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2636807
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Information
Patent Grant
2636807
References
Source
Patent Number
2,636,807
Date Filed
Not available
Date Issued
Tuesday, April 28, 1953
72 years ago
CPC
H05K3/4046 - using auxiliary conductive elements
C01F11/32 - Purification
C08L97/02 - Lignocellulosic material
H01J9/28 - Manufacture of leading-in conductors
H01J29/92 - Means forming part of the tube for the purpose of providing electrical connection to it
H05K1/0306 - Inorganic insulating substrates
H05K3/3463 - Solder compositions in relation to features of the printed circuit board or the mounting process
H05K2201/0382 - Continuously deformed conductors
H05K2201/10416 - Metallic blocks or heatsinks completely inserted in a PCB
US Classifications
423 - Chemistry of inorganic compounds
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