3002134

Information

• Patent Grant
• 3002134

• References
• Source

• Patent Number

  3,002,134

• Date Filed

  Not available

• Date Issued

  Tuesday, September 26, 1961
  63 years ago

• CPC

  • H01L23/48 - Arrangements for conducting electric current to or from the solid state body in operation
  • H01L21/24 - Alloying of impurity materials
  • H01L23/10 - characterised by the material or arrangement of seals between parts,ween cap
  • H01L24/00 - Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
  • H01L29/00 - Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier
  • Y10T29/49187 - with forming eyelet from elongated conductor

• US Classifications

  • 257 - Active solid-state devices
  • 029 - Metal working
  • 438 - Semiconductor device manufacturing: process
  • 439 - Electrical connectors