3585715

Information

• Patent Grant
• 3585715

• References
• Source

• Patent Number

  3,585,715

• Date Filed

  Not available

• Date Issued

  Tuesday, June 22, 1971
  53 years ago

• CPC

  • H01L24/01 - Means for bonding being attached to, or being formed on, the surface to be connected
  • H01J5/32 - Seals for leading-in conductors
  • H01L23/488 - consisting of soldered or bonded constructions
  • H01L2924/01005 - Boron [B]
  • H01L2924/01006 - Carbon [C]
  • H01L2924/01019 - Potassium [K]
  • H01L2924/01029 - Copper [Cu]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/01039 - Yttrium [Y]
  • H01L2924/01074 - Tungsten [W]
  • H01L2924/01082 - Lead [Pb]
  • Y10S65/11 - Encapsulating

• US Classifications

  • 219 - Electric heating
  • 065 - Glass manufacturing
  • 228 - Metal fusion bonding
  • 257 - Active solid-state devices
  • 438 - Semiconductor device manufacturing: process