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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00

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H01L2223/54453for use prior to dicing

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,170,253
- Issue date Dec 17, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of wafer thinning
- Patent number 12,154,783
- Issue date Nov 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guard ring design enabling in-line testing of silicon bridges for s...
- Patent number 12,142,553
- Issue date Nov 12, 2024
- Intel Corporation
- Arnab Sarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Template, manufacturing method of template, and manufacturing metho...
- Patent number 12,087,604
- Issue date Sep 10, 2024
- Kioxia Corporation
- Kazuhiro Takahata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,074,121
- Issue date Aug 27, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for annealing die and wafer
- Patent number 12,051,603
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Hao Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor devices and structures with metal layers
- Patent number 12,027,518
- Issue date Jul 2, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate electrodes with notches and methods for forming the same
- Patent number 12,009,214
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing same
- Patent number 11,984,406
- Issue date May 14, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yunsheng Xia
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
3D semiconductor devices and structures with metal layers
- Patent number 11,984,445
- Issue date May 14, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for fabricating semiconductor structure having alignment mar...
- Patent number 11,901,305
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Co. Ltd.
- Kuo-Hung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,887,935
- Issue date Jan 30, 2024
- Renesas Electronics Corporation
- Takehiro Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secure inspection and marking of semiconductor wafers for trusted m...
- Patent number 11,804,411
- Issue date Oct 31, 2023
- International Business Machines Corporation
- Effendi Leobandung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 11,749,756
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Che-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recognition method for photolithography process and semiconductor d...
- Patent number 11,682,557
- Issue date Jun 20, 2023
- Winbond Electronics Corp.
- Chih-Yu Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guard ring design enabling in-line testing of silicon bridges for s...
- Patent number 11,676,889
- Issue date Jun 13, 2023
- Intel Corporation
- Arnab Sarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secure inspection and marking of semiconductor wafers for trusted m...
- Patent number 11,652,009
- Issue date May 16, 2023
- International Business Machines Corporation
- Effendi Leobandung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor devices and structures with metal layers
- Patent number 11,646,309
- Issue date May 9, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip singulation method
- Patent number 11,646,230
- Issue date May 9, 2023
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Takeshi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 11,626,372
- Issue date Apr 11, 2023
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrated circuit device and structure with hybrid bonding
- Patent number 11,605,630
- Issue date Mar 14, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor arrangement with fin features having different heights
- Patent number 11,469,144
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Tsung-Yu Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate electrodes with notches and methods for forming the same
- Patent number 11,456,176
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to form a 3D integrated circuit
- Patent number 11,374,118
- Issue date Jun 28, 2022
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and fabricating method thereof
- Patent number 11,362,039
- Issue date Jun 14, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Hung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser processing apparatus and laser processing method
- Patent number 11,348,793
- Issue date May 31, 2022
- Disco Corporation
- Yuta Yoshida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer processing method
- Patent number 11,322,403
- Issue date May 3, 2022
- Disco Corporation
- Masaru Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Workpiece processing method
- Patent number 11,289,348
- Issue date Mar 29, 2022
- Disco Corporation
- Byeongdeck Jang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Guard ring design enabling in-line testing of silicon bridges for s...
- Patent number 11,257,743
- Issue date Feb 22, 2022
- Intel Corporation
- Arnab Sarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,222,851
- Issue date Jan 11, 2022
- Fuji Electric Co., Ltd.
- Naoko Kodama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
System and Method for Bonding Semiconductor Devices
- Publication number 20240395766
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Tai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240363545
- Publication date Oct 31, 2024
- Siliconware Precision Industries Co., Ltd.
- Che-Yu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR USING A SYSTEM FOR ANNEALING A WAFER AND SYSTEM FOR ANNE...
- Publication number 20240347355
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Hao YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
- Publication number 20240304617
- Publication date Sep 12, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
- Publication number 20240222368
- Publication date Jul 4, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20240120291
- Publication date Apr 11, 2024
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
- Publication number 20240120332
- Publication date Apr 11, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER STRUCTURE
- Publication number 20240049382
- Publication date Feb 8, 2024
- Siliconware Precision Industries Co., Ltd.
- Chin-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230378361
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Che-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GUARD RING DESIGN ENABLING IN-LINE TESTING OF SILICON BRIDGES FOR S...
- Publication number 20230260884
- Publication date Aug 17, 2023
- Intel Corporation
- Arnab SARKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
- Publication number 20230223361
- Publication date Jul 13, 2023
- Intel Corporation
- Dae-Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20230139773
- Publication date May 4, 2023
- Semiconductor Manufacturing International (Beijing) Corporation
- Xinxing BAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gate Electrodes with Notches and Methods for Forming the Same
- Publication number 20220359205
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
- Publication number 20220328474
- Publication date Oct 13, 2022
- Monolithic 3D Inc.
- Zvi Or-Bach
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
TEMPLATE, MANUFACTURING METHOD OF TEMPLATE, AND MANUFACTURING METHO...
- Publication number 20220301908
- Publication date Sep 22, 2022
- KIOXIA Corporation
- Kazuhiro TAKAHATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECURE INSPECTION AND MARKING OF SEMICONDUCTOR WAFERS FOR TRUSTED M...
- Publication number 20220238395
- Publication date Jul 28, 2022
- International Business Machines Corporation
- Effendi LEOBANDUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING ELECTRONIC...
- Publication number 20220189838
- Publication date Jun 16, 2022
- Murata Manufacturing Co., Ltd.
- Ryohei OKABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GUARD RING DESIGN ENABLING IN-LINE TESTING OF SILICON BRIDGES FOR S...
- Publication number 20220130743
- Publication date Apr 28, 2022
- Intel Corporation
- Arnab SARKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMEN...
- Publication number 20220122938
- Publication date Apr 21, 2022
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR ANNEALING DIE AND WAFER
- Publication number 20210257230
- Publication date Aug 19, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Hao YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER AND METHOD OF WAFER THINNING
- Publication number 20210257208
- Publication date Aug 19, 2021
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECURE INSPECTION AND MARKING OF SEMICONDUCTOR WAFERS FOR TRUSTED M...
- Publication number 20210134682
- Publication date May 6, 2021
- International Business Machines Corporation
- Effendi LEOBANDUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D DEVICE AND DEVICES WITH BONDING
- Publication number 20210125981
- Publication date Apr 29, 2021
- MonolithIC 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
- Publication number 20210125942
- Publication date Apr 29, 2021
- Intel Corporation
- Dae-Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT DEVICE AND STRUCTURE WITH BONDING
- Publication number 20210104517
- Publication date Apr 8, 2021
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DEPTH ETCHING IN SEMICONDUCTOR ARRANGEMENT
- Publication number 20210066132
- Publication date Mar 4, 2021
- Tsung-Yu CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210050451
- Publication date Feb 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Che-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATING METHOD THEREOF
- Publication number 20210028120
- Publication date Jan 28, 2021
- Taiwan Semiconductor Manufacturing Co. Ltd.
- Kuo-Hung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT
- Publication number 20200365583
- Publication date Nov 19, 2020
- MonolithIC 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE
- Publication number 20200365463
- Publication date Nov 19, 2020
- MonolithIC 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS

for use prior to dicing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Metal-free frame design for silicon bridges for semiconductor packages

Semiconductor wafer and method of wafer thinning

Guard ring design enabling in-line testing of silicon bridges for s...

Template, manufacturing method of template, and manufacturing metho...

Metal-free frame design for silicon bridges for semiconductor packages

System and method for annealing die and wafer

3D semiconductor devices and structures with metal layers

Gate electrodes with notches and methods for forming the same

Semiconductor structure and method for manufacturing same

3D semiconductor devices and structures with metal layers

Method for fabricating semiconductor structure having alignment mar...

Semiconductor device and manufacturing method thereof

Secure inspection and marking of semiconductor wafers for trusted m...

Method for manufacturing semiconductor device

Recognition method for photolithography process and semiconductor d...

Guard ring design enabling in-line testing of silicon bridges for s...

Secure inspection and marking of semiconductor wafers for trusted m...

3D semiconductor devices and structures with metal layers

Chip singulation method

Metal-free frame design for silicon bridges for semiconductor packages

3D integrated circuit device and structure with hybrid bonding

Semiconductor arrangement with fin features having different heights

Gate electrodes with notches and methods for forming the same

Method to form a 3D integrated circuit

Semiconductor structure and fabricating method thereof

Laser processing apparatus and laser processing method

Wafer processing method

Workpiece processing method

Guard ring design enabling in-line testing of silicon bridges for s...

Method of manufacturing semiconductor device

Patents Applicationslast 30 patents

System and Method for Bonding Semiconductor Devices

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD FOR USING A SYSTEM FOR ANNEALING A WAFER AND SYSTEM FOR ANNE...

3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS

3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS

CARRIER STRUCTURE

SEMICONDUCTOR DEVICE

GUARD RING DESIGN ENABLING IN-LINE TESTING OF SILICON BRIDGES FOR S...

METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

Gate Electrodes with Notches and Methods for Forming the Same

3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS

TEMPLATE, MANUFACTURING METHOD OF TEMPLATE, AND MANUFACTURING METHO...

SECURE INSPECTION AND MARKING OF SEMICONDUCTOR WAFERS FOR TRUSTED M...

ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING ELECTRONIC...

GUARD RING DESIGN ENABLING IN-LINE TESTING OF SILICON BRIDGES FOR S...

PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMEN...

SYSTEM AND METHOD FOR ANNEALING DIE AND WAFER

SEMICONDUCTOR WAFER AND METHOD OF WAFER THINNING

SECURE INSPECTION AND MARKING OF SEMICONDUCTOR WAFERS FOR TRUSTED M...

3D DEVICE AND DEVICES WITH BONDING

METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES

3D INTEGRATED CIRCUIT DEVICE AND STRUCTURE WITH BONDING

MULTI-DEPTH ETCHING IN SEMICONDUCTOR ARRANGEMENT

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND FABRICATING METHOD THEREOF

3D INTEGRATED CIRCUIT

3D SEMICONDUCTOR DEVICE AND STRUCTURE