3887421

Information

• Patent Grant
• 3887421

• References
• Source

• Patent Number

  3,887,421

• Date Filed

  Not available

• Date Issued

  Tuesday, June 3, 1975
  49 years ago

• CPC

  • H01L23/544 - Marks applied to semiconductor devices or parts
  • B05B15/045 - Masking elements
  • B05C17/06 - Stencils
  • H01L21/00 - Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L2223/54453 - for use prior to dicing
  • H01L2924/0002 - Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
  • Y10S438/942 - Masking
  • Y10S438/943 - Movable
  • Y10S438/975 - Substrate or mask aligning feature

• US Classifications

  • 156 - Adhesive bonding and miscellaneous chemical manufacture
  • 101 - Printing
  • 257 - Active solid-state devices
  • 427 - Coating processes
  • 438 - Semiconductor device manufacturing: process