3929528

Information

• Patent Grant
• 3929528

• References
• Source

• Patent Number

  3,929,528

• Date Filed

  Not available

• Date Issued

  Tuesday, December 30, 1975
  49 years ago

• CPC

  • H01L24/80 - Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
  • H01L21/00 - Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L29/00 - Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier
  • H01L2924/01005 - Boron [B]
  • H01L2924/01012 - Magnesium [Mg]
  • H01L2924/01013 - Aluminum [Al]
  • H01L2924/01014 - Silicon [Si]
  • H01L2924/01019 - Potassium [K]
  • H01L2924/01023 - Vanadium [V]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/01072 - Hafnium [Hf]
  • H01L2924/1305 - Bipolar Junction Transistor [BJT]
  • H01L2924/13062 - Junction field-effect transistor [JFET]
  • H01L2924/14 - Integrated circuits
  • H01L2924/19041 - being a capacitor
  • H01L2924/30105 - Capacitance
  • Y10S148/007 - Autodoping
  • Y10S148/05 - Etch and refill
  • Y10S148/051 - Etching
  • Y10S148/085 - Isolated-integrated
  • Y10S438/928 - Front and rear surface processing
  • Y10S438/973 - Substrate orientation
  • Y10S438/977 - Thinning or removal of substrate

• US Classifications

  • 438 - Semiconductor device manufacturing: process
  • 148 - Metal treatment
  • 257 - Active solid-state devices