Zirconium [Zr] as principal constituent

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H01L2224/0517

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/0517Zirconium [Zr] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Backside power distribution network semiconductor package and metho...
- Patent number 12,142,564
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor element, and semiconductor el...
- Patent number 12,132,142
- Issue date Oct 29, 2024
- Kyocera Corporation
- Katsuaki Masaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 12,119,294
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with encapsulant deposited along sides and sur...
- Patent number 12,094,729
- Issue date Sep 17, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method to minimize stress on stack via
- Patent number 12,080,600
- Issue date Sep 3, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach surface copper layer with protective layer for microelec...
- Patent number 12,074,096
- Issue date Aug 27, 2024
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die contact structure and method
- Patent number 12,074,127
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced device assembly structures and methods
- Patent number 11,999,001
- Issue date Jun 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged die and RDL with bonding structures therebetween
- Patent number 11,996,401
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging method and semiconductor package device
- Patent number 11,990,432
- Issue date May 21, 2024
- TONGFU MICROELECTRONICS CO., LTD.
- Guoqing Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,973,016
- Issue date Apr 30, 2024
- Infineon Technologies Austria AG
- Elvir Kahrimanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing loss in stacked quantum devices
- Patent number 11,955,465
- Issue date Apr 9, 2024
- Google LLC
- Theodore Charles White
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Array substrate, display panel and display device
- Patent number 11,942,443
- Issue date Mar 26, 2024
- HEFEI BOE DISPLAY TECHNOLOGY CO., LTD.
- Chunxu Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with slanted conductive...
- Patent number 11,935,850
- Issue date Mar 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Kuo-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon photonic interposer with two metal redistribution layers
- Patent number 11,923,327
- Issue date Mar 5, 2024
- Rockley Photonics Limited
- Michael Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure and method of manufacturing bump structure
- Patent number 11,923,326
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Chang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for fabricating semiconductor device with graphene layers
- Patent number 11,908,816
- Issue date Feb 20, 2024
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package system and method
- Patent number 11,901,319
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal contact structure
- Patent number 11,894,326
- Issue date Feb 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variation of metal layer stack under under bump metallization (UBM)
- Patent number 11,894,829
- Issue date Feb 6, 2024
- RF360 SINGAPORE PTE. LTD.
- Ute Steinhaeusser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a metallization structure
- Patent number 11,876,041
- Issue date Jan 16, 2024
- Infineon Technologies Austria AG
- Oliver Blank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide device and method for forming a silicon carbide device
- Patent number 11,869,840
- Issue date Jan 9, 2024
- Infineon Technologies AG
- Ralf Siemieniec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor components having conductive vias with aligned back s...
- Patent number 11,869,809
- Issue date Jan 9, 2024
- Micron Technology, Inc.
- Jin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 11,842,975
- Issue date Dec 12, 2023
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder based hybrid bonding for fine pitch and thin BLT interconnec...
- Patent number 11,810,882
- Issue date Nov 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure containing pre-polymerized protective layer...
- Patent number 11,776,922
- Issue date Oct 3, 2023
- SanDisk Technologies LLC
- Hajime Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,769,746
- Issue date Sep 26, 2023
- Samsung Electronics Co., Ltd.
- Ae-nee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside power distribution network semiconductor package and metho...
- Patent number 11,769,728
- Issue date Sep 26, 2023
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a sidewall connection
- Patent number 11,749,627
- Issue date Sep 5, 2023
- STMicroelectronics Ltd.
- Endruw Jahja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, semiconductor packages, and methods of manuf...
- Patent number 11,728,297
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR ELEMENT WITH BONDING LAYER HAVING LOW-K DIELECTRIC MA...
- Publication number 20240332227
- Publication date Oct 3, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE
- Publication number 20240297106
- Publication date Sep 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES INCLUDING MULTILAYER STACKS WITH IMPR...
- Publication number 20240258217
- Publication date Aug 1, 2024
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE
- Publication number 20240258252
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240243028
- Publication date Jul 18, 2024
- Innolux Corporation
- Ming-Chih Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240234354
- Publication date Jul 11, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-METAL CONTACT STRUCTURE
- Publication number 20240203917
- Publication date Jun 20, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING DIELECTRIC LAYER ON SURFACE OF WAFER, WAFER ST...
- Publication number 20240162161
- Publication date May 16, 2024
- CHIPMORE TECHNOLOGY CORPORATION LIMITED
- Guanmeng XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SYSTEM AND METHOD
- Publication number 20240153896
- Publication date May 9, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CHIP WITH UBM-TYPE METALLIZATION
- Publication number 20240113054
- Publication date Apr 4, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Clément Lobre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Carbide Device and Method for Forming a Silicon Carbide Device
- Publication number 20240113026
- Publication date Apr 4, 2024
- INFINEON TECHNOLOGIES AG
- Edward Fürgut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM
- Publication number 20240088087
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Alexander HEINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20240071973
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING DISPLAY PANEL
- Publication number 20240072027
- Publication date Feb 29, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jeong Won HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240055401
- Publication date Feb 15, 2024
- United Microelectronics Corp.
- Kun-Ju LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER DISTRIBUTION NETWORK SEMICONDUCTOR PACKAGE AND METHO...
- Publication number 20230411294
- Publication date Dec 21, 2023
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR SUPERCONDUCTING MULTI-CHIP MODULE
- Publication number 20230380302
- Publication date Nov 23, 2023
- Daniel Yohannes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REWORKABLE INTER-SUBSTRATE BOND STRUCTURE
- Publication number 20230378126
- Publication date Nov 23, 2023
- The Boeing Company
- Peter D. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES CONTAINING COPPER BONDING PADS WITH DIFFERENT...
- Publication number 20230361066
- Publication date Nov 9, 2023
- SANDISK TECHNOLOGIES LLC
- Linghan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230352430
- Publication date Nov 2, 2023
- RENESAS ELECTRONICS CORPORATION
- Takashi MORIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANSION CONTROLLED STRUCTURE FOR DIRECT BONDING AND METHOD OF FOR...
- Publication number 20230343734
- Publication date Oct 26, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DELAMINATION/CRACKING IMPROVEMENT AT SOLDER JOINTS IN MICROELECTRON...
- Publication number 20230326899
- Publication date Oct 12, 2023
- Qorvo US, Inc.
- Yinbao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20230317649
- Publication date Oct 5, 2023
- Fuji Electric Co., Ltd.
- Masahide GOTOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20230282605
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN
- Publication number 20230253395
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20230253412
- Publication date Aug 10, 2023
- SAMSUNG DISPLAY CO., LTD.
- Jeong Su PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND TILE-SHAPED DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20230238398
- Publication date Jul 27, 2023
- SAMSUNG DISPLAY CO., LTD.
- Byeong Kyun CHOI
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
REDUCING LOSS IN STACKED QUANTUM DEVICES
- Publication number 20230178519
- Publication date Jun 8, 2023
- Google LLC
- Theodore Charles White
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20230178511
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Young Chul SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING ELEMENT ARRAY, OPTICAL PRINTER HEAD INCLUDING LIGHT-...
- Publication number 20230113637
- Publication date Apr 13, 2023
- KYOCERA CORPORATION
- Takanori WATANABE
- H01 - BASIC ELECTRIC ELEMENTS

Zirconium [Zr] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Backside power distribution network semiconductor package and metho...

Method of manufacturing semiconductor element, and semiconductor el...

Through-substrate via structure and method of manufacture

Semiconductor device with encapsulant deposited along sides and sur...

Semiconductor device and method to minimize stress on stack via

Die attach surface copper layer with protective layer for microelec...

Semiconductor die contact structure and method

Advanced device assembly structures and methods

Packaged die and RDL with bonding structures therebetween

Semiconductor packaging method and semiconductor package device

Semiconductor device

Reducing loss in stacked quantum devices

Array substrate, display panel and display device

Method for fabricating semiconductor device with slanted conductive...

Silicon photonic interposer with two metal redistribution layers

Bump structure and method of manufacturing bump structure

Method for fabricating semiconductor device with graphene layers

Semiconductor package system and method

Multi-metal contact structure

Variation of metal layer stack under under bump metallization (UBM)

Semiconductor device having a metallization structure

Silicon carbide device and method for forming a silicon carbide device

Semiconductor components having conductive vias with aligned back s...

Electronic device with multi-layer contact and system

Solder based hybrid bonding for fine pitch and thin BLT interconnec...

Semiconductor structure containing pre-polymerized protective layer...

Semiconductor package

Backside power distribution network semiconductor package and metho...

Semiconductor package having a sidewall connection

Semiconductor devices, semiconductor packages, and methods of manuf...

Patents Applicationslast 30 patents

SEMICONDUCTOR ELEMENT WITH BONDING LAYER HAVING LOW-K DIELECTRIC MA...

THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE PACKAGES INCLUDING MULTILAYER STACKS WITH IMPR...

BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

MULTI-METAL CONTACT STRUCTURE

METHOD FOR PREPARING DIELECTRIC LAYER ON SURFACE OF WAFER, WAFER ST...

SEMICONDUCTOR PACKAGE SYSTEM AND METHOD

ELECTRONIC CHIP WITH UBM-TYPE METALLIZATION

Silicon Carbide Device and Method for Forming a Silicon Carbide Device

ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

METHOD OF FABRICATING DISPLAY PANEL

SEMICONDUCTOR ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME

BACKSIDE POWER DISTRIBUTION NETWORK SEMICONDUCTOR PACKAGE AND METHO...

SYSTEM AND METHOD FOR SUPERCONDUCTING MULTI-CHIP MODULE

REWORKABLE INTER-SUBSTRATE BOND STRUCTURE

SEMICONDUCTOR DEVICES CONTAINING COPPER BONDING PADS WITH DIFFERENT...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

EXPANSION CONTROLLED STRUCTURE FOR DIRECT BONDING AND METHOD OF FOR...

DELAMINATION/CRACKING IMPROVEMENT AT SOLDER JOINTS IN MICROELECTRON...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN

DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME

DISPLAY DEVICE AND TILE-SHAPED DISPLAY DEVICE INCLUDING THE SAME

REDUCING LOSS IN STACKED QUANTUM DEVICES

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

LIGHT-EMITTING ELEMENT ARRAY, OPTICAL PRINTER HEAD INCLUDING LIGHT-...