Zirconium [Zr] as principal constituent

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CPC
H01L2224/1367

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/1367Zirconium [Zr] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Interconnect crack arrestor structure and methods
- Patent number 11,257,767
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
- Patent number 11,244,917
- Issue date Feb 8, 2022
- International Business Machines Corporation
- Virendra R. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
- Patent number 11,171,102
- Issue date Nov 9, 2021
- International Business Machines Corporation
- Virendra R. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
- Patent number 11,094,657
- Issue date Aug 17, 2021
- International Business Machines Corporation
- Virendra R. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tall and fine pitch interconnects
- Patent number 10,818,629
- Issue date Oct 27, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin-encapsulated semiconductor device and method of manufacturing...
- Patent number 10,600,752
- Issue date Mar 24, 2020
- ABLIC Inc.
- Noriyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with barrier layer
- Patent number 10,593,621
- Issue date Mar 17, 2020
- Shinko Electric Industries Co., Ltd.
- Keigo Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
- Patent number 10,403,590
- Issue date Sep 3, 2019
- International Business Machines Corporation
- Virendra R. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
- Patent number 10,396,051
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Virendra R. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced through substrate via metallization in three dimensional s...
- Patent number 10,396,013
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced through substrate via metallization in three dimensional s...
- Patent number 10,396,012
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-encapsulated semiconductor device and method of manufacturing...
- Patent number 10,354,968
- Issue date Jul 16, 2019
- ABLIC Inc.
- Noriyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect crack arrestor structure and methods
- Patent number 10,340,226
- Issue date Jul 2, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding electrode structure of flip-chip led chip and fabrication m...
- Patent number 10,276,750
- Issue date Apr 30, 2019
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Zhibai Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tall and fine pitch interconnects
- Patent number 10,103,121
- Issue date Oct 16, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder particle
- Patent number 10,020,274
- Issue date Jul 10, 2018
- TETOS Co., Ltd.
- Woo Young Ahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding structure for semiconductor package and method of manufactu...
- Patent number 9,984,993
- Issue date May 29, 2018
- Advanced Semiconductor Engineering, Inc.
- Min-Fong Shu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar design for conductive bump
- Patent number 9,953,948
- Issue date Apr 24, 2018
- Taiwan Semiconductor Manufacturing Company
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tall and fine pitch interconnects
- Patent number 9,842,819
- Issue date Dec 12, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 9,698,088
- Issue date Jul 4, 2017
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump electrode, board which has bump electrodes, and method for man...
- Patent number 9,662,730
- Issue date May 30, 2017
- Senju Metal Industry Co., Ltd.
- Takahiro Hattori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Advanced metal-to-metal direct bonding
- Patent number 9,640,509
- Issue date May 2, 2017
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar design for conductive bump
- Patent number 9,496,235
- Issue date Nov 15, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacture of coated copper pillars
- Patent number 9,331,040
- Issue date May 3, 2016
- Atotech Deutschland GmbH
- Thomas Beck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect crack arrestor structure and methods
- Patent number 9,230,932
- Issue date Jan 5, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a conducting contact on a conducting element
- Patent number 9,224,708
- Issue date Dec 29, 2015
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean-Philippe Colonna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar design for conductive bump
- Patent number 8,816,498
- Issue date Aug 26, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective layer for protecting TSV tips during thermo-compressive...
- Patent number 8,723,330
- Issue date May 13, 2014
- Texas Instruments Incorporated
- Jeffrey A West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV pillar as an interconnecting structure
- Patent number 8,691,691
- Issue date Apr 8, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with reinforced positive alignment features
- Patent number 8,659,161
- Issue date Feb 25, 2014
- Oracle International Corporation
- Ashok V. Krishnamoorthy
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...
- Publication number 20190333888
- Publication date Oct 31, 2019
- ABLIC Inc.
- Noriyuki KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Crack Arrestor Structure and Methods
- Publication number 20190326228
- Publication date Oct 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
- Publication number 20190326242
- Publication date Oct 24, 2019
- International Business Machines Corporation
- Virendra R. JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
- Publication number 20190326243
- Publication date Oct 24, 2019
- International Business Machines Corporation
- Virendra R. JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
- Publication number 20190157230
- Publication date May 23, 2019
- International Business Machines Corporation
- Virendra R. JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TALL AND FINE PITCH INTERCONNECTS
- Publication number 20190013287
- Publication date Jan 10, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...
- Publication number 20180286827
- Publication date Oct 4, 2018
- ABLIC Inc.
- Noriyuki KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER PARTICLE
- Publication number 20180158790
- Publication date Jun 7, 2018
- TETOS Co., Ltd.
- Woo Young AHN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Tall and Fine Pitch Interconnects
- Publication number 20180096960
- Publication date Apr 5, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
- Publication number 20170170135
- Publication date Jun 15, 2017
- International Business Machines Corporation
- Virendra R. JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TALL AND FINE PITCH INTERCONNECTS
- Publication number 20170053886
- Publication date Feb 23, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact bumps methods of making contact bumps
- Publication number 20160233188
- Publication date Aug 11, 2016
- SMARTRAC TECHNOLOGY GmbH
- Frank Kriebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method of Batch-Packaging Low Pin Count Embedded Semi...
- Publication number 20160005705
- Publication date Jan 7, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Mutsumi Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURE OF COATED COPPER PILLARS
- Publication number 20150279797
- Publication date Oct 1, 2015
- ATOTECH DEUTSCHLAND GMBH
- Thomas Beck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pillar Design for Conductive Bump
- Publication number 20140361432
- Publication date Dec 11, 2014
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL CHIP STACK AND METHOD OF FORMING THE SAME
- Publication number 20130307144
- Publication date Nov 21, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE LAYER FOR PROTECTING TSV TIPS DURING THERMO-COMPRESSIVE...
- Publication number 20130249098
- Publication date Sep 26, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Crack Arrestor Structure and Methods
- Publication number 20130207239
- Publication date Aug 15, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...
- Publication number 20130200520
- Publication date Aug 8, 2013
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...
- Publication number 20130113106
- Publication date May 9, 2013
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV PILLAR AS AN INTERCONNECTING STRUCTURE
- Publication number 20130026606
- Publication date Jan 31, 2013
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pillar Design for Conductive Bump
- Publication number 20130020698
- Publication date Jan 24, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH REINFORCED POSITIVE ALIGNMENT FEATURES
- Publication number 20120326322
- Publication date Dec 27, 2012
- Oracle International Corporation
- Ashok V. Krishnamoorthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Bump Formation
- Publication number 20120322255
- Publication date Dec 20, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE LAYER FOR PROTECTING TSV TIPS DURING THERMO-COMPRESSIVE...
- Publication number 20120306085
- Publication date Dec 6, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20120299197
- Publication date Nov 29, 2012
- Samsung Electronics Co., Ltd.
- Heungkyu KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND FABRICATION PROCESS...
- Publication number 20110115076
- Publication date May 19, 2011
- SEIKO EPSON CORPORATION
- Yasuo YAMASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A SIDEWALL-PROTECTED METALLIC PILLAR ON A SEMICOND...
- Publication number 20100038777
- Publication date Feb 18, 2010
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND METHOD FOR FABRICATING THE SAME
- Publication number 20090291554
- Publication date Nov 26, 2009
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MOUNTING SEMICONDUCTOR DEVICE, AS WELL AS CIRCUIT BOARD,...
- Publication number 20090242122
- Publication date Oct 1, 2009
- SEIKO EPSON CORPORATION
- Shuichi TANAKA
- H01 - BASIC ELECTRIC ELEMENTS

Zirconium [Zr] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Interconnect crack arrestor structure and methods

Multilayer pillar for reduced stress interconnect and method of mak...

Multilayer pillar for reduced stress interconnect and method of mak...

Multilayer pillar for reduced stress interconnect and method of mak...

Tall and fine pitch interconnects

Resin-encapsulated semiconductor device and method of manufacturing...

Semiconductor device with barrier layer

Multilayer pillar for reduced stress interconnect and method of mak...

Multilayer pillar for reduced stress interconnect and method of mak...

Advanced through substrate via metallization in three dimensional s...

Advanced through substrate via metallization in three dimensional s...

Resin-encapsulated semiconductor device and method of manufacturing...

Interconnect crack arrestor structure and methods

Bonding electrode structure of flip-chip led chip and fabrication m...

Tall and fine pitch interconnects

Solder particle

Bonding structure for semiconductor package and method of manufactu...

Pillar design for conductive bump

Tall and fine pitch interconnects

Semiconductor packages

Bump electrode, board which has bump electrodes, and method for man...

Advanced metal-to-metal direct bonding

Pillar design for conductive bump

Manufacture of coated copper pillars

Interconnect crack arrestor structure and methods

Method for manufacturing a conducting contact on a conducting element

Pillar design for conductive bump

Protective layer for protecting TSV tips during thermo-compressive...

TSV pillar as an interconnecting structure

Chip package with reinforced positive alignment features

Patents Applicationslast 30 patents

RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...

Interconnect Crack Arrestor Structure and Methods

MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...

MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...

MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...

TALL AND FINE PITCH INTERCONNECTS

RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...

SOLDER PARTICLE

Tall and Fine Pitch Interconnects

MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...

TALL AND FINE PITCH INTERCONNECTS

Contact bumps methods of making contact bumps

Structure and Method of Batch-Packaging Low Pin Count Embedded Semi...

MANUFACTURE OF COATED COPPER PILLARS

Pillar Design for Conductive Bump

THREE-DIMENSIONAL CHIP STACK AND METHOD OF FORMING THE SAME

PROTECTIVE LAYER FOR PROTECTING TSV TIPS DURING THERMO-COMPRESSIVE...

Interconnect Crack Arrestor Structure and Methods

THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...

THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...

TSV PILLAR AS AN INTERCONNECTING STRUCTURE

Pillar Design for Conductive Bump

CHIP PACKAGE WITH REINFORCED POSITIVE ALIGNMENT FEATURES

Metal Bump Formation

PROTECTIVE LAYER FOR PROTECTING TSV TIPS DURING THERMO-COMPRESSIVE...

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND FABRICATION PROCESS...

METHOD OF MAKING A SIDEWALL-PROTECTED METALLIC PILLAR ON A SEMICOND...

SEMICONDUCTOR CHIP AND METHOD FOR FABRICATING THE SAME

METHOD FOR MOUNTING SEMICONDUCTOR DEVICE, AS WELL AS CIRCUIT BOARD,...