2998334

Information

• Patent Grant
• 2998334

• References
• Source

• Patent Number

  2,998,334

• Date Filed

  Not available

• Date Issued

  Tuesday, August 29, 1961
  64 years ago

• CPC

  • H01L21/24 - Alloying of impurity materials
  • H01L21/185 - Joining of semiconductor bodies for junction formation
  • H01L21/228 - using diffusion into or out of a solid from or into a liquid phase
  • Y10S148/107 - Melt
  • Y10S148/151 - Simultaneous diffusion
  • Y10S148/166 - Traveling solvent method

• US Classifications

  • 438 - Semiconductor device manufacturing: process
  • 148 - Metal treatment
  • 228 - Metal fusion bonding
  • 257 - Active solid-state devices
  • 420 - Alloys or metallic compositions