with selective exposure, development and removal of a photosensitive layer material

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H01L2224/27618

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/27618with selective exposure, development and removal of a photosensitive layer material

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Adhesive bonding composition and method of use
- Patent number 11,648,750
- Issue date May 16, 2023
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Micro-LED chips and methods for manufacturing the same and display...
- Patent number 11,081,632
- Issue date Aug 3, 2021
- CHENGDU VISTAR OPTOELECTRONICS CO., LTD.
- Feng Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging methods using a photolithographic bonding mat...
- Patent number 10,755,979
- Issue date Aug 25, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hu Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ag underlayer-attached metallic member, Ag underlayer-attached insu...
- Patent number 10,734,297
- Issue date Aug 4, 2020
- Mitsubishi Materials Corporation
- Shuji Nishimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive bonding composition and method of use
- Patent number 10,734,353
- Issue date Aug 4, 2020
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Bond materials with enhanced plasma resistant characteristics and a...
- Patent number 10,727,195
- Issue date Jul 28, 2020
- Technetics Group LLC
- Jason Wright
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanoscale interconnect array for stacked dies
- Patent number 10,600,761
- Issue date Mar 24, 2020
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,504,749
- Issue date Dec 10, 2019
- Mitsubishi Materials Corporation
- Shuji Nishimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die with integrated microphone device using through-silicon vias (T...
- Patent number 10,455,308
- Issue date Oct 22, 2019
- Intel Corporation
- Kevin J. Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Photosensitive resin composition, film adhesive, adhesive sheet, ad...
- Patent number 10,428,253
- Issue date Oct 1, 2019
- Hitachi Chemical Company, Ltd.
- Tomonori Minegishi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for manufacturing semiconductor apparatus, method for manufa...
- Patent number 10,416,557
- Issue date Sep 17, 2019
- Shin-Etsu Chemical Co., Ltd.
- Kyoko Soga
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
3D packaging method for semiconductor components
- Patent number 10,418,339
- Issue date Sep 17, 2019
- Imec VZW
- Fabrice Duval
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive bonding composition and method of use
- Patent number 10,410,991
- Issue date Sep 10, 2019
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanoscale interconnect array for stacked dies
- Patent number 10,304,803
- Issue date May 28, 2019
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier and method thereof
- Patent number 10,163,820
- Issue date Dec 25, 2018
- Infineon Technologies AG
- Frank Pueschner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip mounting structure
- Patent number 10,141,278
- Issue date Nov 27, 2018
- International Business Machines Corporation
- Akihiro Horibe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip mounting structure
- Patent number 9,893,031
- Issue date Feb 13, 2018
- International Business Machines Corporation
- Akihiro Horibe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer stack protection seal
- Patent number 9,768,089
- Issue date Sep 19, 2017
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ranjan Rajoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating pillar solder bump
- Patent number 9,508,594
- Issue date Nov 29, 2016
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer stack protection seal
- Patent number 9,406,577
- Issue date Aug 2, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ranjan Rajoo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Flip-chip assembly process comprising pre-coating interconnect elem...
- Patent number 9,406,662
- Issue date Aug 2, 2016
- Commisariat A l'Energie Atomique et Aux Energies Alternatives
- François Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming semiconductor device packages with photoimageab...
- Patent number 9,362,143
- Issue date Jun 7, 2016
- Micron Technology, Inc.
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale technique for interconnecting vertically stacked dies
- Patent number 9,331,051
- Issue date May 3, 2016
- Technische Universiteit Eindhoven
- Pinxiang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and fabrication method thereof
- Patent number 8,716,109
- Issue date May 6, 2014
- Xintec Inc.
- Ching-Yu Ni
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device having a semiconductor chip, and method for th...
- Patent number 8,574,966
- Issue date Nov 5, 2013
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and fabrication method thereof
- Patent number 8,564,123
- Issue date Oct 22, 2013
- Ching-Yu Ni
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device having a semiconductor chip, and method for th...
- Patent number 8,168,472
- Issue date May 1, 2012
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a semiconductor chip, and method for th...
- Patent number 8,062,928
- Issue date Nov 22, 2011
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a semiconductor chip, and method for th...
- Patent number 7,795,742
- Issue date Sep 14, 2010
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor flip-chip package and method for the fabrication thereof
- Patent number 6,774,493
- Issue date Aug 10, 2004
- M. A. Capote
- Miguel A. Capote
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL SENSOR PACKAGE
- Publication number 20240304639
- Publication date Sep 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240145417
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Hyeongwoo JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20230191747
- Publication date Jun 22, 2023
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20200365552
- Publication date Nov 19, 2020
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-LED CHIPS AND METHODS FOR MANUFACTURING THE SAME AND DISPLAY...
- Publication number 20200251641
- Publication date Aug 6, 2020
- Kunshan New Flat Panel Display Technology Center Co., Ltd.
- Feng ZHAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGING METHODS USING A PHOTOLITHOGRAPHIC BONDING MAT...
- Publication number 20200135689
- Publication date Apr 30, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hu SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20190341364
- Publication date Nov 7, 2019
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS
Information Patent Application
NANOSCALE INTERCONNECT ARRAY FOR STACKED DIES
- Publication number 20190237437
- Publication date Aug 1, 2019
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND MATERIALS WITH ENHANCED PLASMA RESISTANT CHARACTERISTICS AND A...
- Publication number 20190088613
- Publication date Mar 21, 2019
- TECHNETICS GROUP LLC
- Jason Wright
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PACKAGING METHOD AND PACKAGE STRUCTURE FOR FINGERPRINT RECOGNITION...
- Publication number 20190013302
- Publication date Jan 10, 2019
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MOUNTING STRUCTURE
- Publication number 20180076162
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Akihiro HORIBE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP CARRIER AND METHOD THEREOF
- Publication number 20180040573
- Publication date Feb 8, 2018
- INFINEON TECHNOLOGIES AG
- FRANK PUESCHNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE INCLUDING AN ANISOTROPIC CONDUCTIVE FILM, AND MANUFA...
- Publication number 20170338198
- Publication date Nov 23, 2017
- SAMSUNG DISPLAY CO., LTD.
- Eui Yun JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nanoscale Interconnect Array for Stacked Dies
- Publication number 20170323867
- Publication date Nov 9, 2017
- Invensas Corporatoin
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer scale technique for interconnecting vertically stacked dies
- Publication number 20140300008
- Publication date Oct 9, 2014
- Pinxiang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STACK PROTECTION SEAL
- Publication number 20140264762
- Publication date Sep 18, 2014
- GLOBAL FOUNDRIES SINGAPORE PTE LTD.
- Ranjan RAJOO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140017854
- Publication date Jan 16, 2014
- Xintec Inc.
- Ching-Yu NI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS FOR FORMING SEMICONDUCTOR DEVICE PACKAGES WITH PHOTOIMAGEAB...
- Publication number 20130299986
- Publication date Nov 14, 2013
- Micron Technology, Inc.
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130285253
- Publication date Oct 31, 2013
- Hitachi, Ltd
- Mayu Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A SEMICONDUCTOR CHIP, AND METHOD FOR TH...
- Publication number 20120178218
- Publication date Jul 12, 2012
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A SEMICONDUCTOR CHIP, AND METHOD FOR TH...
- Publication number 20120028382
- Publication date Feb 2, 2012
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20110175221
- Publication date Jul 21, 2011
- Ching-Yu NI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A SEMICONDUCTOR CHIP, AND METHOD FOR TH...
- Publication number 20100297792
- Publication date Nov 25, 2010
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-COST FLIP-CHIP INTERCONNECT WITH AN INTEGRATED WAFER-APPLIED PH...
- Publication number 20100159644
- Publication date Jun 24, 2010
- Rajiv Carl Dunne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A SEMICONDUCTOR CHIP, AND METHOD FOR TH...
- Publication number 20070085216
- Publication date Apr 19, 2007
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor flip-chip package and method for the fabrication thereof
- Publication number 20050218517
- Publication date Oct 6, 2005
- M. A. Capote
- Miguel A. Capote
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor flip-chip package and method for the fabrication thereof
- Publication number 20030218261
- Publication date Nov 27, 2003
- M. A. Capote
- Miguel A. Capote
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor flip-chip package and method for the fabrication thereof
- Publication number 20020014703
- Publication date Feb 7, 2002
- Miguel A. Capote
- B32 - LAYERED PRODUCTS

with selective exposure, development and removal of a photosensitive layer material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Adhesive bonding composition and method of use

Micro-LED chips and methods for manufacturing the same and display...

Wafer-level packaging methods using a photolithographic bonding mat...

Ag underlayer-attached metallic member, Ag underlayer-attached insu...

Adhesive bonding composition and method of use

Bond materials with enhanced plasma resistant characteristics and a...

Nanoscale interconnect array for stacked dies

Semiconductor device

Die with integrated microphone device using through-silicon vias (T...

Photosensitive resin composition, film adhesive, adhesive sheet, ad...

Method for manufacturing semiconductor apparatus, method for manufa...

3D packaging method for semiconductor components

Adhesive bonding composition and method of use

Nanoscale interconnect array for stacked dies

Chip carrier and method thereof

Chip mounting structure

Chip mounting structure

Wafer stack protection seal

Fabricating pillar solder bump

Wafer stack protection seal

Flip-chip assembly process comprising pre-coating interconnect elem...

Methods for forming semiconductor device packages with photoimageab...

Wafer scale technique for interconnecting vertically stacked dies

Chip package and fabrication method thereof

Semiconductor device having a semiconductor chip, and method for th...

Chip package and fabrication method thereof

Semiconductor device having a semiconductor chip, and method for th...

Semiconductor device having a semiconductor chip, and method for th...

Semiconductor device having a semiconductor chip, and method for th...

Semiconductor flip-chip package and method for the fabrication thereof

Patents Applicationslast 30 patents

OPTICAL SENSOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

MICRO-LED CHIPS AND METHODS FOR MANUFACTURING THE SAME AND DISPLAY...

WAFER-LEVEL PACKAGING METHODS USING A PHOTOLITHOGRAPHIC BONDING MAT...

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

NANOSCALE INTERCONNECT ARRAY FOR STACKED DIES

BOND MATERIALS WITH ENHANCED PLASMA RESISTANT CHARACTERISTICS AND A...

PACKAGING METHOD AND PACKAGE STRUCTURE FOR FINGERPRINT RECOGNITION...

CHIP MOUNTING STRUCTURE

CHIP CARRIER AND METHOD THEREOF

DISPLAY DEVICE INCLUDING AN ANISOTROPIC CONDUCTIVE FILM, AND MANUFA...

Nanoscale Interconnect Array for Stacked Dies

Wafer scale technique for interconnecting vertically stacked dies

WAFER STACK PROTECTION SEAL

CHIP PACKAGE AND FABRICATION METHOD THEREOF

METHODS FOR FORMING SEMICONDUCTOR DEVICE PACKAGES WITH PHOTOIMAGEAB...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE HAVING A SEMICONDUCTOR CHIP, AND METHOD FOR TH...

SEMICONDUCTOR DEVICE HAVING A SEMICONDUCTOR CHIP, AND METHOD FOR TH...

CHIP PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR DEVICE HAVING A SEMICONDUCTOR CHIP, AND METHOD FOR TH...

LOW-COST FLIP-CHIP INTERCONNECT WITH AN INTEGRATED WAFER-APPLIED PH...

SEMICONDUCTOR DEVICE HAVING A SEMICONDUCTOR CHIP, AND METHOD FOR TH...

Semiconductor flip-chip package and method for the fabrication thereof

Semiconductor flip-chip package and method for the fabrication thereof

Semiconductor flip-chip package and method for the fabrication thereof