with selective exposure, development and removal of a photosensitive bump material

Industry

CPC
H01L2224/11618

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/11618with selective exposure, development and removal of a photosensitive bump material

Industries

Patents Grantslast 30 patents

Information Patent Grant
Conductive terminal for side facing packages
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- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
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- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Ho Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method and associated semiconduc...
- Patent number 11,469,198
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Ho Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive resin composition, photosensitive dry film, and patt...
- Patent number 11,262,655
- Issue date Mar 1, 2022
- Shin-Etsu Chemical Co., Ltd.
- Hitoshi Maruyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of high aspect ratio solder bumping with stud bu...
- Patent number 11,181,704
- Issue date Nov 23, 2021
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of high aspect ratio solder bumping with stud bu...
- Patent number 11,112,570
- Issue date Sep 7, 2021
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing compliant bump
- Patent number 10,825,788
- Issue date Nov 3, 2020
- LBSEMICON CO., LTD.
- Jae Jin Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, methods of manufacture thereof, and semicond...
- Patent number 10,818,583
- Issue date Oct 27, 2020
- Taiwan Semiconductor Manufacturing Company
- I-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Height measurements of conductive structural elements that are surr...
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- Issue date Aug 4, 2020
- CAMTEK LTD.
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Information Patent Grant
Fabrication method of high aspect ratio solder bumping with stud bu...
- Patent number 10,598,874
- Issue date Mar 24, 2020
- International Business Machines Corporation
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- G02 - OPTICS
Information Patent Grant
Printed repassivation for wafer chip scale packaging
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating bump structures on chips with panel type pro...
- Patent number 10,483,232
- Issue date Nov 19, 2019
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical electronic-chip identification writer using dummy C4 bumps
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- Issue date Mar 26, 2019
- International Business Machines Corporation
- Daniel Piper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip mounting structure
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- Issue date Nov 27, 2018
- International Business Machines Corporation
- Akihiro Horibe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip mounting structure
- Patent number 9,893,031
- Issue date Feb 13, 2018
- International Business Machines Corporation
- Akihiro Horibe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices, methods of manufacture thereof, and semicond...
- Patent number 9,773,724
- Issue date Sep 26, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,559,028
- Issue date Jan 31, 2017
- Rohm Co., Ltd.
- Hirofumi Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating pillar solder bump
- Patent number 9,508,594
- Issue date Nov 29, 2016
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual layer stack for contact formation
- Patent number 9,401,336
- Issue date Jul 26, 2016
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microspring structures adapted for target device cooling
- Patent number 8,525,353
- Issue date Sep 3, 2013
- Palo Alto Research Center Incorporated
- Eugene M. Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure with compliant bump and manufacturing method th...
- Patent number 8,476,159
- Issue date Jul 2, 2013
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate structure with compliant bump and manufacturing method th...
- Patent number 8,426,984
- Issue date Apr 23, 2013
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 8,378,486
- Issue date Feb 19, 2013
- Renesas Electronics Corporation
- Fumihiro Bekku
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
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- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-HO TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING DIELECTRIC LAYER ON SURFACE OF WAFER, WAFER ST...
- Publication number 20240162161
- Publication date May 16, 2024
- CHIPMORE TECHNOLOGY CORPORATION LIMITED
- Guanmeng XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric Blocking Layer and Method Forming the Same
- Publication number 20230411329
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE TERMINAL FOR SIDE FACING PACKAGES
- Publication number 20230268302
- Publication date Aug 24, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20230089483
- Publication date Mar 23, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- KIYOKAZU ITOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220367396
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-HO TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210082856
- Publication date Mar 18, 2021
- Kioxia Corporation
- Soichi HOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING COMPLIANT BUMP
- Publication number 20200266164
- Publication date Aug 20, 2020
- LBSEMICON CO., LTD.
- Jae Jin KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED REPASSIVATION FOR WAFER CHIP SCALE PACKAGING
- Publication number 20200043878
- Publication date Feb 6, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Daiki Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND ASSOCIATED SEMICONDUC...
- Publication number 20200020655
- Publication date Jan 16, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-HO TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEIGHT MEASUREMENTS OF CONDUCTIVE STRUCTURAL ELEMENTS THAT ARE SURR...
- Publication number 20190355688
- Publication date Nov 21, 2019
- CAMTEK LTD.
- EYAL SEGEV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF HIGH ASPECT RATIO SOLDER BUMPING WITH STUD BU...
- Publication number 20190131266
- Publication date May 2, 2019
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating Bump Structures on Chips with Panel Type Pro...
- Publication number 20190067242
- Publication date Feb 28, 2019
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SOLDERED ELECTRODE AND USE THEREOF
- Publication number 20180174989
- Publication date Jun 21, 2018
- JSR Corporation
- JUN MUKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MOUNTING STRUCTURE
- Publication number 20180076162
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Akihiro HORIBE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Devices, Methods of Manufacture Thereof, and Semicond...
- Publication number 20180012830
- Publication date Jan 11, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20170053883
- Publication date Feb 23, 2017
- TEXAS INSTRUMENTS INCORPORATED
- You Chye How
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL LAYER STACK FOR CONTACT FORMATION
- Publication number 20160126201
- Publication date May 5, 2016
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING PILLAR SOLDER BUMP
- Publication number 20160056116
- Publication date Feb 25, 2016
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices, Methods of Manufacture Thereof, and Semicond...
- Publication number 20140210074
- Publication date Jul 31, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20140145327
- Publication date May 29, 2014
- Samsung Electronics Co., Ltd.
- Hyung-Jun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microspring Structures Adapted for Target Device Cooling
- Publication number 20130154127
- Publication date Jun 20, 2013
- Palo Alto Research Center Incorporated
- Eugene M. Chow
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Information Patent Application
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE WITH COMPLIANT BUMP AND MANUFACTURING METHOD TH...
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- Chipbond Technology Corporation
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING ELECTRICAL COMPONENT, ELECTRICAL COMPONENT PROD...
- Publication number 20110207048
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- Yuki ITOU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method of manufacturing semiconductor device
- Publication number 20110095420
- Publication date Apr 28, 2011
- RENESAS ELECTRONICS CORPORATION
- Fumihiro Bekku
- H01 - BASIC ELECTRIC ELEMENTS

with selective exposure, development and removal of a photosensitive bump material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Conductive terminal for side facing packages

Semiconductor device

Semiconductor device manufacturing method and associated semiconduc...

Photosensitive resin composition, photosensitive dry film, and patt...

Fabrication method of high aspect ratio solder bumping with stud bu...

Fabrication method of high aspect ratio solder bumping with stud bu...

Method for manufacturing compliant bump

Semiconductor devices, methods of manufacture thereof, and semicond...

Height measurements of conductive structural elements that are surr...

Fabrication method of high aspect ratio solder bumping with stud bu...

Printed repassivation for wafer chip scale packaging

Method for fabricating bump structures on chips with panel type pro...

Optical electronic-chip identification writer using dummy C4 bumps

Chip mounting structure

Chip mounting structure

Semiconductor devices, methods of manufacture thereof, and semicond...

Semiconductor device

Fabricating pillar solder bump

Dual layer stack for contact formation

Microspring structures adapted for target device cooling

Substrate structure with compliant bump and manufacturing method th...

Substrate structure with compliant bump and manufacturing method th...

Semiconductor device and method of manufacturing semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

METHOD FOR PREPARING DIELECTRIC LAYER ON SURFACE OF WAFER, WAFER ST...

Dielectric Blocking Layer and Method Forming the Same

CONDUCTIVE TERMINAL FOR SIDE FACING PACKAGES

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING COMPLIANT BUMP

PRINTED REPASSIVATION FOR WAFER CHIP SCALE PACKAGING

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND ASSOCIATED SEMICONDUC...

HEIGHT MEASUREMENTS OF CONDUCTIVE STRUCTURAL ELEMENTS THAT ARE SURR...

FABRICATION METHOD OF HIGH ASPECT RATIO SOLDER BUMPING WITH STUD BU...

Method for Fabricating Bump Structures on Chips with Panel Type Pro...

METHOD FOR PRODUCING SOLDERED ELECTRODE AND USE THEREOF

CHIP MOUNTING STRUCTURE

Semiconductor Devices, Methods of Manufacture Thereof, and Semicond...

INTEGRATED CIRCUIT PACKAGE

DUAL LAYER STACK FOR CONTACT FORMATION

FABRICATING PILLAR SOLDER BUMP

Semiconductor Devices, Methods of Manufacture Thereof, and Semicond...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Microspring Structures Adapted for Target Device Cooling

SUBSTRATE STRUCTURE WITH COMPLIANT BUMP AND MANUFACTURING METHOD TH...

SUBSTRATE STRUCTURE WITH COMPLIANT BUMP AND MANUFACTURING METHOD TH...

METHOD OF PRODUCING ELECTRICAL COMPONENT, ELECTRICAL COMPONENT PROD...

Semiconductor device and method of manufacturing semiconductor device