2861911

Information

• Patent Grant
• 2861911

• References
• Source

• Patent Number

  2,861,911

• Date Filed

  Not available

• Date Issued

  Tuesday, November 25, 1958
  66 years ago

• CPC

  • H05K3/20 - by affixing prefabricated conductor pattern
  • H05K3/107 - by filling grooves in the support with conductive material
  • H05K3/14 - using spraying techniques to apply the conductive material including vapour evaporation
  • H05K3/143 - Masks therefor
  • H05K2201/0317 - Thin film conductor layer Thin film passive component
  • H05K2201/0376 - Flush conductors
  • H05K2201/09118 - Moulded substrate
  • H05K2203/016 - Temporary inorganic, non-metallic carrier
  • H05K2203/0278 - Flat pressure
  • H05K2203/0557 - Non-printed masks
  • H05K2203/104 - Using magnetic force
  • H05K2203/1344 - Spraying small metal particles or droplets of molten metal
  • Y10S264/53 - Processes of using glass filter in molding process
  • Y10S425/811 - Stencil
  • Y10T29/4916 - Simultaneous circuit manufacturing
  • Y10T29/49984 - and casting

• US Classifications

  • 264 - Plastic and nonmetallic article shaping or treating: processes
  • 029 - Metal working
  • 156 - Adhesive bonding and miscellaneous chemical manufacture
  • 174 - Electricity: conductors and insulators
  • 361 - Electricity: electrical systems and devices
  • 425 - Plastic article or earthenware shaping or treating: apparatus
  • 427 - Coating processes
  • 439 - Electrical connectors