3702464

Information

• Patent Grant
• 3702464

• References
• Source

• Patent Number

  3,702,464

• Date Filed

  Not available

• Date Issued

  Tuesday, November 7, 1972
  52 years ago

• CPC

  • H01L23/49855 - for flat-cards
  • G06K19/07743 - External electrical contacts
  • G06K19/07745 - Mounting details of integrated circuit chips
  • G07F7/0866 - by active credit-cards adapted therefor
  • H01L24/81 - using a bump connector
  • H01L27/00 - Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate
  • G05B2219/36106 - Cassette
  • H01L2224/81801 - Soldering or alloying
  • H01L2924/01005 - Boron [B]
  • H01L2924/01006 - Carbon [C]
  • H01L2924/01013 - Aluminum [Al]
  • H01L2924/01019 - Potassium [K]
  • H01L2924/01021 - Scandium [Sc]
  • H01L2924/01029 - Copper [Cu]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/01056 - Barium [Ba]
  • H01L2924/01074 - Tungsten [W]
  • H01L2924/01075 - Rhenium [Re]
  • H01L2924/01079 - Gold [Au]
  • H01L2924/01322 - Eutectic Alloys
  • H01L2924/014 - Solder alloys
  • H01L2924/10253 - Silicon [Si]
  • H01L2924/14 - Integrated circuits

• US Classifications

  • 235 - Registers
  • 101 - Printing
  • 257 - Active solid-state devices
  • 365 - Static information storage and retrieval