Zirconium (Zr) as principal constituent

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H01L2224/8547

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8547Zirconium (Zr) as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Light emitting device and light emitting module
- Patent number 10,297,716
- Issue date May 21, 2019
- LG Innotek Co., Ltd
- Shuhei Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, semiconductor package, and electronic device...
- Patent number 10,083,136
- Issue date Sep 25, 2018
- Samsung Electronics Co., Ltd.
- Nam-ho Song
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 9,391,006
- Issue date Jul 12, 2016
- Mitsubishi Electric Corporation
- Yazhe Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device having die bonded to the polymer side of...
- Patent number 8,456,021
- Issue date Jun 4, 2013
- Texas Instruments Incorporated
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe for semiconductor package
- Patent number 8,102,037
- Issue date Jan 24, 2012
- Amkor Technology, Inc.
- Hyung Ju Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimized circuit design layout for high performance ball grid arra...
- Patent number 8,039,320
- Issue date Oct 18, 2011
- Texas Instruments Incorporated
- William P. Stearns
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Lead frame for semiconductor package
- Patent number 7,928,542
- Issue date Apr 19, 2011
- Amkor Technology, Inc.
- Hyung Ju Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package including embedded flip chip
- Patent number 7,768,108
- Issue date Aug 3, 2010
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimized circuit design layout for high performance ball grid arra...
- Patent number 7,611,981
- Issue date Nov 3, 2009
- Texas Instruments Incorporated
- William P. Stearns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrochemical cell and fabrication method of the same
- Patent number 7,541,111
- Issue date Jun 2, 2009
- Seiko Instruments Inc.
- Hironobu Itoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for semiconductor package
- Patent number 7,521,294
- Issue date Apr 21, 2009
- Amkor Technology, Inc.
- Hyung Ju Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device in a resin sealed package with a radiating pla...
- Patent number 7,429,791
- Issue date Sep 30, 2008
- NEC Corporation
- Toshimichi Kurihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method for manufacturing the same
- Patent number 7,345,362
- Issue date Mar 18, 2008
- Matsushita Electric Industrial Co., Ltd.
- Kozo Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having stacked integrated circuits and m...
- Patent number 7,309,923
- Issue date Dec 18, 2007
- SanDisk Corporation
- Soochok Kee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip assemblies, methods of making same and component...
- Patent number 7,291,910
- Issue date Nov 6, 2007
- Tessera, Inc.
- Igor Y. Khandros
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat no-lead (QFN) grid array package, method of making and me...
- Patent number 7,279,780
- Issue date Oct 9, 2007
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic component and assembly having leads with offset por...
- Patent number 7,271,481
- Issue date Sep 18, 2007
- Tessera, Inc.
- Igor Y. Khandros
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor component with adjustment circ...
- Patent number 7,257,884
- Issue date Aug 21, 2007
- Micron Technology, Inc.
- Aaron M. Schoenfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and method for fabricating the same
- Patent number 7,239,008
- Issue date Jul 3, 2007
- Oki Electric Industry Co., Ltd.
- Akio Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having stacked, encapsulated dice and metho...
- Patent number 7,227,252
- Issue date Jun 5, 2007
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting circuit board with resin-molded section covering...
- Patent number 7,203,071
- Issue date Apr 10, 2007
- Kabushiki Kaisha Toshiba
- Tatsuya Nakagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive sheet of cross-linked silicone, method of manufacturing th...
- Patent number 7,198,853
- Issue date Apr 3, 2007
- Dow Corning Toray Silicone, Co., Ltd.
- Yoshito Ushio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip assemblies, methods of making same and component...
- Patent number 7,198,969
- Issue date Apr 3, 2007
- Tessera, Inc.
- Igor Y. Khandros
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free integrated circuit package structure
- Patent number 7,180,170
- Issue date Feb 20, 2007
- Semiconductor Components Industries, LLC
- Phillip C. Celaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Double-sided circuit board and multi-chip package including such a...
- Patent number 7,170,158
- Issue date Jan 30, 2007
- Samsung Electronics Co., Ltd.
- Hee Kook Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for semiconductor package
- Patent number 7,170,150
- Issue date Jan 30, 2007
- Amkor Technology, Inc.
- Hyung Ju Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gold spot plated leadframes for semiconductor devices and method of...
- Patent number 7,148,085
- Issue date Dec 12, 2006
- Texas Instruments Incorporated
- Donald C. Abbott
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
BOC BGA package for die with I-shaped bond pad layout
- Patent number 7,112,048
- Issue date Sep 26, 2006
- Micron Technology, Inc.
- Thiam Chye Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat no lead (QFN) grid array package
- Patent number 7,109,572
- Issue date Sep 19, 2006
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having encapsulated die stack
- Patent number 7,109,576
- Issue date Sep 19, 2006
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A MULTI-CHANNEL AND A RELATED ELECTRON...
- Publication number 20140252640
- Publication date Sep 11, 2014
- Samsung Electronics Co., Ltd.
- Min-Keun Kwak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140210093
- Publication date Jul 31, 2014
- Mitsubishi Electric Corporation
- Yazhe WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE HAVING DIE BONDED TO THE POLYMER SIDE OF...
- Publication number 20120126418
- Publication date May 24, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME FOR SEMICONDUCTOR PACKAGE
- Publication number 20110140250
- Publication date Jun 16, 2011
- Hyung Ju Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE INCLUDING EMBEDDED FLIP CHIP
- Publication number 20090230537
- Publication date Sep 17, 2009
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrochemical cell and fabrication method of the same
- Publication number 20090223036
- Publication date Sep 10, 2009
- Hironobu Itoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME FOR SEMICONDUCTOR PACKAGE
- Publication number 20090166842
- Publication date Jul 2, 2009
- Hyung Ju Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optimized Circuit Design Layout for High Performance Ball Grid Arra...
- Publication number 20090170240
- Publication date Jul 2, 2009
- TEXAS INSTRUMENTS INCORPORATED
- William P. Stearns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20070262468
- Publication date Nov 15, 2007
- Hayato Nasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating semiconductor component with adjustment circ...
- Publication number 20070137029
- Publication date Jun 21, 2007
- Aaron M. Schoenfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Double-sided circuit board and multi-chip package including such a...
- Publication number 20070096288
- Publication date May 3, 2007
- Hee Kook Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame for semiconductor package
- Publication number 20060289973
- Publication date Dec 28, 2006
- Hyung Ju Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframeless package structure and method
- Publication number 20060261450
- Publication date Nov 23, 2006
- STMicroelectronics, Inc.
- Harry M. Siegel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic component and assembly having leads with offset por...
- Publication number 20060244135
- Publication date Nov 2, 2006
- Tessera, Inc.
- Igor Y. Khandros
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component having stacked, encapsulated dice and metho...
- Publication number 20060006518
- Publication date Jan 12, 2006
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating semiconductor component with adjustment circ...
- Publication number 20060006551
- Publication date Jan 12, 2006
- Aaron M. Schoenfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Quad flat no-lead (QFN) grid array package, method of making and me...
- Publication number 20050285241
- Publication date Dec 29, 2005
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package and method
- Publication number 20050121767
- Publication date Jun 9, 2005
- Phillip C. Celaya
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Microelectronic component and assembly having leads with offset por...
- Publication number 20050087855
- Publication date Apr 28, 2005
- Tessera, Inc.
- Igor Y. Khandros
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrochemical cell and fabrication method of the same
- Publication number 20050037258
- Publication date Feb 17, 2005
- Hironobu Itoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component and method for manufacturing the same
- Publication number 20050036278
- Publication date Feb 17, 2005
- Kozo Murakami
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ADHESIVE SHEET OF CROSS-LINKED SILICONE, METHOD OF MANUFACTURING TH...
- Publication number 20040265599
- Publication date Dec 30, 2004
- Yoshito Ushio
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Packages for communication devices and a process for manufacturing...
- Publication number 20040257779
- Publication date Dec 23, 2004
- Hironobu Itoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package having stacked integrated circuits and m...
- Publication number 20040251557
- Publication date Dec 16, 2004
- SanDisk Corporation
- Soochok Kee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating semiconductor component having stacked, enca...
- Publication number 20040229401
- Publication date Nov 18, 2004
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component having encapsulated die stack
- Publication number 20040227240
- Publication date Nov 18, 2004
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT HAVING STACKED, ENCAPSULATED DICE
- Publication number 20040227250
- Publication date Nov 18, 2004
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframeless package structure and method
- Publication number 20040200062
- Publication date Oct 14, 2004
- STMicroelectronics, Inc.
- Harry M. Siegel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Aluminum leadframes for semiconductor devices and method of fabrica...
- Publication number 20040188810
- Publication date Sep 30, 2004
- John P. Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package having angulated interconnect surfaces
- Publication number 20040188812
- Publication date Sep 30, 2004
- Thomas H. Koschmieder
- H01 - BASIC ELECTRIC ELEMENTS

Zirconium (Zr) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Light emitting device and light emitting module

Electronic component, semiconductor package, and electronic device...

Semiconductor device and method of manufacturing semiconductor device

Integrated circuit device having die bonded to the polymer side of...

Leadframe for semiconductor package

Optimized circuit design layout for high performance ball grid arra...

Lead frame for semiconductor package

Semiconductor die package including embedded flip chip

Optimized circuit design layout for high performance ball grid arra...

Electrochemical cell and fabrication method of the same

Lead frame for semiconductor package

Semiconductor device in a resin sealed package with a radiating pla...

Electronic component and method for manufacturing the same

Integrated circuit package having stacked integrated circuits and m...

Semiconductor chip assemblies, methods of making same and component...

Quad flat no-lead (QFN) grid array package, method of making and me...

Microelectronic component and assembly having leads with offset por...

Method for fabricating semiconductor component with adjustment circ...

Semiconductor apparatus and method for fabricating the same

Semiconductor component having stacked, encapsulated dice and metho...

Component mounting circuit board with resin-molded section covering...

Adhesive sheet of cross-linked silicone, method of manufacturing th...

Semiconductor chip assemblies, methods of making same and component...

Lead-free integrated circuit package structure

Double-sided circuit board and multi-chip package including such a...

Lead frame for semiconductor package

Gold spot plated leadframes for semiconductor devices and method of...

BOC BGA package for die with I-shaped bond pad layout

Quad flat no lead (QFN) grid array package

Semiconductor component having encapsulated die stack

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE HAVING A MULTI-CHANNEL AND A RELATED ELECTRON...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT DEVICE HAVING DIE BONDED TO THE POLYMER SIDE OF...

LEADFRAME FOR SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DIE PACKAGE INCLUDING EMBEDDED FLIP CHIP

Electrochemical cell and fabrication method of the same

LEADFRAME FOR SEMICONDUCTOR PACKAGE

Optimized Circuit Design Layout for High Performance Ball Grid Arra...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Method for fabricating semiconductor component with adjustment circ...

Double-sided circuit board and multi-chip package including such a...

Lead frame for semiconductor package

Leadframeless package structure and method

Microelectronic component and assembly having leads with offset por...

Semiconductor component having stacked, encapsulated dice and metho...

Method for fabricating semiconductor component with adjustment circ...

Quad flat no-lead (QFN) grid array package, method of making and me...

Integrated circuit package and method

Microelectronic component and assembly having leads with offset por...

Electrochemical cell and fabrication method of the same

Electronic component and method for manufacturing the same

ADHESIVE SHEET OF CROSS-LINKED SILICONE, METHOD OF MANUFACTURING TH...

Packages for communication devices and a process for manufacturing...

Integrated circuit package having stacked integrated circuits and m...

Method for fabricating semiconductor component having stacked, enca...

Semiconductor component having encapsulated die stack

SEMICONDUCTOR COMPONENT HAVING STACKED, ENCAPSULATED DICE

Leadframeless package structure and method

Aluminum leadframes for semiconductor devices and method of fabrica...

Semiconductor package having angulated interconnect surfaces