3136932

Information

• Patent Grant
• 3136932

• References
• Source

• Patent Number

  3,136,932

• Date Filed

  Not available

• Date Issued

  Tuesday, June 9, 1964
  60 years ago

• CPC

  • H01L23/42 - Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
  • C03C27/042 - consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts
  • H01L21/00 - Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L23/041 - the container being a hollow construction having no base used as a mounting for the semiconductor body
  • H01L23/045 - the other leads having an insulating passage through the base
  • H01L23/488 - consisting of soldered or bonded constructions
  • H01L2924/0002 - Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
  • H01L2924/01079 - Gold [Au]

• US Classifications

  • 257 - Active solid-state devices
  • 174 - Electricity: conductors and insulators