with selective exposure, development and removal of a photosensitive bump material

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H01L2224/11618

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/11618with selective exposure, development and removal of a photosensitive bump material

Industries

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Patents Grantslast 30 patents

Information Patent Grant
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Information Patent Grant
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Information Patent Grant
Photosensitive resin composition, photosensitive dry film, and patt...
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Information Patent Grant
Fabrication method of high aspect ratio solder bumping with stud bu...
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Information Patent Grant
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Information Patent Grant
Method for manufacturing compliant bump
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Information Patent Grant
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Information Patent Grant
Height measurements of conductive structural elements that are surr...
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Information Patent Grant
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Information Patent Grant
Printed repassivation for wafer chip scale packaging
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Information Patent Grant
Method for fabricating bump structures on chips with panel type pro...
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Information Patent Grant
Optical electronic-chip identification writer using dummy C4 bumps
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Information Patent Grant
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Information Patent Grant
Chip mounting structure
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Information Patent Grant
Semiconductor devices, methods of manufacture thereof, and semicond...
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
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Information Patent Grant
Fabricating pillar solder bump
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- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual layer stack for contact formation
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- International Business Machines Corporation
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Information Patent Grant
Microspring structures adapted for target device cooling
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- Issue date Sep 3, 2013
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Information Patent Grant
Substrate structure with compliant bump and manufacturing method th...
- Patent number 8,476,159
- Issue date Jul 2, 2013
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- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate structure with compliant bump and manufacturing method th...
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Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
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- Renesas Electronics Corporation
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- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
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SEMICONDUCTOR DEVICE
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Information Patent Application
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- CHIPMORE TECHNOLOGY CORPORATION LIMITED
- Guanmeng XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric Blocking Layer and Method Forming the Same
- Publication number 20230411329
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE TERMINAL FOR SIDE FACING PACKAGES
- Publication number 20230268302
- Publication date Aug 24, 2023
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- H01 - BASIC ELECTRIC ELEMENTS
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METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20230089483
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- Panasonic Intellectual Property Management Co., Ltd.
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SEMICONDUCTOR DEVICE
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Information Patent Application
METHOD FOR MANUFACTURING COMPLIANT BUMP
- Publication number 20200266164
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- LBSEMICON CO., LTD.
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED REPASSIVATION FOR WAFER CHIP SCALE PACKAGING
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- Publication number 20190067242
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- PHOENIX PIONEER TECHNOLOGY CO., LTD.
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Information Patent Application
METHOD FOR PRODUCING SOLDERED ELECTRODE AND USE THEREOF
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- JSR Corporation
- JUN MUKAWA
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Information Patent Application
CHIP MOUNTING STRUCTURE
- Publication number 20180076162
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Akihiro HORIBE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Semiconductor Devices, Methods of Manufacture Thereof, and Semicond...
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Information Patent Application
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- You Chye How
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Information Patent Application
DUAL LAYER STACK FOR CONTACT FORMATION
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- International Business Machines Corporation
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Information Patent Application
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Information Patent Application
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Information Patent Application
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Information Patent Application
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- H01 - BASIC ELECTRIC ELEMENTS

with selective exposure, development and removal of a photosensitive bump material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Conductive terminal for side facing packages

Semiconductor device

Semiconductor device manufacturing method and associated semiconduc...

Photosensitive resin composition, photosensitive dry film, and patt...

Fabrication method of high aspect ratio solder bumping with stud bu...

Fabrication method of high aspect ratio solder bumping with stud bu...

Method for manufacturing compliant bump

Semiconductor devices, methods of manufacture thereof, and semicond...

Height measurements of conductive structural elements that are surr...

Fabrication method of high aspect ratio solder bumping with stud bu...

Printed repassivation for wafer chip scale packaging

Method for fabricating bump structures on chips with panel type pro...

Optical electronic-chip identification writer using dummy C4 bumps

Chip mounting structure

Chip mounting structure

Semiconductor devices, methods of manufacture thereof, and semicond...

Semiconductor device

Fabricating pillar solder bump

Dual layer stack for contact formation

Microspring structures adapted for target device cooling

Substrate structure with compliant bump and manufacturing method th...

Substrate structure with compliant bump and manufacturing method th...

Semiconductor device and method of manufacturing semiconductor device

Patents Applicationslast 30 patents

CONDUCTIVE TERMINAL FOR SIDE FACING PACKAGES

SEMICONDUCTOR DEVICE

METHOD FOR PREPARING DIELECTRIC LAYER ON SURFACE OF WAFER, WAFER ST...

Dielectric Blocking Layer and Method Forming the Same

CONDUCTIVE TERMINAL FOR SIDE FACING PACKAGES

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING COMPLIANT BUMP

PRINTED REPASSIVATION FOR WAFER CHIP SCALE PACKAGING

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND ASSOCIATED SEMICONDUC...

HEIGHT MEASUREMENTS OF CONDUCTIVE STRUCTURAL ELEMENTS THAT ARE SURR...

FABRICATION METHOD OF HIGH ASPECT RATIO SOLDER BUMPING WITH STUD BU...

Method for Fabricating Bump Structures on Chips with Panel Type Pro...

METHOD FOR PRODUCING SOLDERED ELECTRODE AND USE THEREOF

CHIP MOUNTING STRUCTURE

Semiconductor Devices, Methods of Manufacture Thereof, and Semicond...

INTEGRATED CIRCUIT PACKAGE

DUAL LAYER STACK FOR CONTACT FORMATION

FABRICATING PILLAR SOLDER BUMP

Semiconductor Devices, Methods of Manufacture Thereof, and Semicond...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Microspring Structures Adapted for Target Device Cooling

SUBSTRATE STRUCTURE WITH COMPLIANT BUMP AND MANUFACTURING METHOD TH...

SUBSTRATE STRUCTURE WITH COMPLIANT BUMP AND MANUFACTURING METHOD TH...

METHOD OF PRODUCING ELECTRICAL COMPONENT, ELECTRICAL COMPONENT PROD...

Semiconductor device and method of manufacturing semiconductor device