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H01L2924/37001

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/37001Yield

Industries

Patents Grantslast 30 patents

Information Patent Grant
Warpage control in the packaging of integrated circuits
- Patent number 12,144,065
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module with a first substrate, a second substrate and...
- Patent number 12,125,817
- Issue date Oct 22, 2024
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure comprising various via structures
- Patent number 12,087,597
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Fu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 12,080,691
- Issue date Sep 3, 2024
- Samsung Electronics Co., Ltd.
- Sungwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a semiconductor element and a wiring s...
- Patent number 12,057,324
- Issue date Aug 6, 2024
- Shanghai Tianma Micro-Electronics Co., Ltd.
- Xuhui Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device package having a lateral power transistor with segmented chi...
- Patent number 12,040,302
- Issue date Jul 16, 2024
- Infineon Technologies Austria AG
- Hyeongnam Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures and methods for forming the same
- Patent number 12,033,933
- Issue date Jul 9, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kaimin Lv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for managing power in a multi-dimensional pack...
- Patent number 12,019,492
- Issue date Jun 25, 2024
- Kepler Computing Inc.
- Amrita Mathuriya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer bonding method
- Patent number 12,015,008
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Chi Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-die FPGA implementing built-in analog circuit using active si...
- Patent number 12,009,307
- Issue date Jun 11, 2024
- WUXI ESIONTECH CO., LTD.
- Yueer Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages having adhesion layers for through vias
- Patent number 12,009,331
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming same
- Patent number 12,009,226
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Chen Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,996,346
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming same
- Patent number 11,984,422
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked via structure
- Patent number 11,973,023
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding method
- Patent number 11,973,055
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Chi Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,961,789
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package manufacturing method, and adhesive sheet used...
- Patent number 11,935,865
- Issue date Mar 19, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Toshimi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing side wettable package
- Patent number 11,916,030
- Issue date Feb 27, 2024
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip package
- Patent number 11,908,692
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 11,908,829
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yao-Te Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having conductive pillars with inclined surf...
- Patent number 11,901,323
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chiang-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package structure
- Patent number 11,895,780
- Issue date Feb 6, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor arrangement and method for prod...
- Patent number 11,887,961
- Issue date Jan 30, 2024
- Infineon Technologies Austria AG
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment mechanism and alignment method of bonding machine
- Patent number 11,869,792
- Issue date Jan 9, 2024
- SKY TECH INC.
- Jing-Cheng Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded assembly including inter-die via structures and methods for...
- Patent number 11,869,877
- Issue date Jan 9, 2024
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid felts of electrospun nanofibers
- Patent number RE49773
- Issue date Jan 2, 2024
- NANOPAREIL, LLC
- Todd J. Menkhaus
Information Patent Grant
Packaging method for fan-out wafer-level packaging structure
- Patent number 11,862,595
- Issue date Jan 2, 2024
- SJ SEMICONDUCTOR(JIANGYIN) CORPORATION
- Hailin Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and measurement device
- Patent number 11,854,952
- Issue date Dec 26, 2023
- Lapis Semiconductor Co., Ltd.
- Toshihisa Sone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus, power module, and manufacturing method of...
- Patent number 11,848,298
- Issue date Dec 19, 2023
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE
- Publication number 20240387440
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Manufacturing the Same
- Publication number 20240387330
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE COMPRISING VARIOUS VIA STRUCTURES
- Publication number 20240363364
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-FU LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE
- Publication number 20240339419
- Publication date Oct 10, 2024
- Sumitomo Electric Industries, Ltd.
- Shota SAMBONSUGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND SEMICONDUCTOR DEVICE
- Publication number 20240321803
- Publication date Sep 26, 2024
- SUMITOMO BAKELITE CO., LTD.
- Akihiko Otoguro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES HAVING ADHESION LAYERS FOR THROUGH VIAS
- Publication number 20240297140
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20240297053
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co, LTD.
- Ting-Chen Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240274493
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240258263
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING METHOD
- Publication number 20240250061
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Chi Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED VIA STRUCTURE
- Publication number 20240234299
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240213199
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Sungwoo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240203812
- Publication date Jun 20, 2024
- RENESAS ELECTRONICS CORPORATION
- Takamichi HOSOKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated process sequence for hybrid bonding applications
- Publication number 20240194635
- Publication date Jun 13, 2024
- Niranjan PINGLE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION B...
- Publication number 20240186280
- Publication date Jun 6, 2024
- Intel Corporation
- Minglu LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE HAVING IMPROVED BONDING STRUCTURE
- Publication number 20240188215
- Publication date Jun 6, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- LI-CHUN HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES
- Publication number 20240178119
- Publication date May 30, 2024
- Intel Corporation
- Mohammad Mamunur RAHMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION STRUCTURE
- Publication number 20240153879
- Publication date May 9, 2024
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION STRUCTURE AND METHOD FOR F...
- Publication number 20240153878
- Publication date May 9, 2024
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDE COOLED POWER MODULES WITH SINTERED-SILVER INTERPOSERS
- Publication number 20240153862
- Publication date May 9, 2024
- Virginia Tech Intellectual Properties, Inc.
- Guo-Quan LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240145430
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Te Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING CONDUCTIVE PILLARS WITH INCLINED SURF...
- Publication number 20240136316
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chiang-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Manufacturing the Same
- Publication number 20240128157
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having a Layer Stack, Semiconductor Arrangemen...
- Publication number 20240128226
- Publication date Apr 18, 2024
- Infineon Technologies Austria AG
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240128236
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIFTED MULTI-VIA CONNECTION FOR HYBRID BONDING
- Publication number 20240120312
- Publication date Apr 11, 2024
- TOKYO ELECTRON LIMITED
- Kevin Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATING DEVICES INTO A CARRIER WAFER FOR THREE DIMENSIONALLY ST...
- Publication number 20240113070
- Publication date Apr 4, 2024
- ADVANCED MICRO DEVICES, INC.
- CHINTAN BUCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER
- Publication number 20240113006
- Publication date Apr 4, 2024
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Stacking Hybrid Substrates with...
- Publication number 20240105630
- Publication date Mar 28, 2024
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING AN INTEGRATED DEVICE, A CHIPLET AND A METALLIZAT...
- Publication number 20240105688
- Publication date Mar 28, 2024
- QUALCOMM Incorporated
- Xia LI
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Warpage control in the packaging of integrated circuits

Semiconductor module with a first substrate, a second substrate and...

Semiconductor structure comprising various via structures

Semiconductor devices

Semiconductor package having a semiconductor element and a wiring s...

Device package having a lateral power transistor with segmented chi...

Semiconductor structures and methods for forming the same

Method and apparatus for managing power in a multi-dimensional pack...

Wafer bonding method

Multi-die FPGA implementing built-in analog circuit using active si...

Integrated circuit packages having adhesion layers for through vias

Semiconductor device and method of forming same

Semiconductor device and manufacturing method thereof

Semiconductor package and method of forming same

Stacked via structure

Wafer bonding method

Semiconductor package and manufacturing method thereof

Semiconductor package manufacturing method, and adhesive sheet used...

Method for manufacturing side wettable package

Method for fabricating a chip package

Integrated circuit package and method of forming same

Semiconductor packages having conductive pillars with inclined surf...

Manufacturing method of package structure

Semiconductor device, semiconductor arrangement and method for prod...

Alignment mechanism and alignment method of bonding machine

Bonded assembly including inter-die via structures and methods for...

Hybrid felts of electrospun nanofibers

Packaging method for fan-out wafer-level packaging structure

Semiconductor device and measurement device

Semiconductor apparatus, power module, and manufacturing method of...

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF PACKAGE STRUCTURE

Semiconductor Package and Method of Manufacturing the Same

SEMICONDUCTOR STRUCTURE COMPRISING VARIOUS VIA STRUCTURES

SILICON CARBIDE SEMICONDUCTOR DEVICE

PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT PACKAGES HAVING ADHESION LAYERS FOR THROUGH VIAS

SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SAME

WAFER BONDING METHOD

STACKED VIA STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE

Integrated process sequence for hybrid bonding applications

THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION B...

CIRCUIT SUBSTRATE HAVING IMPROVED BONDING STRUCTURE

RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION STRUCTURE

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION STRUCTURE AND METHOD FOR F...

DOUBLE-SIDE COOLED POWER MODULES WITH SINTERED-SILVER INTERPOSERS

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

SEMICONDUCTOR PACKAGES HAVING CONDUCTIVE PILLARS WITH INCLINED SURF...

Semiconductor Package and Method of Manufacturing the Same

Semiconductor Device Having a Layer Stack, Semiconductor Arrangemen...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SHIFTED MULTI-VIA CONNECTION FOR HYBRID BONDING

INTEGRATING DEVICES INTO A CARRIER WAFER FOR THREE DIMENSIONALLY ST...

PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER

Semiconductor Device and Method of Stacking Hybrid Substrates with...

PACKAGE COMPRISING AN INTEGRATED DEVICE, A CHIPLET AND A METALLIZAT...