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ELECTRICITY
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Patents Grants
last 30 patents
Information
Patent Grant
Mechanical architecture for a multi-chip module
Patent number
11,973,004
Issue date
Apr 30, 2024
Tesla, Inc.
Robert Yinan Cao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cooling assembly for a computer module
Patent number
11,966,265
Issue date
Apr 23, 2024
EKWB d.o.o.
Joe Robey
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor device
Patent number
11,961,784
Issue date
Apr 16, 2024
Mitsubishi Electric Corporation
Arata Iizuka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit carrier arrangement and method for producing such a circuit...
Patent number
11,961,785
Issue date
Apr 16, 2024
Vitesco Technologies GmbH
Jens Reiter
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including sense insulated-gate bipolar transistor
Patent number
11,942,531
Issue date
Mar 26, 2024
Rohm Co., Ltd.
Akihiro Hikasa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,935,813
Issue date
Mar 19, 2024
Fuji Electric Co., Ltd.
Ryoichi Kato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structures
Patent number
11,923,349
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chi-Hui Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heat sink fastener
Patent number
11,901,265
Issue date
Feb 13, 2024
Southco, Inc.
Richard E. Schlack
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,901,263
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chung-Jung Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reusable holding component for heatsink
Patent number
11,901,261
Issue date
Feb 13, 2024
Illinois Tool Works Inc.
Ming-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Back plate assembly and electronic device
Patent number
11,894,285
Issue date
Feb 6, 2024
Tyco Electronics (Shanghai) Co., Ltd.
Jiefeng Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cooling device
Patent number
11,892,246
Issue date
Feb 6, 2024
Fujitsu Limited
Kento Ohga
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Grant
Imaging unit and imaging apparatus
Patent number
11,887,839
Issue date
Jan 30, 2024
Nikon Corporation
Hirofumi Arima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including resin case having groove at corner t...
Patent number
11,876,033
Issue date
Jan 16, 2024
Mitsubishi Electric Corporation
Takuro Mori
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power device, power device assembly, and related apparatus
Patent number
11,862,531
Issue date
Jan 2, 2024
Huawei Technologies Co., Ltd.
Yankun Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cryostat suspended sample board
Patent number
11,864,352
Issue date
Jan 2, 2024
EQUAL 1 LABORATORIES IRELAND LIMITED
Hans Haenlein
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chamfered die of semiconductor package and method for forming the same
Patent number
11,854,986
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Housing for a power semiconductor module arrangement
Patent number
11,856,718
Issue date
Dec 26, 2023
Infineon Technologies AG
Alexander Herbrandt
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power conversion device having a clip to fix a plurality of switches
Patent number
11,856,738
Issue date
Dec 26, 2023
LG Innotek Co., Ltd
Shin Young Jang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System, device and methods of manufacture
Patent number
11,848,235
Issue date
Dec 19, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual-sided co-packaged optics for high bandwidth networking applica...
Patent number
11,830,863
Issue date
Nov 28, 2023
Intel Corporation
Suresh V. Pothukuchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
11,824,017
Issue date
Nov 21, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Kang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power conversion apparatus
Patent number
11,817,370
Issue date
Nov 14, 2023
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Hayata Onaga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Systems for providing thermal management to integrated circuits
Patent number
11,810,836
Issue date
Nov 7, 2023
Arista Networks, Inc.
Tiffany Doria
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus and method for holding a heat generating device
Patent number
11,776,874
Issue date
Oct 3, 2023
Solaredge Technologies Ltd.
Tomer Kugman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Distributing heatsink load across a processor module with separable...
Patent number
11,776,876
Issue date
Oct 3, 2023
International Business Machines Corporation
Jason R. Eagle
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electric working machine with semiconductor element that completes...
Patent number
11,777,377
Issue date
Oct 3, 2023
Makita Corporation
Akihiro Nakamoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heat-dissipation device allowing easy detachment from heat-generati...
Patent number
11,758,690
Issue date
Sep 12, 2023
Nanning FuLian FuGui Precision Industrial Co., Ltd.
Chih-Yu Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Arrangement for electronic components
Patent number
11,749,580
Issue date
Sep 5, 2023
Audi AG
Daniel Ruppert
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure
Patent number
11,749,582
Issue date
Sep 5, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Yu-Chia Lai
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20240136251
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chung-Jung Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR DEVICE AND METHOD F...
Publication number
20240120255
Publication date
Apr 11, 2024
Hitachi Energy Switzerland AG
Dominik TRUESSEL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electromagnetic Interference Shielding and Sealing for Spring Screw...
Publication number
20240112980
Publication date
Apr 4, 2024
NIO Technology (Anhui) Co., Ltd.
Mohammad Reza Danesh Kadivar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MODULE DEVICE
Publication number
20240105546
Publication date
Mar 28, 2024
Industrial Technology Research Institute
Ji-Yuan Syu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS FOR AN INTERLOCKING FEATURE ON A POWER MODULE
Publication number
20240105547
Publication date
Mar 28, 2024
DELPHI TECHNOLOGIES IP LIMITED
Edward Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING A PRINTE...
Publication number
20240105548
Publication date
Mar 28, 2024
ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
Uwe WALTRICH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HEAT SINK FOR A SEMICONDUCTOR SWITCHING DEVICE, AND SEMICONDUCTOR S...
Publication number
20240087981
Publication date
Mar 14, 2024
SIEMENS AKTIENGESELLSCHAFT
Walter Apfelbacher
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
A METHOD FOR COOLING AN OBJECT, A COOLING DEVICE AND USE OF A COOLI...
Publication number
20240090185
Publication date
Mar 14, 2024
Søren Imer STUBKIER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Chamfered Die of Semiconductor Package and Method for Forming the Same
Publication number
20240088050
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HEAT SPREADER APPARATUS WITH MAGNETIC ATTACHMENTS ON PRINTED WIRING...
Publication number
20240071863
Publication date
Feb 29, 2024
Micron Technology, Inc.
Charles E. Siko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
System, Device and Methods of Manufacture
Publication number
20240071825
Publication date
Feb 29, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR FABRICATING A SEMICONDUCTOR MODULE
Publication number
20240040689
Publication date
Feb 1, 2024
INFINEON TECHNOLOGIES AG
Ramdas Rangnath Ugale
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER CONVERSION APPARATUS
Publication number
20240038628
Publication date
Feb 1, 2024
Panasonic Intellectual Property Management Co., Ltd.
Hayata ONAGA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH RELIABILITY SEMICONDUCTOR PACKAGE DESIGN
Publication number
20240014090
Publication date
Jan 11, 2024
LITTELFUSE, INC.
Thomas Spann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Cooling Cover and Packaged Semiconductor Device Including the Same
Publication number
20230420337
Publication date
Dec 28, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chung-Jung Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BOARD AND ELECTRONIC APPARATUS
Publication number
20230422450
Publication date
Dec 28, 2023
Fujitsu Limited
Shohei Hashimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE WITH PASS THROUGH HEAT SPREADER
Publication number
20230420335
Publication date
Dec 28, 2023
Xilinx, Inc.
Gamal REFAI-AHMED
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BACKSIDE INTEGRATED TORSION LOADING MECHANISM
Publication number
20230395460
Publication date
Dec 7, 2023
Intel Corporation
David Shia
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HEATSINK UNIT, IC SOCKET, METHOD FOR MANUFACTURING SEMICONDUCTOR PA...
Publication number
20230386965
Publication date
Nov 30, 2023
Yamaichi Electronics Co., Ltd.
Koichi MIWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TERMINAL STRUCTURE, METHOD FOR MANUFACTURING TERMINAL STRUCTURE, AN...
Publication number
20230386966
Publication date
Nov 30, 2023
Fuji Electric Co., Ltd.
Tadahiko SATO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20230378098
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Kang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMOCONDUCTIVE MATERIAL AND ELECTRONIC COMPONENT
Publication number
20230352365
Publication date
Nov 2, 2023
Youji SHIRATO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Circuit Carrier Arrangement And Method For Producing Such A Circuit...
Publication number
20230343674
Publication date
Oct 26, 2023
Vitesco Technologies GMBH
Jens Reiter
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Apparatus and Method for Holding a Heat Generating Device
Publication number
20230343675
Publication date
Oct 26, 2023
Solaredge Technologies Ltd.
Tomer Kugman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
High Efficiency Heat Dissipation Using Thermal Interface Material Film
Publication number
20230317552
Publication date
Oct 5, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Battery Disconnect Unit
Publication number
20230309278
Publication date
Sep 28, 2023
LG ENERGY SOLUTION, LTD.
Yong-Hwan Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR APPARATUS AND ELECTRONIC APPARATUS
Publication number
20230309267
Publication date
Sep 28, 2023
Fujitsu Limited
Shinya SASAKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC APPARATUS
Publication number
20230307315
Publication date
Sep 28, 2023
KIOXIA Corporation
Kazuyuki MATSUZAKI
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
HEAT DISSIPATION DEVICE
Publication number
20230307317
Publication date
Sep 28, 2023
AURAS Technology Co., Ltd.
Cheng-Ju CHANG
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Application
Power Semiconductor Module and Method for Producing a Power Semicon...
Publication number
20230307332
Publication date
Sep 28, 2023
Siemens Aktiengesellschaft
Roland LORZ
H01 - BASIC ELECTRIC ELEMENTS