Claims
- 1. An abrasive slurry for a chemical-mechanical polishing of a precious-metal surface, comprising:
a suspension medium selected from the group consisting of an organic suspension medium and an aqueous suspension medium; abrasive particles suspended in said suspension medium; and an oxidizing agent and a complex-forming agent added to said suspension medium, said complex-forming agent shifting an equilibrium between a precious metal in elemental form and ions of the precious metal in solution toward a formation of the ions of the precious metal.
- 2. The abrasive slurry according to claim 1, wherein said oxidizing agent includes at least one element selected from the group consisting of oxygen, ozone, hydrogen peroxide, peroxodisulfate, hypochlorite, chlorate, perchlorate, bromate, iodate, permanganate, chromate, an iron(III)-compound, nitrohydrochloric acid and chromosulfuric acid.
- 3. The abrasive slurry according to claim 1, wherein said complex-forming agent includes at least one element selected from the group consisting of ethylenediaminetetraacetic acid (EDTA), a crown ether, nitrogen-containing macrocycles, citric acid, chloride, bromide and cyanide.
- 4. The abrasive slurry according to claim 1, including a surfactant.
- 5. A chemical-mechanical polishing method, the method which comprises:
reducing an oxidation potential of a precious metal in an abrasive slurry by shifting an equilibrium between the precious metal in an elemental form and in at least one of an ionogenic form and a complexed form; and polishing a surface of the precious metal with the abrasive slurry.
Priority Claims (1)
Number |
Date |
Country |
Kind |
199 27 286.7 |
Jun 1999 |
DE |
|
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a continuation of copending International Application No. PCT/DE00/01911, filed Jun. 14, 2000, which designated the United States.
Continuations (1)
|
Number |
Date |
Country |
Parent |
PCT/DE00/01911 |
Jun 2000 |
US |
Child |
10023136 |
Dec 2001 |
US |