2582685

Information

• Patent Grant
• 2582685

• References
• Source

• Patent Number

  2,582,685

• Date Filed

  Not available

• Date Issued

  Tuesday, January 15, 1952
  73 years ago

• CPC

  • H05K3/02 - in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
  • B23K1/08 - Soldering by means of dipping in molten solder
  • H02K3/26 - consisting of printed conductors
  • H05K3/067 - Etchants
  • H05K2201/0305 - Solder used for other purposes than connections between PCB or components
  • H05K2203/0113 - Female die used for patterning or transferring
  • Y10S425/811 - Stencil
  • Y10T29/304 - Using transitory solid cover material
  • Y10T29/49155 - Manufacturing circuit on or in base
  • Y10T29/49821 - by altering or destroying work part or connector

• US Classifications

  • 029 - Metal working
  • 101 - Printing
  • 361 - Electricity: electrical systems and devices
  • 425 - Plastic article or earthenware shaping or treating: apparatus
  • 427 - Coating processes
  • 430 - Radiation imagery chemistry: process, composition, or product thereof
  • 432 - Heating
  • 439 - Electrical connectors