with modification of the same mask

Industry

CPC
H01L2224/11906

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/11906with modification of the same mask

Industries

Patents Grantslast 30 patents

Information Patent Grant
Connector structure and method of forming same
- Patent number 11,824,026
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing interconnect structure
- Patent number 11,121,104
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate device, electronic apparatus, and method for manufacturin...
- Patent number 10,892,241
- Issue date Jan 12, 2021
- Sony Corporation
- Shigekazu Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Collars for under-bump metal structures and associated systems and...
- Patent number 10,886,244
- Issue date Jan 5, 2021
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector structure and method of forming same
- Patent number 10,861,811
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor structure
- Patent number 10,861,711
- Issue date Dec 8, 2020
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector structure and method of forming same
- Patent number 10,388,620
- Issue date Aug 20, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of interconnect structure
- Patent number 9,881,888
- Issue date Jan 30, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector structure and method of forming same
- Patent number 9,646,943
- Issue date May 9, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an integrated circuit device including a pillar c...
- Patent number 9,627,339
- Issue date Apr 18, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interconnect structure w...
- Patent number 9,373,578
- Issue date Jun 21, 2016
- STATS ChipPAC Pte. Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structure
- Patent number 9,331,038
- Issue date May 3, 2016
- Taiwan Semiconductor Manufacturing Company Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with compliant interconnects
- Patent number 9,324,667
- Issue date Apr 26, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Trent S. Uehling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component that includes a protective structure
- Patent number 9,263,390
- Issue date Feb 16, 2016
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor component
- Patent number 9,219,010
- Issue date Dec 22, 2015
- Semiconductor Componenets Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect solder bumps for die testing
- Patent number 9,207,275
- Issue date Dec 8, 2015
- International Business Machines Corporation
- Gerald K. Bartley
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package structure and method for making the same
- Patent number 9,159,660
- Issue date Oct 13, 2015
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a solder and method of fabricating t...
- Patent number 9,159,688
- Issue date Oct 13, 2015
- Samsung Electronics Co., Ltd.
- Jong Yun Myung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device including a copper pillar capped by barri...
- Patent number 9,142,521
- Issue date Sep 22, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interconnect structure o...
- Patent number 9,105,532
- Issue date Aug 11, 2015
- STATS ChipPAC, Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing the same, and method...
- Patent number 9,066,457
- Issue date Jun 23, 2015
- Sony Corporation
- Naoto Sasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly apparatus and associated methods
- Patent number 9,040,348
- Issue date May 26, 2015
- Altera Corporation
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure and electronic packaging solder joint structure and...
- Patent number 9,024,441
- Issue date May 5, 2015
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu pillar bump with electrolytic metal sidewall protection
- Patent number 9,006,097
- Issue date Apr 14, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interconnect structure o...
- Patent number 8,890,315
- Issue date Nov 18, 2014
- STATS ChipPAC, Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with means for preventing solder bridges, and...
- Patent number 8,829,688
- Issue date Sep 9, 2014
- Shinko Electric Industries Co., Ltd.
- Yoshihiro Machida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interconnect structure w...
- Patent number 8,709,935
- Issue date Apr 29, 2014
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board, fabricating method thereof and package structure
- Patent number 8,674,503
- Issue date Mar 18, 2014
- Himax Technologies Limited
- Pai-Sheng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for making the same
- Patent number 8,658,466
- Issue date Feb 25, 2014
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device including a copper pillar capped by barri...
- Patent number 8,653,659
- Issue date Feb 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...
- Publication number 20210151400
- Publication date May 20, 2021
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connector Structure and Method of Forming Same
- Publication number 20210118833
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connector Structure and Method of Forming Same
- Publication number 20190279953
- Publication date Sep 12, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING INTERCONNECT STRUCTURE
- Publication number 20180151523
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- MENG-TSE CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL PILLAR STRUCTURE FOR USE IN PACKAGING INTEGRATED CIRCUIT PROD...
- Publication number 20140264890
- Publication date Sep 18, 2014
- GLOBALFOUNDRIES INC.
- Dirk Breuer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20140217580
- Publication date Aug 7, 2014
- Samsung Electronics Co., Ltd.
- Jong Yun MYUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Interconnect Structure w...
- Publication number 20140175642
- Publication date Jun 26, 2014
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT SOLDER BUMPS FOR DIE TESTING
- Publication number 20140167808
- Publication date Jun 19, 2014
- International Business Machines Corporation
- Gerald K. Bartley
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING A COPPER PILLAR CAPPED BY BARRI...
- Publication number 20140124924
- Publication date May 8, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME
- Publication number 20140027905
- Publication date Jan 30, 2014
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Interconnect Structure O...
- Publication number 20140008791
- Publication date Jan 9, 2014
- STATS ChipPAC, Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME
- Publication number 20130334681
- Publication date Dec 19, 2013
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP CONNECTION STRUCTURE AND METHOD OF FORMING
- Publication number 20130299989
- Publication date Nov 14, 2013
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CU PILLAR BUMP WITH ELECTROLYTIC METAL SIDEWALL PROTECTION
- Publication number 20130295762
- Publication date Nov 7, 2013
- Wen-Hsiung LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING FINE-PITCH BUMPS AND STRUCTURE THEREOF
- Publication number 20130256882
- Publication date Oct 3, 2013
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING FINE-PITCH BUMPS AND STRUCTURE THEREOF
- Publication number 20130249089
- Publication date Sep 26, 2013
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING FINE-PITCH BUMPS AND STRUCTURE THEREOF
- Publication number 20130249081
- Publication date Sep 26, 2013
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT
- Publication number 20130244418
- Publication date Sep 19, 2013
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component that includes a protective structure
- Publication number 20130234311
- Publication date Sep 12, 2013
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMPING PROCESS AND STRUCTURE THEREOF
- Publication number 20130181346
- Publication date Jul 18, 2013
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMPING PROCESS
- Publication number 20130183823
- Publication date Jul 18, 2013
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH COMPLIANT INTERCONNECTS
- Publication number 20130181340
- Publication date Jul 18, 2013
- Trent S. UEHLING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE AND ELECTRONIC PACKAGING SOLDER JOINT STRUCTURE AND...
- Publication number 20130168851
- Publication date Jul 4, 2013
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Interconnect Structure w...
- Publication number 20130154090
- Publication date Jun 20, 2013
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR ELEMENT, AND METHOD FOR MANUFAC...
- Publication number 20130134594
- Publication date May 30, 2013
- Shinko Electric Industries Co., LTD.
- Yoshihiro Machida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO FORM SOLDER DEPOSITS AND NON-MELTING BUMP STRUCTURES ON S...
- Publication number 20130105329
- Publication date May 2, 2013
- Atotech Deutschland GmbH
- Kai-Jens Matejat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, FABRICATING METHOD THEREOF AND PACKAGE STRUCTURE
- Publication number 20130087906
- Publication date Apr 11, 2013
- Pai-Sheng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY APPARATUS AND ASSOCIATED METHODS
- Publication number 20130069230
- Publication date Mar 21, 2013
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY APPARATUS AND ASSOCIATED METHODS
- Publication number 20130071969
- Publication date Mar 21, 2013
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Interconnect Structure O...
- Publication number 20120326296
- Publication date Dec 27, 2012
- STATS ChipPAC, Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS

with modification of the same mask

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Connector structure and method of forming same

Method for manufacturing interconnect structure

Substrate device, electronic apparatus, and method for manufacturin...

Collars for under-bump metal structures and associated systems and...

Connector structure and method of forming same

Method of manufacturing a semiconductor structure

Connector structure and method of forming same

Manufacturing method of interconnect structure

Connector structure and method of forming same

Method of forming an integrated circuit device including a pillar c...

Semiconductor device and method of forming interconnect structure w...

Semiconductor interconnect structure

Semiconductor devices with compliant interconnects

Semiconductor component that includes a protective structure

Method of manufacturing a semiconductor component

Interconnect solder bumps for die testing

Semiconductor package structure and method for making the same

Semiconductor device including a solder and method of fabricating t...

Integrated circuit device including a copper pillar capped by barri...

Semiconductor device and method of forming interconnect structure o...

Semiconductor device, method of manufacturing the same, and method...

Electronic assembly apparatus and associated methods

Bump structure and electronic packaging solder joint structure and...

Cu pillar bump with electrolytic metal sidewall protection

Semiconductor device and method of forming interconnect structure o...

Semiconductor device with means for preventing solder bridges, and...

Semiconductor device and method of forming interconnect structure w...

Circuit board, fabricating method thereof and package structure

Semiconductor package structure and method for making the same

Integrated circuit device including a copper pillar capped by barri...

Patents Applicationslast 30 patents

COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...

Connector Structure and Method of Forming Same

Connector Structure and Method of Forming Same

METHOD FOR MANUFACTURING INTERCONNECT STRUCTURE

NOVEL PILLAR STRUCTURE FOR USE IN PACKAGING INTEGRATED CIRCUIT PROD...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Semiconductor Device and Method of Forming Interconnect Structure w...

INTERCONNECT SOLDER BUMPS FOR DIE TESTING

INTEGRATED CIRCUIT DEVICE INCLUDING A COPPER PILLAR CAPPED BY BARRI...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME

Semiconductor Device and Method of Forming Interconnect Structure O...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME

CHIP CONNECTION STRUCTURE AND METHOD OF FORMING

CU PILLAR BUMP WITH ELECTROLYTIC METAL SIDEWALL PROTECTION

METHOD FOR MANUFACTURING FINE-PITCH BUMPS AND STRUCTURE THEREOF

METHOD FOR MANUFACTURING FINE-PITCH BUMPS AND STRUCTURE THEREOF

METHOD FOR MANUFACTURING FINE-PITCH BUMPS AND STRUCTURE THEREOF

METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT

Semiconductor component that includes a protective structure

BUMPING PROCESS AND STRUCTURE THEREOF

BUMPING PROCESS

SEMICONDUCTOR DEVICES WITH COMPLIANT INTERCONNECTS

BUMP STRUCTURE AND ELECTRONIC PACKAGING SOLDER JOINT STRUCTURE AND...

Semiconductor Device and Method of Forming Interconnect Structure w...

SEMICONDUCTOR DEVICE, SEMICONDUCTOR ELEMENT, AND METHOD FOR MANUFAC...

METHOD TO FORM SOLDER DEPOSITS AND NON-MELTING BUMP STRUCTURES ON S...

CIRCUIT BOARD, FABRICATING METHOD THEREOF AND PACKAGE STRUCTURE

ELECTRONIC ASSEMBLY APPARATUS AND ASSOCIATED METHODS

ELECTRONIC ASSEMBLY APPARATUS AND ASSOCIATED METHODS

Semiconductor Device and Method of Forming Interconnect Structure O...