3701696

Information

• Patent Grant
• 3701696

• References
• Source

• Patent Number

  3,701,696

• Date Filed

  Not available

• Date Issued

  Tuesday, October 31, 1972
  52 years ago

• CPC

  • H01L23/3157 - Partial encapsulation or coating
  • H01L21/00 - Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/78 - with subsequent division of the substrate into plural individual devices
  • H01L29/00 - Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier
  • H01L2924/0002 - Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
  • Y10S148/028 - Dicing
  • Y10S148/039 - Displace P-N junction
  • Y10S148/054 - Flat sheets-substrates
  • Y10S148/06 - Gettering
  • Y10S148/145 - Shaped junctions
  • Y10S438/912 - Displacing pn junction

• US Classifications

  • 438 - Semiconductor device manufacturing: process
  • 148 - Metal treatment
  • 257 - Active solid-state devices