya KUSAKA
- H01 - BASIC ELECTRIC ELEMENTS

with an intermediate bond

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device assemblies and systems with one or more dies a...

Die stack with cascade and vertical connections

Semiconductor device with unbalanced die stackup

Semiconductor package including stacked semiconductor chips

Semiconductor die stack having bent wires and vertical wires and a...

Semiconductor package and method of manufacturing the semiconductor...

Semiconductor device and test method of semiconductor device

Semiconductor assemblies with systems and methods for managing high...

Method for manufacturing a semiconductor device having a semiconduc...

Semiconductor package

Semiconductor package including stacked semiconductor chips

Semiconductor devices with multiple substrates and die stacks

Semiconductor device, receiver and transmitter

Straight wirebonding of silicon dies

Memory scaling semiconductor device

Semiconductor device

Semiconductor device with die-skipping wire bonds

Die stack with cascade and vertical connections

Flip-chip like integrated passive prepackage for SIP device

Memory scaling semiconductor device

Semiconductor device assemblies including multiple shingled stacks...

Memory scaling semiconductor device

Wire bonding method and wire bonding apparatus

Memory scaling semiconductor device

Manufacturing process for separating logic and memory array

DRAM memory chips quick optical erasure

Semiconductor devices with post-probe configurability

Methods of operating microelectronic devices including a controller

Semiconductor memory device

Chip packaging structure and manufacturing method for the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING A SEMICONDUCTOR P...

THERMALLY REGULATED SEMICONDUCTOR DEVICE

FAN-OUT PACKAGING METHOD AND PACKAGING STRUCTURE OF STACKED CHIPS T...

POWER CONVERTER APPARATUS

HYBRID MULTI-DIE QFP-QFN PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS

SUBSTRATES WITH DOWNSET

FACILITATOR DIES FOR HETEROGENEOUS DIE STACKS

BUFFER CHIP, AND SEMICONDUCTOR PACKAGE INCLUDING THE BUFFER CHIP AN...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE HAVING REINFORCING STRUCTURE

FAN-OUT PACKAGING FOR A MULTICHIP PACKAGE

LIQUID-REPELLING COATING FOR UNDERFILL BLEED OUT CONTROL

SEMICONDUCTOR CHIP STACK STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUD...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH DECOUPLING CAPACITOR STRUCTURE AND METHOD...

SEMICONDUCTOR DEVICE WITH DECOUPLING CAPACITOR STRUCTURE AND METHOD...

NAND DIE WITH RDL FOR ALTERED BOND WIRE BANDWIDTH IN MEMORY DEVICES

STACKED SEMICONDUCTOR PACKAGE

MODULAR SYSTEMS IN PACKAGES, AND ASSOCIATED DEVICES, SYSTEMS, AND M...

SEMICONDUCTOR DEVICES, ASSEMBLIES, AND ASSOCIATED METHODS

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING AN ADHESIVE STRUCTURE

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR PACKAGE

CROSS STACK BRIDGE BONDING DEVICES AND ASSOCIATED METHODS

THROUGH STACK BRIDGE BONDING DEVICES AND ASSOCIATED METHODS

SEMICONDUCTOR ASSEMBLIES WITH SYSTEMS AND METHODS FOR MANAGING HIGH...

SEMICONDUCTOR DEVICE AND TEST METHOD OF SEMICONDUCTOR DEVICE