3615933

Information

• Patent Grant
• 3615933

• References
• Source

• Patent Number

  3,615,933

• Date Filed

  Not available

• Date Issued

  Tuesday, October 26, 1971
  53 years ago

• CPC

  • H01L24/26 - Layer connectors
  • H01L24/83 - using a layer connector
  • H01L29/00 - Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier
  • H01L2224/8319 - Arrangement of the layer connectors prior to mounting
  • H01L2224/83801 - Soldering or alloying
  • H01L2924/01005 - Boron [B]
  • H01L2924/01006 - Carbon [C]
  • H01L2924/01013 - Aluminum [Al]
  • H01L2924/01014 - Silicon [Si]
  • H01L2924/01015 - Phosphorus [P]
  • H01L2924/01023 - Vanadium [V]
  • H01L2924/01032 - Germanium [Ge]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/01041 - Niobium [Nb]
  • H01L2924/01042 - Molybdenum [Mo]
  • H01L2924/01073 - Tantalum [Ta]
  • H01L2924/01074 - Tungsten [W]
  • H01L2924/014 - Solder alloys
  • H01L2924/12036 - PN diode
  • Y10S148/142 - Semiconductor-metal-semiconductor

• US Classifications

  • 438 - Semiconductor device manufacturing: process
  • 148 - Metal treatment
  • 228 - Metal fusion bonding
  • 257 - Active solid-state devices