with sintering of base

Industry

CPC
Y10T29/49163

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Parent Industries

YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION Y10T29/00Metal working

Current Industry

Y10T29/49163with sintering of base

Industries

Patents Grantslast 30 patents

Information Patent Grant
System producing a conductive path on a substrate
- Patent number 11,464,114
- Issue date Oct 4, 2022
- Orbotech Ltd.
- Zvi Kotler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and production method therefor
- Patent number 10,785,879
- Issue date Sep 22, 2020
- NGK Spark Plug Co., Ltd.
- Tatsuya Katoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing ceramic multi-layer components
- Patent number 10,686,120
- Issue date Jun 16, 2020
- EPCOS AG
- Marion Ottlinger
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method producing a conductive path on a substrate
- Patent number 10,537,027
- Issue date Jan 14, 2020
- Orbotech Ltd.
- Zvi Kotler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic substrate
- Patent number 10,524,365
- Issue date Dec 31, 2019
- NGK Spark Plug Co., Ltd.
- Tatsuya Katoh
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Method of manufacturing a ceramic substrate
- Patent number 10,375,837
- Issue date Aug 6, 2019
- NGK Spark Plug Co., Ltd.
- Tatsuya Katoh
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Touch panel and production method thereof
- Patent number 9,811,230
- Issue date Nov 7, 2017
- Japan Aviation Electronics Industry, Limited
- Kenji Matsumoto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for producing a multilayer element
- Patent number 9,728,706
- Issue date Aug 8, 2017
- EPCOS AG
- Georg Kuegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a circuit board via structure for high speed sig...
- Patent number 9,622,358
- Issue date Apr 11, 2017
- Micron Technology, Inc.
- Shiyou Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component, method of manufacturing electronic component,...
- Patent number 9,596,767
- Issue date Mar 14, 2017
- Fujitsu Limited
- Aki Dote
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ecological method for constructing circuit boards
- Patent number 9,456,507
- Issue date Sep 27, 2016
- The Boeing Company
- Donald F. Wilkins
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electrical bushing with gradient cermet
- Patent number 9,407,076
- Issue date Aug 2, 2016
- Heraeus Precious Metals GmbH & Co. KG
- Jens Troetzschel
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Process for forming an electrically conductive structure on a subst...
- Patent number 9,284,459
- Issue date Mar 15, 2016
- E I du Pont de Nemours and Company
- Zhigang Rick Li
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Probe bonding method having improved control of bonding material
- Patent number 9,250,266
- Issue date Feb 2, 2016
- MicroProbe, Inc.
- January Kister
- G01 - MEASURING TESTING
Information Patent Grant
Method for manufacturing liquid ejecting head
- Patent number 9,138,997
- Issue date Sep 22, 2015
- Seiko Epson Corporation
- Motoki Takabe
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Method for forming copper interconnection structures
- Patent number 9,082,821
- Issue date Jul 14, 2015
- Advanced Interconnect Materials, LLC
- Junichi Koike
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for forming a circuit board via structure for high speed sig...
- Patent number 9,055,702
- Issue date Jun 9, 2015
- Micron Technology, Inc.
- Shiyou Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 8,756,804
- Issue date Jun 24, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Hyung Jin Jeon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for continuous sintering on indefinite length webs
- Patent number 8,720,052
- Issue date May 13, 2014
- 3M Innovative Properties Company
- Daniel J. Theis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer substrate with built-in chip-ty...
- Patent number 8,720,050
- Issue date May 13, 2014
- Murata Manufacturing Co., Ltd.
- Osamu Chikagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for production of monolithic inductive component
- Patent number 8,695,208
- Issue date Apr 15, 2014
- Siemens Aktiengesellschaft
- Richard Matz
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for printing a conductive pattern
- Patent number 8,671,563
- Issue date Mar 18, 2014
- Oy Keskuslaboratorio-Centrallaboratorium AB
- Juha Maijala
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing liquid ejection head having protective laye...
- Patent number 8,646,169
- Issue date Feb 11, 2014
- Canon Kabushiki Kaisha
- Yuzuru Ishida
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method of connecting a grid array package to a printed circuit board
- Patent number 8,549,737
- Issue date Oct 8, 2013
- General Dynamics Advanced Information Systems, Inc.
- Deepak K. Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for producing the same
- Patent number 8,533,943
- Issue date Sep 17, 2013
- Ibiden Co., Ltd.
- Honchin En
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of producing an electrical bushing with gradient cermet
- Patent number 8,528,201
- Issue date Sep 10, 2013
- W. C. Heraeus GmbH
- Jens Troetzschel
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Layout method for electronic components of double-sided surface mou...
- Patent number 8,528,195
- Issue date Sep 10, 2013
- Inventec Corporation
- Chung-Yang Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming a circuit board via structure for high speed sig...
- Patent number 8,516,695
- Issue date Aug 27, 2013
- Micron Technology, Inc.
- Shiyou Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dielectric device and method of manufacturing the same
- Patent number 8,468,693
- Issue date Jun 25, 2013
- TDK Corporation
- Tomohiko Katoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing circuit board
- Patent number 8,418,355
- Issue date Apr 16, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Sang-Duck Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
System Producing a Conductive Path on a Substrate
- Publication number 20210195756
- Publication date Jun 24, 2021
- ORBOTECH LTD.
- Zvi KOTLER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Systems and Methods for Encapsulating Electronics in a Mountable De...
- Publication number 20140296674
- Publication date Oct 2, 2014
- Google Inc.
- James Etzkorn
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
Systems and Methods for Encapsulating Electronics in a Mountable De...
- Publication number 20140290054
- Publication date Oct 2, 2014
- Google Inc.
- James Etzkorn
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140251657
- Publication date Sep 11, 2014
- Samsung Electro-mechanics Co., Ltd.
- Hyung Jin JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer Electronic Structures with Improved Control of Dielectri...
- Publication number 20140102765
- Publication date Apr 17, 2014
- Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies C...
- Dror Hurwitz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE PASTE COMPOSITION AND SEMICONDUCTOR DEVICES MADE THEREWITH
- Publication number 20140061830
- Publication date Mar 6, 2014
- E I DU PONT DE NEMOURS AND COMPANY
- ZHIGANG RICK LI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRICAL BUSHING WITH GRADIENT CERMET
- Publication number 20140008121
- Publication date Jan 9, 2014
- HERAEUS PRECIOUS METALS GMBH & CO. KG
- Jens Troetzschel
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Method for Forming a Circuit Board Via Structure for High Speed Sig...
- Publication number 20130340250
- Publication date Dec 26, 2013
- Micron Technology, Inc.
- Shiyou Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROBE BONDING METHOD HAVING IMPROVED CONTROL OF BONDING MATERIAL
- Publication number 20120313621
- Publication date Dec 13, 2012
- MicroProbe, Inc.
- January Kister
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR MANUFACTURING LIQUID EJECTING HEAD
- Publication number 20120255177
- Publication date Oct 11, 2012
- SEIKO EPSON CORPORATION
- Motoki TAKABE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WIRING BOARD FOR ELECTRONIC PARTS INSPECTING DEVICE AND ITS MANUFAC...
- Publication number 20120229160
- Publication date Sep 13, 2012
- NGK SPARK PLUG CO., LTD.
- Tomoyoshi ONO
- G01 - MEASURING TESTING
Information Patent Application
WIRING BOARD FOR ELECTRONIC PARTS INSPECTING DEVICE AND ITS MANUFAC...
- Publication number 20120228017
- Publication date Sep 13, 2012
- NGK SPARK PLUG CO., LTD.
- Tomoyoshi ONO
- G01 - MEASURING TESTING
Information Patent Application
CERMET-CONTAINING BUSHING WITH HOLDING ELEMENT FOR AN IMPLANTABLE M...
- Publication number 20120197327
- Publication date Aug 2, 2012
- HERAEUS PRECIOUS METALS GMBH & CO. KG
- Heiko Specht
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20120175162
- Publication date Jul 12, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Jee Soo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID EJECTION HEAD AND METHOD OF MANUFACTURING THE LIQUID EJECTIO...
- Publication number 20120164337
- Publication date Jun 28, 2012
- Canon Kabushiki Kaisha
- Yazuru Ishida
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120073870
- Publication date Mar 29, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hyung Jin Jeon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING COPPER INTERCONNECTION STRUCTURES
- Publication number 20120021603
- Publication date Jan 26, 2012
- Advanced Interconnect Materials, LLC
- Junichi KOIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming a Circuit Board Via Structure for High Speed Sig...
- Publication number 20110277323
- Publication date Nov 17, 2011
- Micron Technology, Inc.
- Shiyou Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Apparatus for Providing Hermetic Electrical Feedthrough
- Publication number 20110253432
- Publication date Oct 20, 2011
- Jerry Ok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL BUSHING WITH GRADIENT CERMET
- Publication number 20110186349
- Publication date Aug 4, 2011
- W.C. Heraeus GmbH
- Jens Troetzschel
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Layout Method For Electronic Components Of Double-Sided Surface Mou...
- Publication number 20110173808
- Publication date Jul 21, 2011
- Inventec Corporation
- Chung Yang Wu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR CONTINUOUS SINTERING ON INDEFINITE LENGTH WEBS
- Publication number 20110067234
- Publication date Mar 24, 2011
- Daniel J. Theis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-CHIP PACKAGING USING AN INTERPOSER SUCH AS A SILICON BASED IN...
- Publication number 20110067236
- Publication date Mar 24, 2011
- Sriram Muthukumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIEZOELECTRIC ACTUATOR AND METHOD FOR PRODUCING THE SAME
- Publication number 20110062830
- Publication date Mar 17, 2011
- Martin Schroder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID DISCHARGE HEAD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110043565
- Publication date Feb 24, 2011
- Canon Kabushiki Kaisha
- Sadayoshi Sakuma
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
DIELECTRIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100323097
- Publication date Dec 23, 2010
- TDK Corporation
- Tomohiko Katoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100243133
- Publication date Sep 30, 2010
- Murata Manufacturing Co., Ltd.
- Tatsuo Kunishi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR MANUFACTURING PIEZOELECTRIC ACTUATOR
- Publication number 20100242242
- Publication date Sep 30, 2010
- NGK Insulators, Ltd.
- Hideki SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Al/AlN JOINT MATERIAL, BASE PLATE FOR POWER MODULE, POWER MODULE, A...
- Publication number 20100230473
- Publication date Sep 16, 2010
- MITSUBISHI MATERIALS CORPORATION
- Toshiyuki Nagase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC COMPOSITE MULTILAYER SUBSTRATE, METHOD FOR MANUFACTURING CE...
- Publication number 20100224396
- Publication date Sep 9, 2010
- Murata Manufacturing Co., Ltd.
- Masato NOMIYA
- B32 - LAYERED PRODUCTS

with sintering of base

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

System producing a conductive path on a substrate

Circuit board and production method therefor

Method for producing ceramic multi-layer components

Method producing a conductive path on a substrate

Ceramic substrate

Method of manufacturing a ceramic substrate

Touch panel and production method thereof

Method for producing a multilayer element

Method for forming a circuit board via structure for high speed sig...

Electronic component, method of manufacturing electronic component,...

Ecological method for constructing circuit boards

Electrical bushing with gradient cermet

Process for forming an electrically conductive structure on a subst...

Probe bonding method having improved control of bonding material

Method for manufacturing liquid ejecting head

Method for forming copper interconnection structures

Method for forming a circuit board via structure for high speed sig...

Method of manufacturing printed circuit board

Method for continuous sintering on indefinite length webs

Method for manufacturing multilayer substrate with built-in chip-ty...

Method for production of monolithic inductive component

Method for printing a conductive pattern

Method of manufacturing liquid ejection head having protective laye...

Method of connecting a grid array package to a printed circuit board

Printed wiring board and method for producing the same

Method of producing an electrical bushing with gradient cermet

Layout method for electronic components of double-sided surface mou...

Method for forming a circuit board via structure for high speed sig...

Dielectric device and method of manufacturing the same

Method for manufacturing circuit board

Patents Applicationslast 30 patents

System Producing a Conductive Path on a Substrate

Systems and Methods for Encapsulating Electronics in a Mountable De...

Systems and Methods for Encapsulating Electronics in a Mountable De...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Multilayer Electronic Structures with Improved Control of Dielectri...

CONDUCTIVE PASTE COMPOSITION AND SEMICONDUCTOR DEVICES MADE THEREWITH

ELECTRICAL BUSHING WITH GRADIENT CERMET

Method for Forming a Circuit Board Via Structure for High Speed Sig...

PROBE BONDING METHOD HAVING IMPROVED CONTROL OF BONDING MATERIAL

METHOD FOR MANUFACTURING LIQUID EJECTING HEAD

WIRING BOARD FOR ELECTRONIC PARTS INSPECTING DEVICE AND ITS MANUFAC...

WIRING BOARD FOR ELECTRONIC PARTS INSPECTING DEVICE AND ITS MANUFAC...

CERMET-CONTAINING BUSHING WITH HOLDING ELEMENT FOR AN IMPLANTABLE M...

PRINTED CIRCUIT BOARD

LIQUID EJECTION HEAD AND METHOD OF MANUFACTURING THE LIQUID EJECTIO...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

METHOD FOR FORMING COPPER INTERCONNECTION STRUCTURES

Method for Forming a Circuit Board Via Structure for High Speed Sig...

Method and Apparatus for Providing Hermetic Electrical Feedthrough

ELECTRICAL BUSHING WITH GRADIENT CERMET

Layout Method For Electronic Components Of Double-Sided Surface Mou...

METHOD FOR CONTINUOUS SINTERING ON INDEFINITE LENGTH WEBS

MULTI-CHIP PACKAGING USING AN INTERPOSER SUCH AS A SILICON BASED IN...

PIEZOELECTRIC ACTUATOR AND METHOD FOR PRODUCING THE SAME

LIQUID DISCHARGE HEAD AND METHOD FOR MANUFACTURING THE SAME

DIELECTRIC DEVICE AND METHOD OF MANUFACTURING THE SAME

LAMINATED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR MANUFACTURING PIEZOELECTRIC ACTUATOR

Al/AlN JOINT MATERIAL, BASE PLATE FOR POWER MODULE, POWER MODULE, A...

CERAMIC COMPOSITE MULTILAYER SUBSTRATE, METHOD FOR MANUFACTURING CE...