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3519894
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Information
Patent Grant
3519894
References
Source
Patent Number
3,519,894
Date Filed
Not available
Date Issued
Tuesday, July 7, 1970
54 years ago
CPC
H01L24/83 - using a layer connector
H01F6/00 - Superconducting magnets Superconducting coils
H01L21/00 - Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H01L24/31 - Structure, shape, material or disposition of the layer connectors after the connecting process
H01L29/00 - Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier
H01L2224/29109 - Indium [In] as principal constituent
H01L2224/29111 - Tin [Sn] as principal constituent
H01L2224/29116 - Lead [Pb] as principal constituent
H01L2224/8319 - Arrangement of the layer connectors prior to mounting
H01L2224/83801 - Soldering or alloying
H01L2924/01005 - Boron [B]
H01L2924/01006 - Carbon [C]
H01L2924/01013 - Aluminum [Al]
H01L2924/01015 - Phosphorus [P]
H01L2924/01019 - Potassium [K]
H01L2924/01023 - Vanadium [V]
H01L2924/01027 - Cobalt [Co]
H01L2924/01029 - Copper [Cu]
H01L2924/01032 - Germanium [Ge]
H01L2924/01033 - Arsenic [As]
H01L2924/01042 - Molybdenum [Mo]
H01L2924/01049 - Indium [In]
H01L2924/0105 - Tin [Sn]
H01L2924/01051 - Antimony [Sb]
H01L2924/01052 - Tellurium [Te]
H01L2924/01068 - Erbium [Er]
H01L2924/01074 - Tungsten [W]
H01L2924/01075 - Rhenium [Re]
H01L2924/01079 - Gold [Au]
H01L2924/01082 - Lead [Pb]
H01L2924/014 - Solder alloys
H01L2924/3011 - Impedance
Y10S505/875 - Combined with housing and cryogenic fluid cooling
US Classifications
257 - Active solid-state devices
327 - Miscellaneous active electrical nonlinear devices, circuits, and systems
361 - Electricity: electrical systems and devices
505 - Superconductor technology: apparatus, material, process
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