with at least one step of making the capacitor or connections thereto

Industry

CPC
H01L27/1085

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/1085with at least one step of making the capacitor or connections thereto

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 11,700,726
- Issue date Jul 11, 2023
- Samsung Electronics Co., Ltd.
- Jin Sub Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor structure, method of forming the same, semiconductor devi...
- Patent number 11,695,034
- Issue date Jul 4, 2023
- Samsung Electronics Co., Ltd.
- Seongyul Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuitry, DRAM circuitry
- Patent number 11,683,927
- Issue date Jun 20, 2023
- Micron Technology, Inc.
- Hitoshi Ishigami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 11,678,478
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Youngjun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,676,820
- Issue date Jun 13, 2023
- SK Hynix Inc.
- Oh-Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterostructure oxide semiconductor vertical gate-all-around (VGAA)...
- Patent number 11,672,110
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Gerben Doornbos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,670,707
- Issue date Jun 6, 2023
- Micron Technology, Inc.
- David K. Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,670,673
- Issue date Jun 6, 2023
- Samsung Electronics Co., Ltd.
- Hyun-suk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device having spacer capping pattern disposed...
- Patent number 11,665,883
- Issue date May 30, 2023
- Samsung Electronics Co., Ltd.
- Inkyoung Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intermediate separation layers at the back-end-of-line
- Patent number 11,652,047
- Issue date May 16, 2023
- Intel Corporation
- Travis W. Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory devices
- Patent number 11,653,490
- Issue date May 16, 2023
- Samsung Electronics Co., Ltd.
- Seokho Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device
- Patent number 11,647,627
- Issue date May 9, 2023
- Samsung Electronics Co., Ltd.
- Jiseok Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of fabricating the same
- Patent number 11,646,225
- Issue date May 9, 2023
- Samsung Electronics Co., Ltd.
- Myeong-Dong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and methods for controlling structure of bottom electro...
- Patent number 11,647,624
- Issue date May 9, 2023
- Micron Technology, Inc.
- Akira Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device having a channel provided on a memory unit
- Patent number 11,647,625
- Issue date May 9, 2023
- Samsung Electronics Co., Ltd.
- Jaeho Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory devices and methods of fabricating the same
- Patent number 11,641,730
- Issue date May 2, 2023
- Samsung Electronics Co., Ltd.
- Kyooho Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DRAM and manufacturing method therefore
- Patent number 11,641,731
- Issue date May 2, 2023
- Winbond Electronics Corp.
- Shu-Mei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned etch back for vertical three dimensional (3D) memory
- Patent number 11,641,732
- Issue date May 2, 2023
- Micron Technology, Inc.
- Litao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device using different crystallinities in stor...
- Patent number 11,631,677
- Issue date Apr 18, 2023
- Samsung Electronics Co., Ltd.
- Daeyoung Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded unified semiconductor chips and fabrication and operation me...
- Patent number 11,631,688
- Issue date Apr 18, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device
- Patent number 11,631,679
- Issue date Apr 18, 2023
- United Microelectronics Corp.
- Luo-Hsin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical contacts for semiconductor devices
- Patent number 11,631,681
- Issue date Apr 18, 2023
- Micron Technology, Inc.
- Byung Yoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays comprising memory cells
- Patent number 11,631,678
- Issue date Apr 18, 2023
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and forming method thereof
- Patent number 11,626,408
- Issue date Apr 11, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Shuai Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device, method of manufacturing the same, and...
- Patent number 11,626,498
- Issue date Apr 11, 2023
- Institute of Microelectronics, Chinese Academy of Sciences
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having hybrid capacitors
- Patent number 11,626,405
- Issue date Apr 11, 2023
- Samsung Electronics Co., Ltd.
- Sung Hwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices having a transistor and a capacitor along a common horizont...
- Patent number 11,626,406
- Issue date Apr 11, 2023
- Micron Technology, Inc.
- Fredrick D. Fishburn
- G11 - INFORMATION STORAGE
Information Patent Grant
DRAM with selective epitaxial cell transistor
- Patent number 11,626,407
- Issue date Apr 11, 2023
- Integrated Silicon Solution, (Cayman) Inc.
- Andrew J. Walker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a plurality of electrodes and suppor...
- Patent number 11,626,476
- Issue date Apr 11, 2023
- Samsung Electronics Co., Ltd.
- Ha-young Yi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including capacitor
- Patent number 11,621,339
- Issue date Apr 4, 2023
- Samsung Electronics Co., Ltd.
- Sunmin Moon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC DEVICES INCLUDING CAPACITORS, AND RELATED ELECTRONI...
- Publication number 20240136391
- Publication date Apr 25, 2024
- Micron Technology, Inc.
- Sanket S. Kelkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING 3D MEMORY STRUCTURE
- Publication number 20240121939
- Publication date Apr 11, 2024
- NANYA TECHNOLOGY CORPORATION
- SHIH-FAN KUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAGGERED HORIZONTAL CELL ARCHITECTURE FOR MEMORY DEVICES
- Publication number 20240107748
- Publication date Mar 28, 2024
- Micron Technology, Inc.
- William M. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TUNGSTEN CONTACT PLUGS ABOVE GATE AND SOURCE/DRAIN CONTACTS
- Publication number 20240096698
- Publication date Mar 21, 2024
- QUALCOMM Incorporated
- Junjing BAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORT PILLARS WITH MULTIPLE, ALTERNATING EPITAXIAL SILICON FOR HO...
- Publication number 20240098969
- Publication date Mar 21, 2024
- Micron Technology, Inc.
- David K. Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS COMPRISING A METAL PORTION IN THE TOP PORTION OF CAPACITO...
- Publication number 20240090197
- Publication date Mar 14, 2024
- Micron Technology, Inc.
- Harutaka Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SUPPORTING LAYER AND METHOD FOR FABRICATI...
- Publication number 20240090198
- Publication date Mar 14, 2024
- NANYA TECHNOLOGY CORPORATION
- LIANG-PIN CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF A LATERAL 3D MEMORY DEVICE
- Publication number 20240074141
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Yoshitaka Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING BONDING STRUCTURE AND METHOD OF MANUFAC...
- Publication number 20240074145
- Publication date Feb 29, 2024
- NANYA TECHNOLOGY CORPORATION
- YI-JEN LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEROF
- Publication number 20240074152
- Publication date Feb 29, 2024
- NANYA TECHNOLOGY CORPORATION
- Chiang-Lin SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240064960
- Publication date Feb 22, 2024
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Janbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20240049439
- Publication date Feb 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Chia Che CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...
- Publication number 20240040765
- Publication date Feb 1, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Yue ZHUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING THE MICROELECTRONIC DEVICES, AND RELATED MICROEL...
- Publication number 20240038588
- Publication date Feb 1, 2024
- Micron Technology, Inc.
- Terrence B. McDaniel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240032273
- Publication date Jan 25, 2024
- Fujian Jinhua Integrated Circuit Co., Ltd.
- XUANXUAN CHEN
- G11 - INFORMATION STORAGE
Information Patent Application
Memory device having word line surrounding gate structure and manuf...
- Publication number 20240023321
- Publication date Jan 18, 2024
- NANYA TECHNOLOGY CORPORATION
- Szu-Yao CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ETCHED LANDING PAD SURFACE
- Publication number 20240023307
- Publication date Jan 18, 2024
- NANYA TECHNOLOGY CORPORATION
- YEN-HO CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND FORMING METHOD THEREOF
- Publication number 20240023310
- Publication date Jan 18, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Min LI
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240015952
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhon Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE PATTERNING CYLINDRICAL TRANSISTOR AND CAPACITOR DYNAMIC RAND...
- Publication number 20240008251
- Publication date Jan 4, 2024
- Intel Corporation
- Abhishek Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240008246
- Publication date Jan 4, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- YI JIANG
- G11 - INFORMATION STORAGE
Information Patent Application
MANUFACTURING METHOD MEMORY DEVICE HAVING LATERALLY EXTENDING CAPAC...
- Publication number 20240006471
- Publication date Jan 4, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20230422465
- Publication date Dec 28, 2023
- Changxin Memory Technologies, Inc.
- Guangsu SHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor memory device and method of fabricating the same
- Publication number 20230422475
- Publication date Dec 28, 2023
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Liandie Zhuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR SAME
- Publication number 20230422478
- Publication date Dec 28, 2023
- Changxin Memory Technologies, Inc.
- Kang YOU
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY AND FORMING METHOD THEREOF
- Publication number 20230422474
- Publication date Dec 28, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Yi TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING MEMORY DEVICE WITH MULTILAYERED CAPACITOR DIEL...
- Publication number 20230413509
- Publication date Dec 21, 2023
- NANYA TECHNOLOGY CORPORATION
- CHIH-HSIUNG HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY AND FORMING METHOD THEREOF
- Publication number 20230413512
- Publication date Dec 21, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Yi TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE WITH VOID-FREE CONDUCTIV...
- Publication number 20230413533
- Publication date Dec 21, 2023
- NANYA TECHNOLOGY CORPORATION
- CHENG-YAN JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF
- Publication number 20230413514
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Katherine H. Chiang
- H01 - BASIC ELECTRIC ELEMENTS

with at least one step of making the capacitor or connections thereto

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Capacitor structure, method of forming the same, semiconductor devi...

Integrated circuitry, DRAM circuitry

Semiconductor devices

Semiconductor device and method for fabricating the same

Heterostructure oxide semiconductor vertical gate-all-around (VGAA)...

Integrated assemblies and methods of forming integrated assemblies

Semiconductor device

Semiconductor memory device having spacer capping pattern disposed...

Intermediate separation layers at the back-end-of-line

Semiconductor memory devices

Integrated circuit device

Semiconductor devices and methods of fabricating the same

Apparatuses and methods for controlling structure of bottom electro...

Memory device having a channel provided on a memory unit

Semiconductor memory devices and methods of fabricating the same

DRAM and manufacturing method therefore

Self-aligned etch back for vertical three dimensional (3D) memory

Semiconductor memory device using different crystallinities in stor...

Bonded unified semiconductor chips and fabrication and operation me...

Semiconductor device

Vertical contacts for semiconductor devices

Memory arrays comprising memory cells

Memory device and forming method thereof

Semiconductor memory device, method of manufacturing the same, and...

Semiconductor device having hybrid capacitors

Devices having a transistor and a capacitor along a common horizont...

DRAM with selective epitaxial cell transistor

Semiconductor device including a plurality of electrodes and suppor...

Semiconductor device including capacitor

Patents Applicationslast 30 patents

MICROELECTRONIC DEVICES INCLUDING CAPACITORS, AND RELATED ELECTRONI...

SEMICONDUCTOR DEVICE INCLUDING 3D MEMORY STRUCTURE

STAGGERED HORIZONTAL CELL ARCHITECTURE FOR MEMORY DEVICES

SELECTIVE TUNGSTEN CONTACT PLUGS ABOVE GATE AND SOURCE/DRAIN CONTACTS

SUPPORT PILLARS WITH MULTIPLE, ALTERNATING EPITAXIAL SILICON FOR HO...

APPARATUS COMPRISING A METAL PORTION IN THE TOP PORTION OF CAPACITO...

SEMICONDUCTOR DEVICE WITH SUPPORTING LAYER AND METHOD FOR FABRICATI...

FABRICATION METHOD OF A LATERAL 3D MEMORY DEVICE

SEMICONDUCTOR DEVICE HAVING BONDING STRUCTURE AND METHOD OF MANUFAC...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEROF

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME

METHOD OF FORMING SEMICONDUCTOR STRUCTURE

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...

METHODS OF FORMING THE MICROELECTRONIC DEVICES, AND RELATED MICROEL...

MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

Memory device having word line surrounding gate structure and manuf...

SEMICONDUCTOR DEVICE WITH ETCHED LANDING PAD SURFACE

SEMICONDUCTOR MEMORY DEVICE AND FORMING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SINGLE PATTERNING CYLINDRICAL TRANSISTOR AND CAPACITOR DYNAMIC RAND...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD MEMORY DEVICE HAVING LATERALLY EXTENDING CAPAC...

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

Semiconductor memory device and method of fabricating the same

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR SAME

MEMORY AND FORMING METHOD THEREOF

METHOD FOR PREPARING MEMORY DEVICE WITH MULTILAYERED CAPACITOR DIEL...

MEMORY AND FORMING METHOD THEREOF

METHOD OF FABRICATING SEMICONDUCTOR DEVICE WITH VOID-FREE CONDUCTIV...

INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF