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Stacked via structure
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Patent number 11,973,023
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Issue date Apr 30, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd
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Po-Han Wang
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H01 - BASIC ELECTRIC ELEMENTS
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Wafer bonding method
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Patent number 11,973,055
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Issue date Apr 30, 2024
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Taiwan Semiconductor Manufacturing Co., Ltd
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Yung-Chi Lin
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B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Package structure with dummy die
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Patent number 11,721,676
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Issue date Aug 8, 2023
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Taiwan Semiconductor Manufacturing Co., Ltd
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Hsien-Wei Chen
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H01 - BASIC ELECTRIC ELEMENTS
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